High‑Adhesion Potting Silicone Updated

August 26, 2026 — Many power‑electronics manufacturers face delamination risks between Potting Compound and housing substrates after long‑term temperature cycling. Ordinary potting silicone may lose bonding force when exposed to alternating hot‑cold working conditions, bringing hidden troubles to power supply and inverter products.

Hongye Silicone adjusts formula components to improve interface bonding performance toward aluminum, ABS and PC materials. The upgraded silicone retains good fluidity for automatic dispensing and vacuum filling processes. Every batch undergoes thermal‑cycle aging test inside Huizhou laboratory before shipment. It keeps stable insulation, moisture‑proof and shock‑absorbing performance after complete curing.

This material suits new‑energy power modules, industrial power supplies and outdoor control units. Global purchasers can apply for free lab samples to run bonding verification with their own housings. Hongye Silicone provides complete TDS, MSDS and RoHS test reports for customs clearance. Technical engineers offer remote guidance for mixing ratio and curing condition setting for overseas production lines.