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Home> Company News> Thermal‑Conductive Potting Silicone Updated

Thermal‑Conductive Potting Silicone Updated

2026,09,07
Keywords: Hongye Silicone, thermal‑conductive potting silicone, electronics encapsulation
 
electronic silicone
Key Sentence: Hongye Silicone optimizes thermal‑conductive potting silicone formula to deliver stable heat dissipation for power‑intensive electronic modules.

Sep 7, 2026 — Hongye Silicone has completed formula iteration for its thermal‑conductive potting silicone, targeting growing global demand for new‑energy and power‑supply encapsulation projects. Many electronic manufacturers face heat accumulation risks inside compact power modules, which may shorten component service life under long‑term high‑load operation. The upgraded silicone balances thermal conductivity, fluidity and electrical insulation performance, supporting vacuum potting and automatic dispensing production lines.

Produced in Huizhou standardized workshop, each batch goes through thermal conductivity test, volume resistivity test and high‑low temperature cycle aging test before shipment. It maintains stable performance under wide temperature range, reduces internal heat accumulation and protects PCBA, power supply units and automotive electronic assemblies. The material supports custom thermal conductivity grades, hardness and color for different project requirements. More overseas industrial clients submit sample requests for verification before formal bulk purchase, as thermal management becomes a core material selection index for modern electronic equipment.

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