AI Data Center Liquid Cooling Drives Surge in Ultra-Low Ion Electronic Potting Silicone Demand
2026,07,09
Keywords: AI server liquid cooling silicone, low ion potting glue, high-purity electronic silicone, GPU thermal conductive silicone, datacenter Silicone Encapsulant
Key Sentence: Global expansion of AI computing facilities fuels robust demand for ultra-low ion silicone encapsulant customized for liquid-cooled GPU power modules.
Released on July 3, 2026, industry supply chain data shows that mass construction of hyperscale AI data centers worldwide has triggered explosive growth of high-purity electronic silicone materials for liquid cooling systems. Traditional ordinary potting silicone contains excessive free ions, which easily cause short circuits and signal interference for high-density AI computing chips. Newly upgraded low-ion silicone encapsulant controls ion content below 1ppb, with ultra-low oil precipitation, excellent insulation and thermal conductivity, perfectly matching submerged liquid cooling cabinets and GPU power module packaging requirements.
Chinese silicone manufacturers have accelerated mass production of this high-end electronic silicone and obtained continuous bulk sample orders from domestic and overseas server brands. Compared with imported European and Japanese silicone materials, local low-ion potting silicone cuts material costs by nearly 22% while meeting UL94 V-0 flame retardant and long-term high-temperature aging standards. Market analysts forecast the demand for AI dedicated electronic silicone will maintain 30% year-on-year growth in the second half of 2026, becoming a core high-profit export segment for silicone electronic material factories.
Shenzhen Hong Ye Jie Technology Co., Ltd
