Product Overview
Our Electronic Potting for Superluminescent Diodes is a professionalSilicone Potting Compound developed for the encapsulation, sealing, heat dissipation and protection of Superluminescent Diodes (SLD). As a leading manufacturer of electronic Potting Compound and silicone raw materials, we optimize the formula for SLD’s core needs—ultra-low optical loss, wide spectral compatibility and high stability. Unlike ordinary potting silicones, it maintains ultra-low optical loss after curing, does not interfere with SLD’s wide-spectrum emission, efficiently dissipates heat to avoid chip degradation, resists corrosion and ozone, and has excellent adhesion to PC, PMMA, PCB and metals, effectively protecting SLD chips and welding wires, ensuring long-term stable spectral performance for procurement partners.
Key Features & Advantages
- Ultra-Low Optical Loss & Wide Spectral Compatibility: Ultra-low optical loss (≤0.08%) after curing, ensuring no obstruction to SLD’s wide-spectrum transmission and maintaining stable spectral intensity and bandwidth; high transparency and uniform light transmittance, avoiding spectral distortion or scattering, which is critical for SLD’s application in optical sensing and communication.
- Superior Heat Dissipation & Temperature Adaptability: Operating stably from -60℃ to 220℃, with outstanding high and low temperature resistance; integrated thermally conductive potting compound properties accelerate heat dissipation of SLD chips, avoiding overheating-induced spectral drift and extending service life; absorbs internal stress from temperature cycles, protecting SLD chips and welding wires from damage.
- Ultra-High Insulation & Anti-Vibration: Ultra-strong insulation performance (dielectric strength ≥25 kV/mm, volume resistivity ≥1.0×10¹⁶ Ω·cm), preventing short circuits and ensuring safe operation; excellent anti-vibration and shock-resistant effects, protecting SLDs from mechanical damage during transportation and use; waterproof, moisture-proof and dust-proof, adapting to harsh industrial and optical application environments.
- Strong Adhesion & Easy Operation: Excellent adhesion to PC (electronic insulation board), PMMA (acrylic), PCB and metals (aluminum, copper, stainless steel), forming a tight seal without detachment; two-component design, easy to mix evenly, optional vacuum defoaming (0.01MPa for 3 minutes), supports room temperature or heated curing, full curing in 24 hours, suitable for batch SLD production.
- High Stability & Dual-Formula Options: Available in high-purity addition curing silicone (low volatility, non-toxic, high stability) and enhanced thermally conductive potting compound (for high-power SLDs), meeting different power and application needs; low volatility, high strength, no stratification after long-term storage (stir before use without affecting performance); mixed glue can be used up at one time, reducing waste and procurement costs.
How to Use (Step-by-Step Guide)
- Pre-Mixing Preparation: Fully stir Component A in its container to mix the settled filler evenly, and shake Component B thoroughly to ensure uniform consistency, avoiding affecting curing effect, optical loss and adhesion, which is crucial for SLD’s spectral performance.
- Mixing: Mix Component A and Component B according to the specified weight ratio (customizable), stir slowly and evenly to avoid generating air bubbles, which may affect optical loss, heat dissipation and sealing performance of SLDs.
- Degassing (Optional): Put the mixed potting compound into a vacuum container, degas at 0.01MPa for 3 minutes to completely eliminate air bubbles, then pour it into SLD packaging molds or casings.
- Curing: Place the encapsulated SLD at room temperature for curing or heat to accelerate curing; enter the next process after basic curing, and full curing takes 24 hours. Note: Environment temperature and humidity significantly affect curing speed and final performance.
Application Scenarios
This specializedelectronic potting compound and silicone encapsulant is mainly used for encapsulation, sealing, filling and heat dissipation protection of various Superluminescent Diodes (SLD). It is widely applied in optical coherence tomography (OCT), fiber optic gyroscopes, optical sensing, medical imaging, fiber optic communication and industrial measurement. It ensures stable wide-spectrum emission of SLDs in high-precision and harsh environments, reduces failure rates caused by moisture, corrosion, vibration and overheating, extends service life, and helps procurement partners reduce production costs and enhance product competitiveness.
Technical Specifications
Type: Addition-Curing & Thermally Conductive Electronic Potting Silicone; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Transparent Liquid (both components); Viscosity: Customizable; Working Time: Customizable; Curing Time: 24 hours (full, room temp/heated optional); Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Adhesion: Excellent (PC, PMMA, PCB, metals); Optical Loss: ≤0.08%; Thermal Conductivity: Customizable; Volatility: Minimal; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Non-hazardous; Customizable parameters available.
Certifications & Compliance
Our Electronic Potting for Superluminescent Diodes complies with international standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global SLD production requirements, trusted by global optical component manufacturers and procurement partners.
Customization Options
We provide SLD-specific customization: adjust viscosity, hardness, curing speed, optical loss, thermal conductivity and insulation; choose between addition curing silicone and thermally conductive potting compound; optimize adhesion for SLD packaging materials; flexible parameter adjustment to match different SLD spectral bandwidth and power requirements, meeting small-batch and large-scale production needs.
Production Process & Quality Control
We implement a strict 5-step quality control process: high-purity silicone raw materials screening, precision automated mixing, performance testing (optical loss, adhesion, heat dissipation, insulation), curing verification, and sealed packaging. Monthly capacity exceeds 500 tons, supporting stable global supply; non-hazardous, transportable as general chemicals.
FAQ
Q: Is it suitable for all types of SLDs? A: Yes, it can be customized for different spectral bandwidth, high-power and low-power SLDs, with good compatibility and no impact on wide-spectrum emission performance. Q: What’s the difference between the two formula options? A: Addition curing silicone is ideal for general SLDs; thermally conductive type is for high-power models needing efficient heat dissipation to avoid spectral drift. Q: How to store the product? A: Seal and store, shelf life is 12 months; stir evenly before use if stratified, no impact on performance. Q: Is it hazardous? A: No, it is non-hazardous and can be transported as general chemicals. Q: What if it gets into eyes or mouth? A: Rinse with clean water immediately or seek medical attention.
Shenzhen Hong Ye Jie Technology Co., Ltd
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