HONG YE SILICONE Circuit Board Potting Silicone is a high-performance two-component silicone (available in addition and condensation curing types), designed for potting all electronic products including circuit boards, electronic ballasts, transformers, LED, LCD, CPU and electronic displays. It is liquid before curing and forms a flexible rubber with excellent impact resistance after curing, featuring no exotherm, low shrinkage, easy maintenance and wide temperature resistance (-60℃ to high temperature). As a core product matching our RTV 2 Silicone Rubber, liquid silicone, Industrial mold silicone rubber, Pad Printing Silicone and Silicone Encapsulant, it provides comprehensive protection for circuit boards, with customizable parameters to meet diverse industrial needs.
Product Overview
Our Circuit Board Potting Silicone is a professional two-component potting material engineered for circuit board and electronic component protection, a key part of HONG YE SILICONE’s full silicone product matrix. Suitable for a wide range of electronic products, this silicone is liquid in its uncured state, enabling easy pouring and infiltration into all gaps of circuit boards, and cures into a soft, shock-resistant rubber layer. Classified into addition curing and condensation curing types to adapt to different production needs, it offers excellent waterproof, moisture-proof, chemical-resistant and anti-static performance, ensuring long-term stable operation of electronic components, and is easy to peel off for maintenance, reducing after-sales costs.
Product Features & Advantages
1. Gentle curing process: Cures without exotherm or corrosion, with low shrinkage, suitable for thermal conductive sealing and pouring of electronic components, forming a reliable thermal conductive and insulating system.
2. Comprehensive protection performance: Delivers excellent waterproof, moisture-proof, chemical medium resistance, yellowing resistance, shock resistance and anti-static functions, isolating circuit boards from harsh environmental damage.
3. Easy maintenance: The cured glue layer can be easily peeled off for circuit board maintenance and repair, avoiding damage to components and reducing maintenance costs for manufacturers.
4. Superior temperature & aging resistance: Maintains elasticity in a wide temperature range, does not crystallize at -60℃, and has excellent weather resistance and anti-aging performance, extending the service life of electronic products.
5. Excellent product compatibility: Enhances light decay, sealing, service life and brightness of electronic products (especially LEDs), ensuring stable performance of circuit boards in long-term use.
Technical Specifications (HY-9055/ HY-9045)
Available in two models (HY-9055 and HY-9045), both are two-component silicone with a mixing ratio of 1:1 by weight. The addition curing models (HY-9055, HY-9045) can be cured at room temperature or by heating, with basic curing completed before entering the next process and full curing time of 24 hours (temperature and humidity affect curing speed). All parameters (hardness, viscosity, operation time, etc.) can be customized according to customer needs; specific parameters of other models are available on request.
How to Use
1. Preparation: Fully stir Component A to mix settled fillers evenly; shake Component B thoroughly to ensure uniform material composition without stratification.
2. Mixing: Blend Component A and B strictly according to the 1:1 weight ratio, stir evenly to guarantee consistent curing effect and product performance.
3. Deaeration (Optional): Place the uniformly mixed glue into a vacuum container, deaerate for 3 minutes under 0.08MPa to remove air bubbles, then ready for potting.
4. Potting & Curing: Pour the treated glue onto circuit boards or electronic components; for addition curing models (HY-9055, HY-9045), cure at room temperature or by heating. Proceed to the next process after basic curing, with full curing completed in 24 hours.
Application Scenarios
Widely used for potting of all electronic products, including circuit boards, electronic ballasts, electronic镇流器 (ballasts), electronic transformers, LED lamps, LCD screens, CPUs and electronic displays. It is an ideal potting material for electronic manufacturing, LED lighting, consumer electronics, industrial control and other industries, effectively protecting circuit boards from moisture, dust, impact and chemical corrosion, improving product stability and service life, and enhancing market competitiveness for manufacturers.
Certifications and Compliance
HONG YE SILICONE holds ISO9001 quality management system certification, CE and UL certifications. Our Circuit Board Potting Silicone complies with global electronic material standards and environmental requirements, ensuring safe and reliable application in international electronic manufacturing projects, and meeting the import quality requirements of markets worldwide.
Customization Options
We provide professional OEM customization services. According to customers’ different application scenarios and production needs, we can adjust and customize key parameters such as cured hardness, viscosity, operation time and curing speed. We also support the development of exclusive formulas for addition and condensation curing types, to meet personalized bulk procurement needs.
Production Process
The product undergoes strict quality control: high-quality Silicone raw materials inspection → precise formula mixing and stirring → automated production line processing → pre-production sample curing performance testing → full inspection of finished products before shipment. Our professional QC team monitors the whole process, backed by 20+ years of silicone manufacturing experience, ensuring consistent performance of each batch of products.
FAQ
Q1: What is the difference between addition and condensation curing types?
A1: Addition curing (e.g., HY-9055, HY-9045) cures faster, with better transparency and low shrinkage; condensation curing is cost-effective, suitable for general potting needs.
Q2: How to store unused potting silicone?
A2: Seal Component A and B separately and store in a cool, dry place. Mixed glue must be used up at one time to avoid waste.
Q3: What if the colloid stratifies after storage?
A3: Stir thoroughly before use—this is a normal physical phenomenon and will not affect product performance.
Q4: Is the product a hazardous material for transportation?
A4: Non-hazardous, can be transported as general chemicals, complying with international transportation standards.
Q5: Can the cured glue layer be removed easily for maintenance?
A5: Yes, the cured rubber layer is flexible and can be peeled off easily without damaging circuit boards or components.
Shenzhen Hong Ye Jie Technology Co., Ltd
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