HONG YE SILICONE Flame Retardant Electronic Potting Compound (Model HY-9045) is a high-performance two-component Addition Curing Silicone, specially engineered for flame-retardant protection of electronic components. Mixed at 1:1 weight ratio, it cures without exotherm or corrosion, featuring excellent flame retardancy, insulation and waterproof performance. As a core product matching our liquid silicone , RTV 2 Silicone Rubber, Industrial mold silicone rubber, Pad Printing Silicone and Silicone Encapsulant, it operates stably in wide temperature ranges, adheres well to various substrates, meets international safety standards, with 1-year shelf life, customizable parameters and multiple packaging options for bulk electronic production.
Product Overview
Our Flame Retardant Electronic Potting Compound is a professional fire-safe potting material for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix. Model HY-9045 is an addition curing flame-retardant silicone, which is a new type of flame-retardant material. It is liquid before mixing, cures into a stable, low-shrinkage protective layer after blending Component A and B at 1:1 weight ratio. Different from ordinary Electronic Potting Compound, it focuses on fire safety, forming a reliable flame-retardant system while providing full-range protection, solving the pain points of electronic component fire risks in high-temperature or high-voltage scenarios. Product Features & Advantages
1. Superior flame retardancy (core advantage): Integrates excellent flame-retardant performance, forming a flame-retardant system to prevent fire spread, paired with high insulation (volume resistance ≥1×10¹⁵ Ω, dielectric strength ≥25 kv/m⁻¹), ensuring safe operation of electronic components in high-risk scenarios.
2. Gentle & flexible curing: Cures without exotherm, no corrosion to electronic components, low shrinkage; supports both room-temperature and heating curing (80℃ for 4-5 hours), adaptable to manual operation and automated production lines, even accelerable in low winter temperatures.
3. All-round protection & stability: Combines waterproof, moisture-proof, mold-proof and dust-proof properties, with excellent chemical medium resistance, yellowing resistance and weather aging resistance, maintaining stable performance in diverse environments.
4. Easy operation & high compatibility: 1:1 weight mixing ratio (easy to measure), Component A and B are both liquid; after mixing, deaeration at 0.08MPa for 3 minutes ensures bubble-free potting, compatible with various electronic substrates.
5. Customizable & cost-saving: Key parameters (hardness, viscosity, operable time) can be adjusted according to needs; mixed glue should be used at one time to avoid waste, reducing procurement and production costs for manufacturers.
Technical Specifications (Model HY-9045)
This product is an addition curing flame-retardant electronic potting compound, with Component A and B both being liquid. The mixing ratio is 1:1 by weight, Component A has a viscosity of 2500±500 Pa.s. At 25℃, the operable time is 30-60 minutes; at 80℃, the curing time is 4-5 hours. After curing, it reaches Shore A hardness 45±5, dielectric strength ≥25 kv/m⁻¹, dielectric constant 3.0 (1.2MHz), volume resistance ≥1×10¹⁵ Ω. These parameters are for HY-9045; other models and customizable parameters (hardness, viscosity, operable time) are available on request.
How to Use
1. Preparation: Fully stir Component A and B separately in their respective containers to ensure uniform material composition without stratification, which is critical for stable flame-retardant and curing performance.
2. Mixing: Blend Component A and B strictly according to 1:1 weight ratio, stir thoroughly to guarantee consistent flame retardancy and insulation performance of the cured layer.
3. Deaeration: After mixing evenly, place the glue into a vacuum container and deaerate for 3 minutes under 0.08MPa to remove air bubbles, ensuring a dense, bubble-free potting layer.
4. Potting & Curing: Pour the treated silicone onto target electronic components; choose room-temperature curing or heating curing (80℃ for 4-5 hours). In low winter temperatures, proper heating can be used to accelerate vulcanization for efficient production.
Application Scenarios
Widely used for potting, sealing and fixing of electronic components requiring flame retardancy, waterproofing and insulation, including LED screens, wind turbine components, PCB substrates, power modules, LCD electronic displays, advertising lights and electronic circuits. It is also suitable for bonding, sealing and waterproofing of non-heat-generating control modules, widely applied in electronic manufacturing, LED lighting, new energy and industrial control industries, reducing fire risks and component failure rates, enhancing product safety and market competitiveness.
Certifications and Compliance
HONG YE SILICONE holds ISO9001 quality management system certification, CE and UL certifications. Our Flame Retardant Electronic Potting Compound (HY-9045) fully complies with international electronic material safety standards and environmental requirements, ensuring excellent flame retardancy and insulation performance, meeting the safety and compliance needs of global electronic markets, facilitating smooth import and reliable application in international projects.
Customization Options
We provide professional OEM customization services focused on flame-retardant needs. According to customers’ electronic component types and application scenarios, we can customize key parameters such as cured hardness, viscosity, operable time and curing speed. We also support formula optimization to enhance flame retardancy, adapting to different fire safety levels and personalized bulk procurement needs of global manufacturers.
Production Process
The product undergoes strict multi-link quality control: high-quality flame-retardant Silicone raw materials inspection → precise formula mixing (optimized for flame retardancy and insulation) → automated production and filling → pre-production sample performance testing (flame retardancy, insulation) → full inspection of finished products before shipment. Our professional QC team monitors the whole process, ensuring consistent flame-retardant performance and quality of each batch. FAQ
Q1: What packaging specifications are available?
A1: 5kg, 20kg, 25kg and 200kg, suitable for small-batch testing and large-batch electronic component production.
Q2: What is the shelf life and storage method?
A2: 1-year shelf life under 25℃; store in sealed containers in a cool, dry place; stratified colloid can be stirred evenly before use, no impact on performance.
Q3: Which substances should be avoided to prevent uncuring?
A3: Avoid contact with organotin compounds, sulfur, sulfides, amine compounds, incompletely cured condensation silicone, amine-cured epoxy resin and solder flux.
Q4: Is it a hazardous material for transportation?
A4: Non-hazardous, can be transported as general chemicals, complying with international transportation standards.
Q5: Can it be used for high-voltage electronic components?
A5: Yes, it has excellent insulation performance (volume resistance ≥1×10¹⁵ Ω), suitable for high-voltage components, providing both flame retardancy and safety protection.
Shenzhen Hong Ye Jie Technology Co., Ltd
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