Product Summary
HONG YE SILICONE’s Liquid Foamed Silicone is a high thermal conductivity 2-component Addition Curing Silicone, featuring excellent heat dissipation (thermal conductivity ≥1.5 W/(m·K)), heat transfer efficiency, no heat accumulation, suitable for heat dissipation, high-temperature equipment and thermal management scenarios. It has fine uniform closed-cell pores, -65℃-200℃ temperature resistance, 1:1 easy operation, passed SGS thermal conductivity certification, compatible with Electronic Potting Compound and high-precision Mold Silicone , serving B2B buyers in electronic, automotive and thermal management industries.
Product Overview
HONG YE SILICONE’s Liquid Foamed Silicone (Foaming Silicone Rubber, Silicone Foam ) is a high thermal conductivity heat dissipation core product, specially developed for heat dissipation, high-temperature equipment and thermal management environments. As a 2-component addition curing silicone, it is formed by chemical foaming of flowable Part A and Part B, formulated with thermal conductive fillers and heat dissipation modifiers, featuring ultra-high thermal conductivity, efficient heat transfer, fine uniform closed-cell structure, good elasticity and thermal stability. It has a thermal conductivity of ≥1.5 W/(m·K), efficient heat dissipation, no heat accumulation, effectively reducing equipment temperature, solving the problem of traditional foaming materials’ poor heat dissipation in high-temperature scenarios. Compatible with most of our electronic and thermal products, it is ideal for heat dissipation components, thermal conductive buffers and thermal management scenarios.
Technical Specifications
Type: 2-component addition curing silicone
High Thermal Conductivity & Heat Dissipation: Thermal conductivity ≥1.5 W/(m·K), efficient heat transfer, no heat accumulation, heat dissipation efficiency ≥95%, thermal stability ≥95%
Foaming Feature: Fine uniform closed-cell pores (20-40μm), thermal conductive structure, dense pore distribution, uniform heat transfer, no heat concentration
Temperature Range: -65℃ to 200℃ (long-term use)
Mixing Ratio: 1:1 (Part A:Part B, by weight)
Cure Method: Room-temperature or heated (80℃, 1h) vulcanization
Certifications: SGS eco-toxicity, RoHS, SGS thermal conductivity certification
Key Traits: High thermal conductivity, heat dissipation, thermal conductivity ≥1.5 W/(m·K), no heat accumulation
Packaging: Part A (20/25/200KG/barrel), Part B (20/25/200KG/barrel)
Product Features & Advantages
1. Excellent High Thermal Conductivity: Thermal conductivity ≥1.5 W/(m·K), efficient heat transfer, solving the problem of traditional foaming materials’ poor heat dissipation in high-temperature scenarios.
2. Efficient Heat Dissipation: Heat dissipation efficiency ≥95%, no heat accumulation, effectively reducing equipment temperature, protecting equipment from overheating damage.
3. Thermal Conductivity & Elasticity Balance: While maintaining ultra-high thermal conductivity, it retains good elasticity and structural stability, no brittle fracture, balancing heat dissipation and usability.
4. Compatibility with Heat Dissipation Products: Compatible with HONG YE SILICONE’s electronic Potting Compound and high-precision mold silicone, forming a complete thermal management solution, enabling one-stop procurement. 5. Easy Operation: 1:1 simple mixing ratio, good flowability, easy to process into heat dissipation components, no professional thermal conductive operation skills required, improving production efficiency.
How to Use
1. Take Part A and Part B according to 1:1 weight ratio, stir separately to eliminate sediment, ensure no impurities (avoid affecting thermal conductivity and heat dissipation).
2. Mix and stir thoroughly for 3 minutes until homogeneous, vacuum degas to remove air bubbles (ensure thermal conductivity uniformity and closed-cell structure).
3. Pour the mixture into heat dissipation component mold (paired with electronic potting compound), foam and cure at room temperature or by heating (heating helps enhance thermal conductivity).
4. After full curing, the product has excellent heat dissipation performance, ready for use in thermal management and high-temperature scenarios.
Application Scenarios
Focus on heat dissipation scenarios: Electronic heat dissipation buffers (paired with electronic potting compound), automotive high-temperature components (paired with Industrial mold silicone rubber), thermal management parts (paired with high-precision mold silicone), heat-dissipating robot parts (paired with robot silicone), and high-temperature packaging (paired with Liquid Tank Silicone). It helps thermal management buyers reduce equipment temperature and extend equipment service life.
Certifications and Compliance
Passed SGS eco-toxicity certification, RoHS compliant, SGS thermal conductivity certification, excellent high thermal conductivity and heat dissipation, meeting the thermal management procurement requirements of B2B buyers in electronic, automotive and thermal management industries, facilitating export to global markets.
Customization Options
Customizable thermal conductivity (≥2.0 W/(m·K) for high-demand scenarios), heat dissipation efficiency (≥98% for high-demand scenarios), foaming ratio and hardness, adapting to different heat dissipation and thermal management requirements, helping buyers optimize heat transfer effect.
Production Process
Thermal conductive-oriented production process: High-purity thermal conductive Silicone raw materials → formula optimization (add thermal conductive fillers and heat dissipation modifiers) → precision mixing → thermal conductivity test → heat dissipation test → standardized curing → thermal stability inspection → packaging. Strict thermal testing ensures product ultra-high thermal conductivity and efficient heat dissipation.
FAQ
Q1: What is the thermal conductivity? A: ≥1.5 W/(m·K), excellent thermal conductivity, efficient heat transfer and heat dissipation.
Q2: Will it cause heat accumulation? A: No, heat dissipation efficiency ≥95%, no heat accumulation, effectively reducing equipment temperature.
Q3: Is it suitable for electronic heat dissipation scenarios? A: Yes, paired with electronic potting compound, ideal for electronic heat dissipation buffers and thermal management parts.
Q4: Will high temperature affect its thermal conductivity? A: No, thermal stability ≥95%, thermal conductivity remains unchanged in -65℃-200℃, ensuring heat dissipation in high-temperature scenarios.
Shenzhen Hong Ye Jie Technology Co., Ltd
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