Product Overview
Our Electronic Potting, also called potting glue or electronic glue, is specially developed for temperature sensor modules. As a professional supplier of liquid silicone and Thermally Conductive Potting Compound, we provide a reliable alternative to traditional Epoxy Potting Resin. This formula is tailored for sensor scenarios—excellent adhesion to PC, PMMA, PCB and metals (aluminum, copper, stainless steel), waterproof, dust-proof, anti-corrosion and shock-proof, effectively protecting sensor components without affecting temperature sensing accuracy, suitable for various temperature sensor module sizes and production processes. Technical Specifications
This is a high-performance electronic potting silicone (addition-curing and condensation-curing types available), with fully customizable parameters. Key properties:
- State before curing: Liquid colloid; Mixing: A/B components (weight ratio customizable), stir well before use to mix settled fillers
- Defoaming: 3 minutes at 0.01MPa in vacuum container after mixing, ensuring bubble-free encapsulation (critical for stable thermal conductivity)
- Curing: Room temperature or heating curing; Basic curing (for next process); Full curing: 24 hours (ambient temp/humidity affects speed)
- Temperature adaptability: -60℃ to 220℃ for long-term operation, adapts to extreme temperature detection scenarios
- Adhesion & Thermal Performance: Excellent bonding to metals and PCB; efficient thermal conductivity, ensuring accurate temperature transmission
- Customizable: Hardness, viscosity and operating time can be adjusted for different temperature sensor module requirements
Product Features & Advantages
- Precise Thermal Conductivity: Efficiently transmits temperature signals without interfering with sensor accuracy, ensuring reliable and accurate temperature detection of sensor modules.
- Ultra-Wide Temperature Adaptability: Stable operation from -60℃ to 220℃, adapts to high and low temperature detection scenarios, protecting sensors in extreme environments.
- Multi-Protection Performance: Integrates waterproof, moisture-proof, dust-proof, insulation and anti-corrosion functions, protecting sensor modules from harsh environmental damage.
- Strong Adhesion & Low Volatility: Excellent bonding to PCB and various metals, high structural strength, no cracking or detachment; low volatile content, no contamination to sensor components.
- Dual Curing Types: Addition-curing (fast curing, high precision) and condensation-curing (cost-effective), flexible selection for different production needs.
- Customizable & Easy to Operate: Adjustable parameters to match different sensor sizes; simple mixing and potting process, suitable for mass production.
How to Use (Step-by-Step)
- Pre-Mix Preparation: Fully stir Component A to evenly mix settled fillers, and shake Component B thoroughly to ensure uniform viscosity (critical for thermal conductivity and sensor accuracy).
- Component Mixing: Mix Component A and Component B strictly according to the specified weight ratio, stirring continuously until homogeneous.
- Vacuum Defoaming: Place the mixed compound in a vacuum container and defoam at 0.01MPa for 3 minutes to remove air bubbles, then proceed to potting.
- Curing Process: Pour the mixture into temperature sensor modules; cure at room temperature or heat. Proceed to the next process after basic curing, and ensure full curing (24 hours) for optimal protection and thermal performance.
Application Scenarios
This Electronic Potting is specifically designed for temperature sensor modules, including industrial temperature sensors, automotive temperature sensors, medical temperature sensors and environmental monitoring temperature modules. It encapsulates and protects sensor components, ensuring accurate temperature detection and stable operation. For purchasers, it improves sensor module reliability, reduces failure rates, ensures detection accuracy, lowers after-sales costs, and boosts competitiveness in the global temperature sensor market.
Customization Options
We provide full customization for temperature sensor module requirements:
- Adjust curing hardness, viscosity and operating time to match different sensor module sizes and production processes.
- Optimize thermal conductivity and temperature adaptability to meet specific temperature detection range needs.
- Provide both addition-curing and condensation-curing formulas to balance production efficiency and cost.
- Support OEM & ODM services and flexible packaging specifications to meet mass production needs of sensor manufacturers.
Certifications & Compliance
Our Electronic Potting meets international electronic and sensor industry standards, holding ISO 9001, CE, RoHS certifications. It has stable batch performance, is non-toxic, non-hazardous and environmentally friendly, with excellent anti-ozone and chemical corrosion resistance, widely trusted by global temperature sensor module manufacturers and suppliers.
FAQ
Q: Will this potting affect the temperature detection accuracy of the sensor?
A: No. It has precise thermal conductivity, which can efficiently transmit temperature signals without interfering with the sensor’s detection accuracy, ensuring reliable performance.
Q: What to do if the silicone layers after storage?
A: Stir Component A and B evenly separately before use; layering does not affect product performance, ensuring normal curing and thermal conductivity.
Q: Can it be customized for small-size temperature sensor modules?
A: Yes. We can adjust viscosity and operating time to match small-size modules, ensuring precise potting without damaging tiny sensor components.
Q: Is it suitable for high-temperature industrial sensor modules?
A: Yes. It has excellent high-temperature resistance (-60℃ to 220℃), adapting to high-temperature industrial environments, protecting sensors and ensuring stable detection.
Shenzhen Hong Ye Jie Technology Co., Ltd
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