Non-Particulate Foamed Silicone Cushion

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Payment Type:	T/T,Paypal
Incoterm:	FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:	1 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	shenzhen

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Product Description

Product Attributes

Packaging & Delivery

Product Description

Product Attributes

Model No.: HY-F series

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	1kg/5kg/25kg/200kg
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Product Description

Product Abstract

Semiconductor Dust-Free Anti-Vibration Packaging Foamed Silicone is microchip ultra-clean protectiveAddition Curing Silicone, semiconductor wafer anti-shock packagingRTV Silicone Foam . Developed from ultra-clean low-particle semiconductor liquid silicone, this chip anti-static buffer Foam Silicone features zero dust shedding, micro-vibration isolation, static elimination and chemical inertness, with adjustable 2-5 times ultra-clean foaming ratio. It serves for semiconductor wafer packaging lining, microchip transportation shockproof filler, precision semiconductor component dust-proof buffer pad, chip testing equipment isolation layer. Matched with semiconductor ultra-precision clean Mold Silicone, the particle-free Foaming Silicone Rubber forms ultra-clean anti-vibration Silicone Sponge for semiconductor precision electronic packaging protection.

Product Overview

This semiconductor dedicated two-component liquid silicone is purified by ultra-clean process, with zero micro-particle shedding and low ion content, meeting semiconductor grade dust-free packaging standards. As electrostatic dissipative inert Addition Curing Silicone, it eliminates static adsorption dust and avoids electrostatic damage to precision chips. After particle-free closed-cell foaming, it forms anti-shock protective Silicone Sponge. Different from ordinary packaging foam with particle shedding and static accumulation, this ultra-clean RTV Silicone Foam prevents chip scratch and static breakdown, belonging to high-end semiconductor precision packaging core materialFoaming Silicone Rubber.

Core Product Features & Advantages

1. Ultra-clean zero shedding: Purified formula of Foaming Silicone Rubber avoids micro-particle pollution to wafers and chips.

2. Static damage prevention: Low-resistance static dissipative liquid silicone protects semiconductor components from ESD damage.

3. Micro-vibration isolation: Compact elastic Foam Silicone buffers tiny vibration in chip transportation and testing.

4. Chemical inert protection: Non-reactive Addition Curing Silicone does not corrode semiconductor precision components.

5. Ultra-precision clean molding: Dust-free demolding with semiconductor dedicated Mold Silicone.

6. High yield guarantee: Stable cured Foamed Silicone reduces chip packaging and transportation damage rate.

Step-by-Step Usage Instructions

1. Ultra-clean stirring: Stir semiconductor-grade A/B liquid silicone in Class 100 dust-free workshop strictly.

2. Static-free mixing: 1:1 uniform stirring for 3 minutes to stabilize anti-static and dust-free performance.

3. Particle-free defoaming: Remove micro bubbles to ensure flawless fitting of chip packaging Silicone Sponge.

4. Semiconductor mold curing: Shaping via ultra-clean precision Mold Silicone to obtain protective RTV Silicone Foam.

Application Scenarios

Silicon wafer dust-free packaging liner, precision microchip transportation anti-vibration filler, semiconductor discrete component static-proof buffer pad, chip testing bench isolation foam, integrated circuit (IC) finished product protective layer. The ultra-clean Foamed Silicone ensures zero defect packaging and transportation of high-precision semiconductor products.

Precautions

Strictly prohibit external particle contamination to maintain the ultra-clean protective performance of Addition Curing Silicone.

Packaging & Storage

25KG semiconductor vacuum dust-free barrel, constant temperature sterile storage, retain ultra-clean performance of raw Foam Silicone.