Product Abstract
Hong Ye silicone rubber's Precision Electronic Packaging Anti-Static Shockproof Foamed Silicone is microelectronic component anti-static buffer Addition Curing Silicone, chip packaging dust-free shock absorption RTV Silicone Foam. Adopting ultra-clean anti-static electronic-grade liquid silicone, this semiconductor packaging protective Foam Silicone features permanent anti-static performance, dust-free zero-shedding, anti-extrusion buffer and low-temperature stability, with adjustable 2-4 times ultra-fine uniform foaming ratio. It is widely used for chip packaging inner lining, precision circuit board transportation buffer filling, semiconductor component anti-static protection layer, micro-electronic finished product anti-collision packaging filler. Matched with electronic component micro-precision Mold Silicone, the dust-free anti-static Foaming Silicone Rubber forms high-clean protectiveSilicone Sponge for precision electronic packaging and transportation.
Product Overview
This precision electronic packaging dedicated two-component liquid silicone is specially formulated for semiconductor and microelectronic anti-static packaging scenarios, solving the fatal defects of ordinary packaging foam such as static electricity accumulation, dust shedding and easy compression damage to tiny components. As low-resistance stable anti-static Addition Curing Silicone, it continuously releases static electricity without accumulating electric charge, avoiding electrostatic breakdown of precision electronic parts. After dust-free micro-pore foaming treatment, it forms anti-static shock-absorbing Silicone Sponge. Different from ordinary EVA and plastic foam with unstable anti-static performance, this electronic-grade RTV Silicone Foam ensures zero damage rate of electronic components during packaging and transportation, belonging to high-standard protective packaging material for semiconductor products Foaming Silicone Rubber.
Core Product Features & Advantages
1. Permanent anti-static protection: Modified molecular structure of Foaming Silicone Rubber prevents static accumulation and component breakdown.
2. Ultra-clean zero shedding: Purified dust-free liquid silicone avoids particle contamination on chip surfaces.
3. Micro-buffer anti-extrusion: Fine uniform pores of Foam Silicone protect tiny electronic structures from pressure damage.
4. Low temperature stability: Flexible performance of Addition Curing Silicone adapts low-temperature cold chain transportation.
5. Micro-precision customization: Fits tiny electronic component gaps with ultra-precision Mold Silicone.
6. Reusable durability: Elastic cured Foamed Silicone supports repeated packaging and turnover use.
Step-by-Step Usage Instructions
1. Electronic grade raw stirring: Stir anti-static electronic A/B liquid silicone evenly in dust-free workshop.
2. Isometric precise mixing: Mix 1:1 raw materials slowly for 2 minutes to ensure uniform anti-static foaming structure.
3. Ultra-clean defoaming treatment: Remove micro-bubbles to achieve flat and tight fitting of electronic Silicone Sponge.
4. Precision mold curing: Micro-size shaping via electronic dedicated Mold Silicone to obtain anti-static RTV Silicone Foam.
Application Scenarios
Semiconductor chip anti-static packaging liner, precision PCB circuit board transportation buffer foam, micro electronic component shockproof filling layer, optical electronic parts dustproof protective pad, cold chain electronic product anti-extrusion packaging material. The high-cleanFoamed Silicone provides full-range safety protection for precision electronic packaging and turnover transportation.
Precautions
Avoid mixing with impurity materials to prevent attenuation of anti-static performance of Addition Curing Silicone.
Packaging & Storage
25KG dust-free electronic vacuum barrel, constant temperature and humidity storage, retain anti-static stability of raw Foam Silicone.
FAQ
Q1: Can this Silicone Sponge effectively prevent static damage to electronic components?
A1: Permanent anti-static Foaming Silicone Rubber eliminates static accumulation and electrostatic breakdown risks.
Q2: Will it produce dust and pollute precision chips?
A2: Zero-shedding ultra-clean liquid silicone meets semiconductor dust-free packaging standards.
Q3: Custom micro-size gaskets for tiny electronic parts with Mold Silicone?
A3: Low-tolerance high-precision RTV Silicone Foam supports ultra-fine electronic product customization.
Shenzhen Hong Ye Jie Technology Co., Ltd
Contact Now
