HONG YE SILICONE Electronic Potting (Model HY-9315) is a high-performance Thermally Conductive Potting Compound designed for 5G base station equipment, a core Silicone raw material with excellent heat dissipation, flame retardancy and IP65 waterproofing. As a premiumElectronic Encapsulation Adhesive, this dual-component Addition Curing Silicone features 1:1 weight ratio, low viscosity and adjustable curing speed. Fully complying with ISO, CE, RoHS and UL94-V0 standards, it provides reliable protection for 5G base station components, ensuring stable operation under long-term high-load conditions, meeting global 5G communication manufacturer demands.
Product Overview
Our Electronic Potting is a low-viscosity, flame-retardant dual-component Silicone Potting Compound, specially engineered for 5G base station equipment—the core infrastructure of 5G communication networks. As a professional supplier of Thermally Conductive Potting Compound and Silicone Encapsulant, we optimize this product for 5G base station working conditions: it bonds perfectly to PC, PP, ABS, PVC and various metals, with excellent insulation, waterproof (IP65), flame retardancy and heat dissipation. It effectively protects 5G base station electronic components from moisture, dust, high temperature and mechanical impact, ensuring stable signal transmission and long-term reliable operation of 5G base stations. Technical Specifications
Our Electronic Potting (Model HY-9315) has stable performance with fully customizable parameters; key specifications are as follows: it is a dual-component addition-curing liquid silicone (A and B), both appearing as liquid with a viscosity of 500±100 cps. The mixing ratio of A and B components is 1:1 by weight, with mixed viscosity of 500±100 cps. Operating time is 0.5-2 hours, room-temperature curing takes 4-5 hours, and 80℃ curing takes 20 minutes. After curing, hardness is 15±5 Shore A, thermal conductivity ≥0.8 W(m·K), dielectric strength ≥25 kV/mm, dielectric constant 3.0~3.3 (1.2MHz), volume resistivity ≥1.0×10¹⁶ Ω·cm, linear expansion coefficient ≤2.2×10⁻⁴ m/(m·K), flame retardancy meets UL94-V0. Shelf life is 1 year (below 25℃), non-hazardous for general chemical transportation. Product Features & Advantages
- 5G-Dedicated High Thermal Conductivity: Thermal conductivity ≥0.8 W(m·K), efficiently dissipates heat generated by 5G base station components during long-term high-load operation, avoiding overheating and extending equipment service life.
- UL94-V0 Flame Retardancy: High-level flame retardancy, effectively preventing fire risks, complying with 5G communication equipment safety standards and ensuring operational safety.
- IP65 Waterproof & Dustproof: Excellent sealing performance, reaching IP65 waterproof grade, effectively isolating moisture and dust, adapting to outdoor 5G base station installation environments.
- Low Viscosity & Good Flowability: Easy to pour and fill complex 5G base station components, ensuring full encapsulation of tiny gaps and improving production efficiency.
- Wide Temperature Adaptability: Stable performance from -60℃ to 220℃, adapting to extreme temperature changes in outdoor environments, avoiding performance degradation in hot or cold weather.
- Superior Insulation & Impact Resistance: High dielectric strength and volume resistivity prevent short circuits; cured into soft rubber, with excellent impact resistance to protect fragile 5G components.
How to Use (Step-by-Step)
- Pre-Mix Preparation: Thoroughly stir Component A and Component B in their respective containers to ensure uniform viscosity; no stratification issue, ensuring consistent mixing effect.
- 1:1 Weight Mixing: Strictly mix Component A and Component B at a 1:1 weight ratio, stirring continuously until homogeneous to ensure optimal curing and thermal conductivity.
- Vacuum Defoaming: After mixing evenly, place the mixed glue in a vacuum container and defoam at 0.08MPa for 5 minutes to remove air bubbles, ensuring dense, bubble-free encapsulation.
- Curing Process: Pour the defoamed glue into 5G base station components. Cure at room temperature (4-5 hours) or heat (80-100℃ for 15-20 minutes); thick application may require longer curing time, especially in winter.
Application Scenarios
This Electronic Potting is specifically designed for 5G base station equipment, including 5G base station power modules, signal processing modules, communication control boards and outdoor 5G antenna components. It is also suitable for outdoor displays, power modules and complex electronic accessories. For 5G communication purchasers, it enhances 5G base station reliability, reduces failure rates caused by heat and moisture, extends service life, ensures stable signal transmission, lowers maintenance costs, and boosts competitiveness in the global 5G communication market.
Customization Options
We provide full customization for 5G base station equipment requirements:
- Adjust curing hardness, viscosity and operating time to match different 5G base station component sizes and production processes.
- Optimize thermal conductivity and flame retardancy to meet stricter 5G communication safety standards.
- Offer flexible packaging specifications (5kg, 20kg, 25kg, 200kg) to meet mass production and supply chain needs.
- Adjust curing speed to adapt to 5G base station mass production workflows, especially for winter low-temperature environments.
Certifications & Compliance
Our Electronic Potting meets international 5G communication and electronic industry standards, holding ISO 9001, CE and RoHS certifications, with flame retardancy meeting UL94-V0 standard. It fully complies with EU RoHS directives, with stable batch performance, non-toxic and environmentally friendly, undergoing strict quality testing to ensure consistency and reliability, widely trusted by global 5G communication manufacturers and suppliers.
Production Process
Our production process adheres to strict 5G-grade quality standards: selecting high-purity Silicone raw materials, precise mixing of A/B components, vacuum defoaming, strict viscosity and thermal conductivity testing, and sterile packaging. Each batch undergoes rigorous performance testing (heat dissipation, flame retardancy, waterproofing) to ensure it meets 5G base station equipment application requirements, demonstrating our strong production capacity and quality assurance system. FAQ
Q: Is this potting suitable for outdoor 5G base stations?
A: Yes. It reaches IP65 waterproof grade, with excellent dustproof and weather resistance, adapting to outdoor harsh environments, ensuring stable operation of 5G base station components.
Q: How to speed up curing in winter low-temperature environments?
A: It is recommended to cure at 80-100℃ for 15 minutes; this effectively shortens curing time, avoiding prolonged curing affecting production efficiency.
Q: Can it meet the high heat dissipation needs of 5G base stations?
A: Yes. Its thermal conductivity is ≥0.8 W(m·K), which can efficiently dissipate heat generated by 5G base stations during high-load operation, preventing component overheating.
Q: What is the shelf life and storage requirement?
A: Stored below 25℃, the shelf life is 1 year. Keep containers sealed, and it is non-hazardous, suitable for general chemical transportation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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