HONG YE SILICONE Flexible Cure Electronic Potting Compound is a high-performance two-component addition curing material, specialized in flexible curing to adapt to diverse production needs. It is liquid before curing, integrates waterproof, moisture-proof, thermal conductivity, flame retardancy and insulation, operates stably from -60℃ to 220℃, with adjustable curing speed (room-temperature or heating). As a core product matching our liquid silicone , RTV 2 Silicone Rubber, Industrial mold silicone rubber, Pad Printing Silicone and Silicone Encapsulant, it adheres well to PC, PCB, metals and acrylic, features flexible curing and easy operation, fully complying with international standards, with customizable parameters for bulk electronic component production.
Product Overview
Our Flexible Cure Electronic Potting Compound is a professional potting material engineered for flexible curing demands, a key part of HONG YE SILICONE’s full silicone product matrix. Also called potting glue, electronic glue or encapsulation silicone, it is an Addition Curing Silicone that cures into a flexible, high-strength protective layer after mixing with curing agent. Different from ordinary Electronic Potting Compound with fixed curing mode, it features adjustable flexible curing—supports both room-temperature and heating curing, adapts to different production rhythms, solving the pain points of rigid curing that limits production efficiency or component compatibility. Product Features & Advantages
1. Flexible curing design (core advantage): Supports dual curing modes—room-temperature curing (full curing 24 hours) or heating accelerated curing, with adjustable curing speed to match manual operation or automated production lines, greatly improving production efficiency.
2. Extreme temperature adaptability: Operates stably from -60℃ to 220℃, absorbs stress caused by high-temperature cycles, protects chips and welding gold wires, maintains flexible performance even in extreme temperatures, avoiding component damage from thermal expansion and contraction.
3. All-round protection performance: Integrates waterproof, moisture-proof, dust-proof, insulation, thermal conductivity, shockproof and anti-corrosion properties, forming a flexible protective barrier to isolate components from external damage.
4. High strength & strong adhesion: Low volatile content, high curing strength, excellent adhesion to PC, PMMA (acrylic), PCB, CPU and metals (aluminum, copper, stainless steel), no peeling or cracking after long-term use.
5. Easy operation & high compatibility: Low viscosity with good fluidity, optional vacuum defoaming (0.01MPa for 3 minutes) to fill complex components; compatible with most electronic substrates, no corrosion to fragile components.
6. Customizable curing parameters: Curing speed, operable time and cured hardness can be adjusted according to production needs, adapting to diverse electronic component potting requirements.
Technical Specifications
This product is a two-component flexible cure electronic potting compound, belonging to addition curing silicone. Both Component A and B are liquid, requiring thorough stirring before mixing according to the specified weight ratio. It operates stably at -60℃ to 220℃, with excellent adhesion and thermal conductivity. Key flexible curing parameters: room-temperature full curing time 24 hours, heating curing can accelerate the process; operable time, viscosity and cured hardness are fully customizable according to customers’ specific production and component needs.
How to Use
1. Preparation: Fully stir Component A to mix settled fillers evenly; shake Component B thoroughly to ensure uniform material composition without stratification, critical for flexible curing stability.
2. Mixing: Blend Component A and B strictly according to the specified weight ratio, stir thoroughly to guarantee consistent flexible curing performance and all-round protection.
3. Deaeration (Optional): Place the uniformly mixed glue into a vacuum container, deaerate for 3 minutes under 0.01MPa to remove air bubbles, ensuring a dense, flexible protective layer.
4. Potting & Flexible Curing: Pour the treated silicone onto target components; choose room-temperature curing (for small-batch or manual operation) or heating curing (for mass production) to achieve full curing and optimal flexible protection.
Application Scenarios
Widely used for encapsulation, sealing, filling and pressure protection of electronic components, including PCB, CPU, LED modules, outdoor LED displays, power modules and general electrical modules. It is suitable for electronic manufacturing, LED lighting, automotive electronics, industrial control and consumer electronics industries, adapting to diverse production rhythms with flexible curing, reducing production costs, protecting components from damage, and enhancing product service life and market competitiveness.
Certifications and Compliance
HONG YE SILICONE holds ISO9001 quality management system certification, CE and UL certifications. Our Flexible Cure Electronic Potting Compound fully complies with EU ROHS environmental directives and international electronic material standards, meeting the quality and flexible production requirements of global markets, ensuring smooth import and reliable application in international projects.
Customization Options
We provide professional OEM customization services focused on flexible curing. According to customers’ production rhythms and component types, we can customize key parameters such as curing speed (room-temperature/heating), operable time, viscosity and cured hardness. We also support formula optimization for better flexibility or specific protection needs, meeting personalized bulk procurement needs.
Production Process
The product undergoes strict multi-link quality control: high-quality Silicone raw materials inspection → precise formula mixing (optimized for flexible curing) → automated production and filling → pre-production sample curing testing (verifying flexible performance) → full inspection of finished products before shipment. Our professional QC team monitors the whole process, backed by 20+ years of silicone manufacturing experience, ensuring consistent flexible curing performance of each batch. FAQ
Q1: How to choose between room-temperature and heating curing?
A1: Choose room-temperature for small-batch/manual operation; heating curing accelerates the process, suitable for mass production to improve efficiency.
Q2: Can curing speed be further adjusted?
A2: Yes, we can customize the formula to adjust curing speed, fully matching your production rhythm and flexible production needs.
Q3: How to store unused potting compound?
A3: Seal and store Component A and B separately in a cool, dry place; mixed glue should be used up at one time; stratified colloid can be stirred evenly before use, no impact on performance.
Q4: Is it suitable for fragile electronic components?
A4: Yes, it cures flexibly without exotherm or corrosion, avoiding damage to fragile components while providing firm protection.
Q5: Is it a hazardous material for transportation?
A5: Non-hazardous, can be transported as general chemicals, complying with international transportation standards.
Shenzhen Hong Ye Jie Technology Co., Ltd
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