Product Overview
Our Adhesive Electronic Potting Silicone Compound is a professional dual-function material engineered for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix. Different from ordinary Electronic Potting Compound or single adhesive, it combines strong bonding performance with comprehensive potting protection—liquid with good fluidity before curing, able to fill tiny gaps of electronic components while firmly adhering to substrates, and cures into a stable, corrosion-free protective layer. It solves the pain points of separate bonding and potting processes, simplifies production, and provides all-round protection for electronic components, ensuring long-term stable operation. Product Features & Advantages
1. Dual-function integration (adhesion + potting): Combines strong bonding performance with full-range potting protection, realizes two processes in one, simplifies production procedures, improves production efficiency and reduces procurement costs for electronic manufacturers.
2. UL94-HB flame retardancy & all-round protection: Reaches UL94-HB flame retardant grade, integrates waterproof, moisture-proof, dust-proof, insulation, shockproof and anti-corrosion properties, effectively isolating electronic components from harsh environmental damage.
3. Excellent fluidity & self-defoaming: Low viscosity and good fluidity, with self-defoaming performance, easily pots complex electronic components and fills tiny gaps, avoiding air bubbles and ensuring uniform protection and bonding.
4. Gentle curing & zero shrinkage: Cures without exotherm or corrosion, zero shrinkage during the whole curing process, ensures tight fitting with components and substrates, avoiding damage to fragile electronic parts.
5. Detachable & maintenance-friendly: Sealed components can be taken out for repair and replacement, and patching with this compound leaves no traces, reducing maintenance costs and material waste.
6. Flexible curing &量产-friendly: Mixed glue has a long pot life at room temperature, can be rapidly cured under heating, suitable for both manual operation and automated production lines, adapting to mass production needs.
7. Wide compatibility & stability: Firmly adheres to various substrates, with good acid-alkali resistance, atmospheric aging resistance and temperature adaptability, maintaining stable bonding and protection performance in diverse environments.
Technical Specifications
This product is a two-component adhesive electronic potting silicone compound, liquid before curing with adjustable viscosity according to production needs. It reaches UL94-HB flame retardant grade, cures without exotherm or shrinkage, and forms a high-adhesion, flexible protective layer after curing. Key parameters including viscosity, bonding strength, operable time, curing speed and hardness can be fully customized according to customers’ electronic component types and production processes, ensuring perfect适配 with bonding and potting requirements.
How to Use
1. Preparation: Fully stir Component A to mix settled fillers evenly; shake Component B thoroughly to ensure uniform material composition without stratification, which is critical for bonding strength and curing effect.
2. Mixing: Blend Component A and B strictly according to the specified weight ratio, stir evenly to guarantee consistent bonding performance and potting protection.
3. Potting & Bonding: Rely on the product’s self-defoaming and fluidity to pour the mixed silicone directly onto electronic components, ensuring it fills all gaps and adheres firmly to substrates (no additional adhesive needed).
4. Curing: Place the treated components at room temperature for storage (mixed glue has long pot life) or heat to accelerate curing; wait for full curing to achieve optimal bonding and protective performance.
Application Scenarios
Widely used for bonding, sealing, potting and coating protection of various electronic components, including circuit boards, power modules, sensors, LED modules, electronic ballasts and small household appliance control panels. It is suitable for electronic manufacturing, automotive electronics, industrial control, consumer electronics and other industries, simplifying production processes, improving production efficiency, reducing costs, and effectively protecting core components from external damage, enhancing product service life and market competitiveness.
Certifications and Compliance
HONG YE SILICONE holds ISO9001 quality management system certification, CE and UL certifications. Our Adhesive Electronic Potting Silicone Compound complies with UL94-HB flame retardant standards and international electronic material environmental requirements, is non-toxic and non-corrosive, suitable for various electronic component applications, ensuring smooth import and reliable application in global markets.
Customization Options
We provide professional OEM customization services. According to customers’ electronic component types, production processes and application scenarios, we can customize key parameters such as viscosity, bonding strength, operable time, curing speed and flame retardant grade. We also support formula optimization for special bonding or potting needs, meeting personalized bulk procurement needs of global electronic manufacturers.
Production Process
The product undergoes strict multi-link quality control: high-quality Silicone raw materials inspection → precise formula mixing (optimized for bonding and potting dual functions) → automated viscosity adjustment and filling → pre-production sample performance testing → full inspection of finished products before shipment. Our professional QC team monitors the whole process, backed by 20+ years of silicone manufacturing experience, ensuring consistent performance of each batch. FAQ
Q1: What substances should be avoided during use to prevent uncuring?
A1: Avoid contact with organotin compounds, sulfur, sulfides, amine compounds and their containing materials, which will cause the product to fail to cure normally.
Q2: How to store unused silicone compound?
A2: Seal and store Component A and B separately in a cool, dry place; mixed glue should be used up at one time to avoid waste.
Q3: What if the silicone is layered after long-term storage?
A3: This is normal; stir thoroughly before use, and it will not affect bonding, potting and other performances.
Q4: Is it suitable for complex electronic components with tiny gaps?
A4: Yes, it has excellent fluidity and self-defoaming performance, able to fill tiny gaps and ensure firm bonding.
Q5: Can it replace separate adhesive and potting materials?
A5: Yes, it integrates dual functions, simplifies production processes, reduces procurement costs and improves production efficiency.
Shenzhen Hong Ye Jie Technology Co., Ltd
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