HONG YE SILICONE Silicone Potting Compound (Electronic Encapsulation Adhesive) is a premium liquid silicone material with integrated waterproof, moisture-proof, thermal conductive, flame-retardant and insulating properties. Mixed with a curing agent, it solidifies into a tight protective layer, boasting excellent adhesion to PC, PMMA, PCB and CPU, and stable operation from -60℃ to 220℃. Divided into addition and condensation curing types, it’s a core product matching our RTV 2 Silicone Rubber , Pad Printing Silicone, Food grade mold silicone and Liquid Silicone, providing reliable encapsulation protection for electronic components in global electronics, LED and industrial control industries.
Product Overview
Our Electronic Potting Compound, also named Silicone Encapsulant or electronic glue, is a professional silicone-based encapsulation material for electronic components, and a key part of HONG YE SILICONE’s full silicone product matrix including Industrial mold silicone rubber. As a liquid silicone raw material processed with advanced technology, it cures into a solid protective layer after adding a curing agent, realizing comprehensive sealing, filling and pressure-proof protection for electronic components. It has superior adhesion and thermal stability to PC, PMMA, PCB and CPU, with two curing types to meet diverse industrial application needs, making it an ideal choice for high-reliability electronic component protection.
Product Features & Advantages
1. All-round protection: Delivers excellent anti-corrosion, waterproof, moisture-proof, dust-proof, temperature resistance, insulation, thermal conduction and shockproof effects, fully isolating components from harsh environmental damage.
2. Strong environmental adaptability: Ozone and chemical erosion resistance, maintaining stable performance in complex industrial working conditions for a long time.
3. Extreme temperature resistance: Continuous operation from -60℃ to 220℃, absorbing thermal stress from high-temperature cycles to protect chips and welded gold wires from damage.
4. Superior material performance: Low volatile content, high structural strength, and excellent bonding with aluminum, copper, stainless steel and other common metals in electronics production, ensuring long-term structural stability of encapsulated components.
Technical Specifications
Operating temperature range: -60℃ ~ 220℃
Core performance: Waterproof, moisture-proof, flame-retardant, insulating, thermally conductive, shockproof
Adhesive substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel
Curing condition: Room temperature/heating curing, full curing time 24 hours
Material characteristic: Low volatile content, ozone resistant, chemical erosion resistant
Compatibility: Perfect for LED displays, CPU peripheral components, electronic control boards
How to Use
1. Preparation: Fully stir Component A to mix settled fillers evenly; shake Component B thoroughly to ensure uniform material composition.
2. Mixing: Blend Component A and B strictly according to the specified weight ratio to guarantee consistent curing effect.
3. Deaeration (Optional): Put the uniformly mixed adhesive into a vacuum container, deaerate for 3 minutes under 0.01MPa to remove air bubbles, then ready for potting.
4. Potting & Curing: Pour the treated adhesive on target electronic components; cure at room temperature or by heating, conduct subsequent processes after basic curing. Environmental temperature and humidity affect curing speed, with full curing completed in 24 hours.
Application Scenarios
This product is widely used for encapsulation, sealing and filling of various electronic components, especially suitable for LED display modules, CPU peripheral components, power supply units, electronic control boards and communication equipment. It effectively improves the environmental adaptability and structural stability of electronic products, reduces component failure rates during transportation and use, and helps manufacturers improve product quality and cut after-sales maintenance costs, being a core material for high-quality electronics manufacturing.
Certifications and Compliance
HONG YE SILICONE has passed ISO9001 quality management system certification, and our Silicone Potting Compound and all silicone products comply with CE and UL international standards. All products are manufactured in strict accordance with global electronic material industry specifications, ensuring safety and reliability in international electronic manufacturing, LED and industrial control projects, and meeting the import quality requirements of global markets.
Customization Options
We provide professional OEM customization services for Silicone Potting Compound. According to customers’ different application scenarios and performance requirements, we can independently adjust and formulate the hardness, viscosity and operation time of the cured product. For special needs such as high thermal conductivity and ultra-low temperature resistance, we can customize exclusive product formulas to meet personalized bulk procurement needs of global customers.
Production Process
The product is manufactured through a strict multi-link production and quality control process: high-quality Silicone raw materials inspection → precise formula mixing and stirring → automated production line processing → pre-production sample curing performance testing → full inspection of finished products before shipment. Our professional QC team conducts whole-process quality monitoring, with mature production technology accumulated over 20 years of silicone material manufacturing, ensuring consistent performance of each batch of products.
FAQ
Q1: What is the difference between addition and condensation curing potting compound?
A1: Addition curing type has faster curing speed and lower shrinkage rate, suitable for high-precision electronic component potting; condensation curing type is cost-effective with stable performance, suitable for general electronic component encapsulation.
Q2: How to store unused Silicone Potting Compound?
A2: Seal Component A and B separately and store in a cool and dry environment. The mixed adhesive must be used up at one time to avoid material waste caused by spontaneous curing.
Q3: What if the colloid is layered after long-term storage?
A3: This is a normal physical phenomenon of silicone materials. Just fully stir the colloid before use, and the product performance will not be affected at all.
Q4: Is Silicone Potting Compound a hazardous material for transportation?
A4: It is a non-hazardous material complying with international transportation standards, but avoid contact with mouth and eyes during use; rinse with clean water immediately if accidental contact occurs, and seek medical treatment if necessary.
Q5: Is deaeration a necessary step when using the product?
A5: Deaeration is not mandatory, but highly recommended for high-precision component potting, which avoids air bubbles in the cured protective layer and ensures the product’s sealing and insulation effect.
Shenzhen Hong Ye Jie Technology Co., Ltd
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