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Home> Industry News> HONG YE SILICONE Optimizes Addition Curing Silicone Formula for Overseas Electronic Component Clients

HONG YE SILICONE Optimizes Addition Curing Silicone Formula for Overseas Electronic Component Clients

2026,08,04
HONG YE SILICONE Optimizes Addition Curing Silicone Formula for Overseas Electronic Component Clients
 
 
Keywords: HONG YE SILICONE, addition curing silicone, electronic potting silicone, high temperature resistant silicone
 
 
Summary: Against growing overseas demand for high-reliability electronic encapsulation materials, HONG YE SILICONE upgrades its addition curing silicone formulation to enhance heat resistance and low-shrinkage performance.
 
foam silicone
 
 
Details: Global electronics manufacturers raise stricter requirements on potting materials for circuit modules amid frequent high-temperature weather. HONG YE SILICONE adjusts raw material matching parameters, lowering product shrinkage rate while maintaining stable working time. The improved electronic potting silicone has gained repeated trial orders from Southeast Asia and European buyers, supporting long-term supply cooperation for precision electronic assembly customers.
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