HONG YE SILICONE Electronic Potting Silicone for Harsh Environments, also called Potting Compound or Silicone Encapsulant, is a high-performance two-component addition/condensation curing silicone. It integrates waterproof, moisture-proof, thermal conductivity, flame retardancy and insulation, operating stably from -60℃ to 220℃, with excellent corrosion and chemical resistance. As a core product matching our liquid silicone, RTV 2 Silicone Rubber, Industrial mold silicone rubber, Pad Printing Silicone and Silicone Potting Compound, it adheres well to PC, PCB, metals and acrylic, ideal for encapsulating electronic components in harsh environments, with fully customizable parameters for bulk procurement.
Product Overview
Our Electronic Potting Silicone for Harsh Environments is a professional encapsulation material engineered for electronic components working in extreme conditions, a key part of HONG YE SILICONE’s full silicone product matrix. Also known as electronic glue or encapsulation silicone, it cures into a stable protective layer after mixing with curing agent, providing comprehensive protection against corrosion, moisture, dust, vibration and extreme temperatures. Classified into addition and condensation curing types, it solves the pain points of electronic device failure in harsh environments, ensuring long-term stable operation of components like PCB, CPU and LED modules.
Product Features & Advantages
1. Extreme temperature resistance: Operates stably from -60℃ to 220℃, absorbs stress caused by high-temperature cycles, protects chips and welding gold wires, adapting to severe cold and high-heat harsh environments.
2. All-round harsh environment protection: Delivers excellent corrosion, waterproof, moisture-proof, dust-proof and shock-proof performance, with strong ozone and chemical erosion resistance, isolating components from harsh external damage.
3. Multi-performance integration: Integrates superior insulation, thermal conductivity and flame retardancy, effectively dissipating heat and preventing short circuits, ensuring component safety in harsh working conditions.
4. Strong adhesion & wide compatibility: Excellent adhesion to PC, PMMA (acrylic), PCB, CPU and metals (aluminum, copper, stainless steel), with high strength and low volatile content, ensuring tight bonding without peeling.
5. Flexible curing & easy operation: Available in addition curing type, supporting room-temperature or heating curing, 24 hours for full curing; easy to mix and pot, with optional vacuum defoaming for complex components.
Technical Specifications
This product is a two-component electronic potting silicone, available in addition and condensation curing types. Both Component A and B are liquid, requiring thorough stirring before mixing according to the specified weight ratio. It operates stably at -60℃ to 220℃, with excellent adhesion to various substrates. Key parameters including cured hardness, viscosity, operable time and thermal conductivity can be fully customized according to customers’ specific harsh environment application needs; detailed parameters of specific models are available on request.
How to Use
1. Preparation: Fully stir Component A to mix settled fillers evenly; shake Component B thoroughly to ensure uniform material composition without stratification, which is critical for stable performance in harsh environments.
2. Mixing: Blend Component A and B strictly according to the specified weight ratio, stir thoroughly to guarantee consistent curing and protective performance.
3. Deaeration (Optional): Place the uniformly mixed glue into a vacuum container, deaerate for 3 minutes under 0.01MPa to remove air bubbles, ensuring a dense, bubble-free encapsulation layer.
4. Potting & Curing: Pour the treated silicone onto target electronic components; cure at room temperature or by heating. Proceed to the next process after basic curing, and ensure 24 hours for full curing to achieve optimal harsh environment resistance.
Application Scenarios
Widely used for encapsulation, sealing, filling and pressure protection of electronic components working in harsh environments, including outdoor electronic devices, industrial control modules, high-temperature equipment components, marine electronics and outdoor LED modules. It is especially suitable for components like PCB, CPU, acrylic (PMMA) and electronic insulation boards, effectively extending service life, reducing failure and after-sales costs, and enhancing product competitiveness in harsh environment application scenarios.
Certifications and Compliance
HONG YE SILICONE holds ISO9001 quality management system certification, CE and UL certifications. Our Electronic Potting Silicone for Harsh Environments complies with global electronic material standards and environmental directives, meeting the quality and safety requirements of harsh environment application scenarios in international markets, ensuring smooth import and reliable application in global projects.
Customization Options
We provide professional OEM/ODM customization services. According to customers’ specific harsh environment requirements (such as extreme temperature resistance, corrosion resistance), we can customize key parameters including cured hardness, viscosity, operable time, curing speed and thermal conductivity. Exclusive formulas for special harsh environment scenarios are available to meet personalized bulk procurement needs.
Production Process
The product undergoes strict multi-link quality control: high-quality Silicone raw materials inspection → precise formula mixing (ensuring harsh environment resistance) → automated production and filling → pre-production sample performance testing (high/low temperature, corrosion resistance) → full inspection of finished products before shipment. Our professional QC team monitors the whole process, backed by 20+ years of silicone manufacturing experience, ensuring consistent performance of each batch in harsh environments. FAQ
Q1: What is the difference between addition and condensation curing types? A1: Addition curing has faster curing speed and better transparency; condensation curing is cost-effective, both suitable for harsh environment applications, selectable based on needs.
Q2: How to store unused potting silicone? A2: Seal and store Component A and B separately in a cool, dry place; mixed glue should be used up at one time to avoid waste; stratified colloid can be stirred evenly before use, no impact on performance.
Q3: Is the product a hazardous material for transportation? A3: Non-hazardous, can be transported as general chemicals, complying with international transportation standards.
Q4: What should I do if it accidentally gets into mouth or eyes? A4: Rinse immediately with clean water; if necessary, seek medical advice; it is non-toxic and non-irritating.
Q5: Can it be customized for more extreme temperature resistance? A5: Yes, we can adjust the formula to enhance high/low temperature resistance, adapting to more severe harsh environment application needs.
Shenzhen Hong Ye Jie Technology Co., Ltd
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