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6 April 2015
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Addition Cure Silicone Encapsulant and Potting Compounds for Thermal Conductivity

Addition Cure silicone Encapsulant and Potting Compounds for Thermal Conductivity  Features & Applications

Addition cure encapsulant and potting compound for thermal conductivity HY-9055# is a two-component silicone rubber with low viscosity, which can be cured both at room temperature and high temperature.

Addition cure encapsulant and potting compound for thermal conductivity HY-9055# works on the surface of material as PC(Poly-carbonate), PP, ABS, PVC as to its superior bonding feature, and it is also applicable for insulation, waterproof, bonding of electronics parts.

Addition cure encapsulant and potting compound for thermal conductivity  meets the requirements of European RoHs.

 

 

 

Addition Cure silicone Encapsulant and Potting Compounds for Thermal Conductivity Typical Application
– High-power electronic component.

– Power module and printed circuit board request thermal conductivity and high temperature.

 

Addition Cure silicone Encapsulant and Potting Compounds for Thermal Conductivity  Technical Parameters

Properties index Part A Part B
Before Curing Appearence Dark Grey fluid White fluid
Viscosity (cps) 2500+/-500 2500+/-500
Features when operation Mixing Ratio ( By weight) 1:1
Viscosity after Curing(cps) 2000~3000
Operating Time (hr) 2
Curing time ( hr, room temperature) 8
Curing time ( min, 80C) 20
Hardness(shore A) 55+/-5
After Curing Thermal Conductivity[W( m·K)] ≥0.8
Dielectric Strength( kV/mm) ≥25
Dielectric permittivity(1.2MHz) 3.0~3.3
Volume resistivity(Ω·cm) ≥1.0×1016
Linear Dilatation[m/( m·K)] ≤2.2×10-4
Fire Resistance 94-V1

 

(Pls note all datas of Addition Cure Encapsulant and Potting Compounds for Thermal Conductivity above is in 25C with 55% humidity conditions. We don’t guarantee a same date if testing under different conditions, or when data was regenerated).

 

Addition Cure silicone Encapsulant and Potting Compounds for Thermal Conductivity Warm Tips
1. Sealing pakage for storage. The mixture should be used up at once to avoid wasting.
2. Silicone belongs to non-dangerous goods, but keep away form mouth and eyes.
3. When it gets stratified after a period of storage, Please mix HY-9055# evenly before using,
it does not affect the performance.

4. HY-9055# won’t be cured when mixed with some chemical material, so pls avoid contacting the following chemical materials

A. Organice tin compounds and silicone rubber with organotin

B. Materials with sulfur, sulfide

C. Materials with amine

 

Addition Cure silicone Encapsulant and Potting Compounds for Thermal Conductivity Package
10kg/set (Part A 5kg + Part B 5kg)

40kg/set  (Part A 20kg + Part B 20kg)

 

Addition Cure silicone Encapsulant and Potting Compounds for Thermal Conductivity  Shelf Life and Transportation
1. Twelve(12) months when stored at 25C in original unopened packages.
2. This is a non-dangerous product, it can be transported as general chemicals.
3. Products exceed the storage life should be confirmed normal before using.

 

If there is any more questions about Addition Cure silicone Encapsulant and Potting Compounds for Thermal Conductivity ,

Further information, please feel free to contact Alice

Email:info@sellsilicon.comSilicone jenova grc

F: 86-755-89948030

3w(dot)sellsilicon(dot)com

 

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