Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a heat-conductive and thermal management 2-component Addition Curing Silicone, featuring excellent heat conductivity (thermal conductivity ≥1.5 W/(m·K)), good thermal management, can quickly dissipate heat, suitable for heat-dissipating scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS heat-conductive certification, compatible with high-temperature insulation silicone and Electronic Potting Compound, serving B2B buyers in thermal management industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a heat-conductive core product, specially developed for thermal management and heat-dissipating scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with heat-conductive components, featuring excellent heat conductivity, fine uniform closed-cell structure, good elasticity and thermal stability. It can quickly transfer and dissipate heat (thermal conductivity ≥1.5 W/(m·K)), effectively reducing the temperature of equipment and components, preventing overheating damage, ensuring stable operation. Compatible with most of our insulation and electronic products, it is ideal for electronic, industrial and robot thermal management scenarios.
Technical Specifications
Type: 2-component addition curing silicone
Heat-Conductive Performance: Thermal conductivity ≥1.5 W/(m·K), good heat conductivity, rapid heat dissipation; thermal management stable
Foaming Feature: Fine uniform closed-cell pores (30-70μm), heat-conductive, no heat accumulation, good heat transfer
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS heat-conductive certification
Key Traits: Heat-conductive, thermal management, thermal conductivity ≥1.5 W/(m·K), rapid heat dissipation
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Heat Conductivity: Thermal conductivity ≥1.5 W/(m·K), can quickly transfer and dissipate heat, solving the problem of traditional foaming materials’ poor heat conductivity and heat accumulation.
2. Effective Thermal Management: Reduces equipment and component temperature, prevents overheating damage, extends service life, ensures stable operation in high-temperature working environments.
3. Heat Conductivity & Insulation Balance: While maintaining excellent heat conductivity, it has certain electrical insulation performance, avoiding short circuit, balancing thermal management and safety.
4. Compatibility with Thermal Products: Compatible with HONG YE SILICONE’s high-temperature insulation silicone and electronic Potting Compound, forming a complete thermal management solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat-conductive components, no professional heat-conductive operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting heat-conductive performance).
2. Mix and stir thoroughly for 2-3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure heat-conductive uniformity and closed-cell structure).
3. Pour the mixture into heat-dissipating component mold (paired with high-temperature insulation silicone), foam and cure at room temperature or by heating.
4. After full curing, the product has excellent heat conductivity, can quickly dissipate heat, ready for use in thermal management scenarios.
Application Scenarios
Focus on thermal management scenarios: Electronic component heat dissipation (paired with electronic potting compound), industrial equipment thermal management (paired with Industrial mold silicone rubber), robot heat-dissipating parts (paired with robot silicone), high-temperature insulation heat transfer (paired with high-temperature insulation silicone), and heat-dissipating packaging auxiliary parts (paired with Liquid Tank Silicone). It helps thermal management buyers reduce equipment temperature and ensure stable operation.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS heat-conductive certification, excellent heat conductivity and thermal management, meeting the thermal management procurement requirements of B2B buyers in electronic, industrial and robot industries, facilitating export to global markets.
Customization Options
Customizable thermal conductivity (≥2.5 W/(m·K) for high-demand scenarios), heat dissipation speed, foaming ratio and hardness, adapting to different thermal management requirements, helping buyers optimize heat dissipation effect.
Production Process
Heat-conductive-oriented production process: High-purity heat-conductive Silicone raw materials → formula optimization (add heat-conductive components) → precision mixing → heat-conductive test → standardized curing → thermal management inspection → packaging. Strict heat-conductive testing ensures product heat dissipation performance.
FAQ
Q1: What is the thermal conductivity? A: ≥1.5 W/(m·K), excellent heat conductivity, rapid heat dissipation.
Q2: Can it reduce equipment temperature? A: Yes, effective thermal management, quickly dissipates heat, prevents overheating damage.
Q3: Is it suitable for electronic component heat dissipation? A: Yes, paired with electronic potting compound, ideal for electronic component heat dissipation.
Q4: Does it have insulation performance? A: Yes, heat conductivity and insulation balanced, avoiding short circuit.
Shenzhen Hong Ye Jie Technology Co., Ltd
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