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4 November 2016
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Addition Cure Electronic Potting Compound Silicone Rubber

Description of Addition Cure Electronic Potting Compound Silicone Rubber

Addition Cure Electronic Potting Compound Silicone Rubber is a kind of two components(1:1 mixing ratio) addition cure silicone with the characteristics of heat-conducting, low viscosity, inherent flame resistance, waterproofing, etc. It can cure both at room temperature and heated temperature. And the curing time can be accelerated by higher temperature.

 

Application of Addition Cure Electronic Potting Compound Silicone Rubber

  1. Applying for the surface of PC(Poly-carbonate), PP, ABS, PVC, Metal, etc
  2. High powered electronic encapsulation and DC/DC module and circuit board which requires heat dissipation and high temperature resistance
  3. Insulation, waterproof and bonding of electronic parts
  4. Filling for LED, LCD electronic display, circuit board
  5. Outdoor protection for LED screen

 

Datasheet of Addition Cure Electronic Potting Compound Silicone Rubber

Product Model HY-9025 HY-9035 HY-9045
Properties Index Part A Part B Part A Part B Part A Part B
Appearance Gray Liquid White Fluid Gray Fluid White Fluid Gray Fluid White Fluid
Before Curing Mixed Viscosity(mPa∙s) 2000~3000 2000 3000
Features When Operation Mix Ratio(A:B) 1:1 1:1 1:1
Operating Time(25℃/mins) 60~120 60~120 60~120
Curing Time(hrs, 25℃) 6-8 6-8 6-8
Hardness(shore A) 25±3 35±3 45±3
 

 

After Curing

Linear Expansibility[m/(m∙k)] ≤2.2×10-4 ≤2.2×10-4 ≤2.2×10-4
Thermal Conductivity[W(m∙k)] ≥0.8 ≥0.8 ≥0.8
Dielectric Permittivity(1.2MHz) 3.0~3.3 3.0~3.3 3.0~3.3
Volume Resistivity(Ω∙cm) ≥1.0×1015 ≥1.0×1015 ≥1.0×1015
Fire Resistance UL94-V0 UL94-V0 UL94-V0

Note: Above technical datasheet doesn’t include all of our products, and it’s not the

fixed data, they can be adjustable according to customer’s requirement.

 

Product Model HY-9310 HY-9320 HY-9325
Appearance Transparent Transparent Transparent
Before Curing Mixed Viscosity(mPa∙s) 500 500 500
        Features When Operation Mix Ratio(A:B) 1:1 1:1 1:1
Operating Time(25℃/mins) 60~120 60~120 60~120
Curing Time(hrs, 25℃) 6-8 6-8 6-8
Hardness(shore A) 10±3 20±3 25±3
 After Curing Linear Expansibility[m/(m∙k)] ≤2.2×10-4 ≤2.2×10-4 ≤2.2×10-4
Thermal Conductivity[W(m∙k)] ≥0.2 ≥0.2 ≥0.2
Dielectric Permittivity(1.2MHz) 3.0~3.3 3.0~3.3 3.0~3.3
Volume Resistivity(Ω∙cm) ≥1.0×1015 ≥1.0×1015 ≥1.0×1015
Fire Resistance UL94-V0 UL94-V0 UL94-V0

Note: Above technical datasheet doesn’t include all of our products, and it’s not the fixed data,

they can be adjustable according to customer’s requirement.

 

Notes and Operation Instruction of Addition Cure Electronic Potting Compound Silicone Rubber

  • The following material may hinder the curing of electronic potting silicone, so please use after the test. When necessary, please clean the application areas.       -Organotin compound or condensation silicone with organotin

-Sulphur, sulfide and sulfur rubber materials.

-Amine compounds as well as containc the amine materials.

-Pewters solder flux

  • Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes. Then the mixture could be used for pouring.
  • Please note that the thickness of the silicone affects the curing time. If the silicone used is a little thick, then the curing time will be a little longer. The temperature also affects the curing time. When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization.
  • Above electronic potting silicone should be sealed storage. The mixture should be used up to avoid causing waste.
  • Above silicone belongs to non-dangerous goods, but keep away from mouth and eyes.
  • When it gets stratified after a period of storage, please mix it evenly before using, which does not affect the performance.

 

Package of Addition Cure Electronic Potting Compound Silicone Rubber

Available package is 5kg, 20kg containers.

 

Shelf Life of Addition Cure Electronic Potting Compound Silicone Rubber

2 years from date of shipment when stored at 24℃ in original unopened packages.

 

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