HONG YE SILICONE Silicone Potting Compound, also called Electronic Encapsulation Adhesive, is a high-grade liquid silicone material integrating waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. Mixed with a curing agent, it solidifies into a protective layer, adhering excellently to PC, PMMA, PCB and CPU, and operating stably from -60℃ to 220℃. Available in addition and condensation curing types, it complements our RTV 2 Silicone Rubber , Pad Printing Silicone, Food grade mold silicone and Liquid Silicone, safeguarding electronic components for global manufacturers.
Product Overview
Our Electronic Potting Compound is a professional Silicone Encapsulant for electronic components, a key part of HONG YE SILICONE’s full silicone product matrix including Industrial mold silicone rubber. As a premium silicone raw material, it cures into a solid layer after adding a curing agent, realizing sealing, filling and pressure-proof protection. With superior adhesion and thermal stability to PC, PMMA, PCB and CPU, its two curing types meet diverse industrial needs, serving as a reliable choice for high-performance electronic component protection.
Product Features & Advantages
1. Comprehensive Protection: Offers excellent anti-corrosion, waterproof, moisture-proof, dust-proof, insulation, thermal conduction and shockproof effects, isolating components from harsh environments.
2. Strong Environmental Adaptability: Resists ozone and chemical erosion, maintaining stability in complex industrial conditions for long-term use.
3. Extreme Temperature Resistance: Works continuously from -60℃ to 220℃, absorbing thermal stress to protect chips and welded gold wires from high-temperature cycles.
4. Superior Material Quality: Low volatile content, high strength, and excellent bonding with aluminum, copper, stainless steel, ensuring durable component protection.
Technical Specifications
Operating Temperature: -60℃ ~ 220℃
Core Properties: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing Condition: Room temperature/heating curing, full curing in 24 hours
Material Traits: Low volatility, ozone-resistant, chemical erosion-resistant
How to Use
1. Preparation: Fully stir Component A to mix settled fillers; shake Component B thoroughly for uniform consistency.
2. Mixing: Blend A and B strictly by specified weight ratio to ensure stable curing effect.
3. Deaeration (Optional): Place mixed adhesive in a vacuum container, deaerate at 0.01MPa for 3 minutes to remove bubbles before potting.
4. Potting & Curing: Pour on target components, cure at room temperature or by heating. Proceed to next process after initial curing; full curing takes 24 hours, affected by temperature and humidity.
Application Scenarios
Widely used for encapsulating, sealing and filling electronic components, especially LED display modules, CPU peripherals, power supplies, control boards and communication devices. It enhances product stability, reduces failure rates during transportation and use, helping manufacturers improve quality and cut after-sales costs.
Certifications and Compliance
HONG YE SILICONE holds ISO9001, CE and UL certifications. Our Silicone Potting Compound complies with global electronic material standards, meeting import requirements of markets worldwide and ensuring reliability in international projects.
Customization Options
We offer OEM customization services. Hardness, viscosity and operation time of the cured product can be adjusted according to customer needs. Exclusive formulas for high thermal conductivity or ultra-low temperature resistance are available for personalized bulk orders.
Production Process
The product undergoes strict quality control: Silicone raw materials inspection → precise formula mixing → automated production → pre-production sample testing → final inspection before shipment. Our QC team monitors the whole process, backed by 20+ years of silicone manufacturing experience for consistent quality.
FAQ
Q1: What’s the difference between the two curing types?
A1: Addition curing has faster speed and lower shrinkage for high-precision components; condensation curing is cost-effective for general encapsulation.
Q2: How to store unused adhesive?
A2: Seal A and B separately in a cool dry place. Mixed adhesive must be used at once to avoid waste.
Q3: What if the colloid layers after storage?
A3: Stir thoroughly before use—this is normal and won’t affect performance.
Q4: Is it a hazardous material?
A4: Non-hazardous for transportation. Avoid mouth/eye contact; rinse with water if accidental contact occurs.
Q5: Is deaeration necessary?
A5: Optional but recommended for high-precision potting to avoid bubbles and ensure sealing effect.
Shenzhen Hong Ye Jie Technology Co., Ltd
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