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Home> Products> Electronic Potting Compound> Electronic Potting Silicone for Motor Drive Systems
Electronic Potting Silicone for Motor Drive Systems
Electronic Potting Silicone for Motor Drive Systems
Electronic Potting Silicone for Motor Drive Systems
Electronic Potting Silicone for Motor Drive Systems
Electronic Potting Silicone for Motor Drive Systems
Electronic Potting Silicone for Motor Drive Systems

Electronic Potting Silicone for Motor Drive Systems

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9045

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
HONG YE SILICONE HY-9045 is a flame-retardant Addition Curing Silicone engineered for motor drive systems, a core Silicone Encapsulant in industrial electronics. This two-component liquid silicone features a 1:1 mixing ratio, low shrinkage, and exceptional insulation (≥25 kV/m) with a volume resistance of ≥1×10¹⁵ Ω. It cures at room or 80℃ temperature, offers high elasticity across wide temperatures, and resists moisture, chemicals, and aging. Ideal for motor drive PCBs and power modules, it ensures fire safety and stable operation, meeting the rigorous demands of global motor manufacturers.
 
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Product Overview

Our Electronic Potting Silicone (Model HY-9045) is a specialized Silicone Potting Compound designed exclusively for motor drive systems—critical components requiring fire resistance, thermal stability, and robust insulation. As a leading manufacturer of RTV 2 Silicone Rubber for industrial applications, we optimized this platinum-cured formula to address the unique challenges of motor drives: high heat, vibration, and fire risk. Unlike standard Epoxy Potting Resin, it cures without exotherm, avoids corrosion, and retains elasticity, absorbing mechanical stress to protect delicate drive electronics long-term.

Technical Specifications

HY-9045 is a two-component Addition curing silicone with a 1:1 weight mixing ratio. Part A and Part B are homogeneous liquids with a viscosity of 2500±500 Pa.s. At 25℃, it offers an operable time of 30–60 minutes; heating to 80℃ reduces full curing time to 4–5 hours. Cured hardness measures Shore A 45±5. Electrical performance includes a dielectric strength of ≥25 kV/m, dielectric constant of 3.0 (1.2MHz), and volume resistance of ≥1×10¹⁵ Ω. All parameters—hardness, viscosity, and operation time—are fully customizable for specific motor drive designs.

Product Features & Advantages

  • Flame-Retardant Safety: Forms a non-combustible protective layer, mitigating fire hazards in motor drive systems and complying with strict industrial safety standards.
  • Stress-Free Curing: Cures without exotherm, low shrinkage, and no corrosion, preventing damage to sensitive PCBs and semiconductor components in motor drives.
  • Superior Insulation: High dielectric strength and volume resistance block electrical leakage, ensuring safe operation even in high-voltage motor drive environments.
  • Elasticity & Vibration Resistance: Retains flexibility across temperature extremes, absorbing vibration from motor operation to protect solder joints and gold wires.
  • Harsh Environment Resilience: Waterproof, moistureproof, mildew-proof, and weather-resistant, withstanding oil, chemicals, and UV aging for outdoor or industrial motor use.
  • Dual Curing Flexibility: Room-temperature curing for small batches or 80℃ accelerated curing for mass production, optimizing manufacturing efficiency.

How to Use (Step-by-Step)

  1. Pre-Mix Preparation: Thoroughly stir Part A and Part B separately in their original containers to ensure uniform consistency (settling is normal and does not affect performance).
  2. Component Mixing: Combine Part A and Part B at a 1:1 weight ratio, stirring continuously for 2–3 minutes until a homogeneous mixture is achieved.
  3. Vacuum Defoaming: Transfer the mixture to a vacuum chamber, degas at 0.08MPa for 3 minutes to remove air bubbles, ensuring bubble-free encapsulation.
  4. Curing Process: Pour the mixture into pre-cleaned motor drive components. Cure at room temperature for full固化 or heat to 80℃ for 4–5 hours to accelerate curing (winter low temperatures may require heating to optimize results).

Application Scenarios

This Electronic Potting Silicone is tailored for motor drive systems, including industrial motor control PCBs, power modules, frequency converter drives, and servo motor control units. It provides comprehensive encapsulation, sealing, and fire protection, ensuring stable performance in heavy-duty motors, automotive motors, and wind energy motors. For purchasers, this translates to reduced motor drive failures, lower maintenance costs, and compliance with global fire safety regulations—strengthening product reliability in competitive markets.

Customization Options

We offer tailored solutions for motor drive systems: adjust hardness (Shore A 20–60), viscosity (500–5000 Pa.s), and operation time (10–120 minutes) for different drive sizes; optimize flame-retardant grades for high-risk applications; and develop fast-curing formulas for automated production lines. OEM services include custom packaging (5kg, 20kg, 25kg, 200kg) and formula tuning to match specific motor drive requirements.

Certifications & Compliance

HY-9045 adheres to international industrial and electronics standards, holding ISO9001 quality certification, CE, and RoHS compliance. Its flame-retardant properties meet UL test requirements, and batch consistency is rigorously controlled through our production quality management system—ensuring it meets regulatory demands in Europe, North America, and Asia.

FAQ

Q: Can this potting silicone withstand the high heat of motor drive systems?
A: Yes. It retains elasticity and insulation performance across wide temperatures, curing without exotherm to avoid heat damage to drive components.
Q: What substances should be avoided to prevent curing failure?
A: Avoid contact with organotin compounds, sulfur/sulfides, amine compounds, uncured condensation silicone, amine-cured epoxy, and solder flux—these materials inhibit the addition curing process.
Q: Is the 1:1 mixing ratio suitable for automated dispensing systems?
A: Yes. The 1:1 ratio is compatible with most industrial dispensing equipment, and we can adjust viscosity to optimize flow for your specific production line.
Q: What is the shelf life and packaging of HY-9045?
A: It has a 1-year shelf life at 25℃ or below, packaged in 5kg, 20kg, 25kg, and 200kg containers. It is a non-dangerous good, shippable as general chemicals.
 
 
 
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