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Home> Company News> Low-VOC Electronic Potting Silicone Released

Low-VOC Electronic Potting Silicone Released

2026,09,11
Keywords: Hongye Silicone, low-VOC potting silicone, electronic encapsulation material
Key Sentence: Hongye Silicone launches low-VOC electronic potting silicone to satisfy strict EU REACH requirements for power device encapsulation.
electronic silicone

Sep 11, 2026 — Electronic manufacturers exporting to Europe face stricter limits on volatile organic compounds for potting materials. Traditional potting silicone may release volatile substances during curing, which can contaminate sensitive circuit boards and fail overseas environmental audits. Hongye Silicone’s R&D team developed this new low-VOC two-component addition cure silicone with optimized filler and polymer raw materials. It keeps low viscosity for easy pouring and eliminates bubble trapping inside compact electronic assemblies.

This potting material maintains stable electrical insulation and thermal shock resistance after curing. It protects circuit modules, sensors and power supplies from moisture, dust and vibration. The product has passed RoHS and REACH testing, with complete COA, MSDS and test reports ready for customs clearance. The Huizhou factory keeps dedicated production lines for low-VOC silicone to avoid cross-contamination with regular grades. Many European manufacturers of chargers and IoT devices requested samples for reliability testing. Hongye Silicone technical engineers provide on-site mixing and curing guidance, helping electronics factories cut material qualification cycles and meet EU green import standards.

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