HONG YE SILICONE Silicone Potting Compound (Electronic Encapsulation Adhesive) is a high-grade liquid silicone material with integrated waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. It cures into a solid protective layer after mixing with a curing agent, boasting excellent adhesion to PC, PMMA, PCB and CPU, and stable performance from -60℃ to 220℃. Available in addition and condensation curing types, it’s a core product matching our RTV 2 Silicone Rubber , Pad Printing Silicone, Food grade mold silicone and Liquid Silicone, providing reliable protection for electronic components across global industries.
Product Overview
Our Electronic Potting Compound is a professional silicone-based encapsulation material for electronic components, also known as electronic glue or Silicone Encapsulant . Mixed with a curing agent, the liquid colloid solidifies to form a tight protective layer, realizing comprehensive sealing, filling and pressure-proof protection for components. It features outstanding adhesion and thermal stability to PC, PMMA, PCB and CPU, and is divided into Addition Curing Silicone and condensation curing types to adapt to different industrial application needs, as a key part of HONG YE JIE’s full silicone product matrix including Industrial mold silicone rubber.
Product Features & Advantages
1. All-round protection: Delivers excellent anti-corrosion, waterproof, moisture-proof, dust-proof, temperature resistance, insulation, thermal conduction and shockproof effects, fully shielding electronic components from harsh environmental damage.
2. Strong environmental adaptability: With ozone and chemical erosion resistance, it can work stably in complex industrial environments for a long time.
3. Extreme temperature resistance: Operates continuously from -60℃ to 220℃, absorbing thermal stress caused by high-temperature cycles to protect chips and welded gold wires from damage.
4. High-quality material properties: Low volatile content, high structural strength, and excellent bonding performance with aluminum, copper, stainless steel and other common metals in electronics manufacturing.
Technical Specifications
Curing type: Addition curing silicone / Condensation curing silicone
Operating temperature range: -60℃ ~ 220℃
Core performance: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing condition: Room temperature / heating curing, full curing time 24h
Environmental adaptability: Ozone resistant, chemical erosion resistant
How to Use
1. Preparations: Fully stir Component A to mix settled fillers evenly, and shake Component B thoroughly to ensure uniform material.
2. Mixing: Blend Component A and B strictly according to the specified weight ratio to guarantee curing effect.
3. Deaeration (optional): Put the uniformly mixed adhesive into a vacuum container, deaerate for 3 minutes under 0.01MPa, and then it can be used for potting.
4. Potting & Curing: Pour the treated adhesive on the target electronic components; place it at room temperature or heat for curing, conduct the next process after basic curing, and the material will realize full curing in 24h (temperature and humidity affect curing speed).
Application Scenarios
This product is widely used for encapsulation, sealing and filling of various electronic components, especially suitable for LED display modules, CPU peripheral components, power supply units, electronic control boards and communication equipment. It effectively improves the structural stability and environmental adaptability of electronic products, reduces the failure rate of components in transportation and use, and helps manufacturers improve product quality and reduce after-sales maintenance costs.
Certifications and Compliance
HONG YE JIE has passed ISO9001 quality management system certification, and our silicone products including Electronic Potting Compound comply with CE and UL international standards. All products are manufactured in accordance with global electronic material industry specifications, ensuring the safety and reliability of application in international electronic manufacturing projects.
Customization Options
We provide professional OEM customization services for Electronic Potting Compound. According to the different application scenarios of customers, the hardness, viscosity and operation time of the cured product can be independently adjusted and formulated. We can also customize the product formula for special performance requirements such as high thermal conductivity and ultra-low temperature resistance to meet personalized bulk procurement needs.
Production Process
The product is manufactured through a strict multi-link production and quality control process: high-quality Silicone raw materials inspection → precise formula mixing and stirring → automated production line processing → pre-production sample curing performance testing → full inspection of finished products before shipment. Our professional QC team conducts whole-process quality monitoring, ensuring the consistency of product performance with over 20 years of silicone material manufacturing experience.
FAQ
Q1: What is the difference between addition and condensation curing potting compound?
A1: Addition curing type has faster curing speed and lower shrinkage rate, suitable for high-precision component potting; condensation curing type is cost-effective, suitable for general electronic component encapsulation.
Q2: How to store the unused Electronic Potting Compound?
A2: The A and B components should be sealed and stored separately in a cool and dry environment. The mixed adhesive must be used up at one time to avoid material waste caused by curing.
Q3: What if the colloid is layered after long-term storage?
A3: This is a normal physical phenomenon, just fully stir the colloid before use, and the product performance will not be affected.
Q4: Is the Electronic Potting Compound a hazardous material?
A4: It is a non-hazardous material, but avoid contact with mouth and eyes; if accidental contact occurs, rinse with clean water immediately, and seek medical treatment if necessary.
Q5: Do I need to deaerate when using the potting compound?
A5: Deaeration is not mandatory, but it is recommended for high-precision component potting, which can avoid air bubbles in the cured layer and ensure the sealing and protection effect.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
