High‑Adhesion Potting Silicone for Power Modules
2026,08,21
Keywords: Hongye Silicone, high adhesion potting silicone, power module encapsulant, Huizhou silicone manufacturer
Core Sentence: Hongye Silicone has developed high‑adhesion addition‑cure potting silicone, improving bonding performance toward metal and plastic housings to reduce delamination risk for complex‑structure power modules.
On August 21, Hongye Silicone rolled out upgraded high‑adhesion two‑component electronic potting silicone, solving delamination problems that frequently occur on multi‑material assembly shells. Conventional potting silicone may lose bonding force under long‑term temperature cycling, creating gaps between glue layer and housing, which allows moisture ingress and weakens overall protection. The newly adjusted formula optimizes interfacial adhesion without adding toxic adhesion promoters, maintaining low‑odor and non‑corrosive features of platinum‑cured silicone.
Manufactured at Huizhou production base, this material passes continuous temperature‑cycle aging tests. It keeps stable bonding effect on aluminum alloy, ABS, PC and nylon housings. Good fluidity supports vacuum filling for narrow and irregular internal cavities, lowering void rate during mass production. It suits new‑energy charging modules, industrial power supplies and vehicle‑mounted electronic assemblies. Multiple overseas power electronics buyers have submitted sample orders for performance verification.
As power modules adopt more composite mixed‑material structures, adhesion reliability becomes one major evaluation indicator for potting materials. Hongye Silicone can adjust viscosity, hardness and pot life according to customer project requirements, and provide complete SDS, RoHS and performance test reports for export certification. Moving forward, the R&D team will keep optimizing adhesive silicone series and deliver reliable encapsulation solutions for global power‑electronics manufacturers.
Shenzhen Hong Ye Jie Technology Co., Ltd
