Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a heat-conductive and thermal-dissipative 2-component Addition Curing Silicone, featuring excellent heat conductivity (thermal conductivity ≥0.8 W/(m·K)), thermal-dissipative, fast heat transfer, suitable for heat-dissipation and high-temperature heat-transfer scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS heat-conductive certification, compatible with high-temperature insulation silicone and Electronic Potting Compound, serving B2B buyers in heat-dissipation industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam) is a heat-conductive core product, specially developed for heat-dissipation, thermal-transfer and high-temperature heat-management scenarios. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with heat-conductive fillers, featuring high thermal conductivity, heat-dissipative, fine uniform closed-cell structure, good elasticity and thermal stability. It has a thermal conductivity of ≥0.8 W/(m·K), can quickly transfer heat, dissipate excess temperature, avoid overheating of equipment and components, effectively solving the problem of traditional foaming silicone’s poor heat conductivity. Compatible with most of our high-temperature and electronic products, it is ideal for electronic, electrical and heat-management scenarios.
Technical Specifications
Type: 2-component addition curing silicone
Heat-Conductive Performance: Thermal conductivity ≥0.8 W/(m·K), heat-conductive, thermal-dissipative, fast heat transfer, heat management
Foaming Feature: Fine uniform closed-cell pores (30-70μm), heat-conductive, uniform heat transfer, no local overheating
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS heat-conductive certification
Key Traits: Heat-conductive, thermal-dissipative, ≥0.8 W/(m·K), fast heat transfer
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent Heat Conductivity: Thermal conductivity ≥0.8 W/(m·K), fast heat transfer, effective heat dissipation, solving the problem of traditional foaming materials’ poor heat conductivity and equipment overheating.
2. Efficient Thermal Dissipation: Can quickly dissipate excess temperature, avoid overheating of electronic and electrical components, extend equipment service life.
3. Heat-Conductive & Elasticity Balance: While maintaining high thermal conductivity, it retains good elasticity and structural stability, can fit closely with heat-generating components, balancing heat transfer and usability.
4. Compatibility with Heat-Management Products: Compatible with HONG YE SILICONE’s high-temperature insulation silicone and electronic Potting Compound, forming a complete heat-management solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat-dissipative components, no professional heat-conductive operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting heat-conductive performance).
2. Mix and stir thoroughly for 2-3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure uniform heat transfer and closed-cell structure).
3. Pour the mixture into heat-dissipative component mold (paired with electronic potting compound), foam and cure at room temperature or by heating.
4. After full curing, the product has excellent heat conductivity, can quickly transfer and dissipate heat, ready for use in heat-dissipation scenarios.
Application Scenarios
Focus on heat-dissipation scenarios: Electronic component heat dissipation (paired with electronic potting compound), electrical equipment thermal management (paired with high-temperature insulation silicone), heat-conductive robot parts (paired with robot silicone), heat-dissipative packaging (paired with Liquid Tank Silicone), and high-temperature heat-transfer components (paired with high-temperature insulation silicone). It helps heat-dissipation buyers avoid equipment overheating and extend service life.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS heat-conductive certification, excellent heat-conductive and thermal-dissipative performance, meeting the heat-dissipation procurement requirements of B2B buyers in electronic, electrical and heat-management industries, facilitating export to global markets.
Customization Options
Customizable thermal conductivity (≥1.2 W/(m·K) for high-demand scenarios), heat-dissipation rate, foaming ratio and hardness, adapting to different heat-dissipation requirements, helping buyers optimize heat management effect.
Production Process
Heat-conductive-oriented production process: High-purity heat-conductive Silicone raw materials → formula optimization (add heat-conductive fillers) → precision mixing → heat conductivity test → standardized curing → thermal stability inspection → packaging. Strict heat-conductive testing ensures product efficient heat transfer and dissipation.
FAQ
Q1: What is the thermal conductivity? A: ≥0.8 W/(m·K), heat-conductive, fast heat transfer, efficient heat dissipation.
Q2: Can it prevent equipment overheating? A: Yes, can quickly dissipate excess temperature, avoid overheating of electronic and electrical components.
Q3: Is it suitable for electronic component heat dissipation? A: Yes, paired with electronic potting compound, ideal for electronic component heat dissipation.
Q4: Will heat conductivity decrease over time? A: No, thermal conductivity is stable, no attenuation after long-term use.
Shenzhen Hong Ye Jie Technology Co., Ltd
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