HONG YE SILICONE Electronic Potting Compound is a professional-grade Thermally Conductive Potting Compound designed for LED drivers, a core Silicone raw material with excellent heat dissipation and flame retardancy. As a high-performance Electronic Encapsulation Adhesive, it is a two-component addition-curing silicone with 1:1 weight ratio, low viscosity and good leveling. It features UL94-V0 flame retardancy, IP65 waterproof rating, wide temperature adaptability (-60℃ to 220℃), fully complying with EU RoHS standards, protecting LED drivers from damage and ensuring stable, long-lasting operation, meeting global LED manufacturer demands.
Product Overview
Our Electronic Potting Compound is specially developed for LED drivers, used to encapsulate, seal and protect driver circuits, power modules and electronic components. As a professional supplier of liquid silicone and Silicone Potting Compound, we provide a reliable alternative to traditional Epoxy Potting Resin. This formula (model HY-9315 as reference) is tailored for LED driver scenarios—excellent thermal conductivity, low viscosity for easy potting, and flexible curing (room temperature or heating), effectively solving overheating issues of LED drivers and extending their service life. Technical Specifications
This is a two-component addition-curing thermally conductive potting silicone (model HY-9315 as reference), with customizable parameters. Key properties:
- Mixing ratio (A:B): 1:1 by weight; Viscosity (A/B): 500±100 cps (liquid state)
- Mixed viscosity: 500±100 cps; Operating time (25℃): 0.5-2 hours
- Curing time: 4-5 hours (room temperature); 20 minutes (80℃); 15 minutes (80-100℃)
- Hardness after curing: 15±5 Shore A; Thermal conductivity: ≥0.8 W(m·K)
- Insulation & Flame retardancy: Dielectric strength ≥25 kV/mm; UL94-V0 grade; Volume resistance ≥1.0×1016 Ω·cm
- Waterproof rating: IP65; Operating temperature: -60℃ to 220℃
- Customizable: Hardness, viscosity and operating time can be adjusted as needed
Product Features & Advantages
- Excellent Thermal Conductivity: ≥0.8 W(m·K) thermal conductivity, efficiently dissipating heat generated by LED drivers, avoiding overheating and extending driver service life.
- High Flame Retardancy: UL94-V0 flame-retardant rating, eliminating fire risks, fully complying with LED industry safety standards and EU RoHS directives.
- IP65 Waterproof & Dust-Proof: Superior sealing performance, effectively preventing water and dust from entering LED drivers, suitable for indoor and outdoor LED applications.
- Low Viscosity & Good Leveling: Easy to pour, filling tiny gaps of LED driver components, ensuring uniform encapsulation and no air bubbles (defoaming recommended).
- Wide Temperature Adaptability: Stable operation from -60℃ to 220℃, adapting to extreme cold and heat, suitable for various LED working environments.
- Flexible Curing & Easy Operation: Room temperature or heating curing (temperature-dependent speed), 1:1 mixing ratio, suitable for mass production of LED drivers.
How to Use (Step-by-Step)
- Pre-Mix Preparation: Fully stir Component A and Component B separately in their respective containers to ensure uniform viscosity and performance.
- Component Mixing: Mix Component A and Component B strictly at a 1:1 weight ratio, stirring continuously until homogeneous.
- Vacuum Defoaming: Place the mixed compound in a vacuum container and defoam at 0.08MPa for 5 minutes, then proceed to potting.
- Curing Process: Pour the mixture into LED driver housings; cure at room temperature (4-5 hours) or heat (80-100℃ for 15 minutes). Extend curing time for thick applications.
Application Scenarios
This Electronic Potting Compound is specifically designed for LED drivers, including outdoor LED display drivers, LED lighting drivers, LED module drivers and power supply drivers. It protects internal components from water, dust and overheating, ensuring stable LED operation. For purchasers, it improves LED driver reliability, reduces failure rates, extends service life, lowers maintenance costs, and boosts competitiveness in the global LED market.
Customization Options
We provide full customization for LED driver requirements:
- Adjust curing hardness, viscosity and operating time to match different LED driver sizes and production processes.
- Optimize thermal conductivity and waterproof performance for high-power LED drivers or outdoor applications.
- Provide formulas beyond HY-9315 to meet specific technical needs (e.g., higher thermal conductivity).
- Support OEM & ODM services and flexible packaging (5kg, 20kg, 25kg, 200kg).
Certifications & Compliance
Our Electronic Potting Compound fully complies with EU RoHS standards, holding ISO 9001, CE certifications. It has UL94-V0 flame-retardant rating, stable batch performance, is non-toxic, non-hazardous and environmentally friendly, widely trusted by global LED driver manufacturers and suppliers.
FAQ
Q: Is this potting compound suitable for high-power LED drivers?
A: Yes. It has excellent thermal conductivity (≥0.8 W(m·K)), efficiently dissipating heat from high-power LED drivers, avoiding overheating and ensuring stable operation.
Q: How to speed up curing in winter?
A: Heat curing is recommended—80-100℃ for 15 minutes, which significantly shortens curing time compared to room temperature curing in cold environments.
Q: What is the shelf life of this potting compound?
A: Seal and store at below 25℃, shelf life is 1 year. It is non-hazardous and can be transported as general chemicals.
Q: Can it be used for outdoor LED display drivers?
A: Yes. It has IP65 waterproof rating, effectively preventing water and dust from entering, adapting to outdoor harsh environments.
Shenzhen Hong Ye Jie Technology Co., Ltd
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