Product Overview
Our Electronic Potting Silicone is a high-performance two-component potting material tailored for Micro-Electromechanical Systems (MEMS), suitable for encapsulation, sealing, filling and pressure protection of MEMS’ PC, PMMA, PCB, CPU and tiny core electronic parts. As a leading Mold Making Silicone and liquid silicone manufacturer, we craft this product with high-purity Silicone raw materials, ensuring excellent adhesion, thermal stability and anti-microvibration performance. It provides comprehensive protection for MEMS components, extending their service life and ensuring stable operation in precision industrial, medical and consumer electronics environments. Key Features & Advantages
1. Precision protection & anti-microvibration: Excellent insulation, corrosion resistance, waterproof, moisture-proof, dust-proof and shockproof performance, effectively absorbing micro-vibrations and protecting MEMS chips and welding gold wires from high-temperature cycle stress.
2. Extreme environment adaptability: Operates stably from -60℃ to 220℃, with excellent ozone resistance and chemical erosion resistance, adapting to MEMS’ complex working conditions.
3. High reliability: Ultra-low volatile content, high strength and good adhesion, bonding excellently with aluminum, copper, stainless steel and other precision metals used in MEMS.
4. Dual curing options: Available as addition curing silicone and condensation curing silicone mold rubber, meeting different MEMS production needs.
5. Superior performance: Better flexibility and environmental adaptability than epoxy potting resin, consistent with our Platinum cured mold silicone quality control standards, ensuring long-term MEMS precision and stability. How to Use
1. Before mixing, fully stir Component A to evenly distribute settled fillers, and shake Component B thoroughly to ensure uniformity (critical for MEMS’ precision).
2. Mix Component A and B according to the specified weight ratio, stirring evenly to ensure consistent thermal conductivity and adhesion.
3. Degas as needed: Stir the mixed adhesive evenly, place in a vacuum container, degas at 0.01MPa for 3 minutes, then pour for use to avoid air bubbles in tiny MEMS components.
4. As an addition curing silicone product, it can be cured at room temperature or heated; proceed to the next process after basic curing, with full curing in 24 hours. Ambient temperature and humidity significantly affect curing speed, so strict control is recommended for MEMS manufacturing.
Application Scenarios
This Silicone Potting Compound is mainly used for encapsulation, sealing, filling and pressure protection of Micro-Electromechanical Systems (MEMS) electronic components, including MEMS PCB boards, CPUs, micro-sensors and control units. It has excellent adhesion and thermal stability for PC, PMMA, PCB and CPU, suitable for precision industrial, medical, automotive and consumer electronics MEMS systems. It ensures MEMS components operate stably in harsh environments, reduces failure risks, lowers maintenance costs and improves precision performance. It can be used with Rapid prototyping silicone to produce MEMS prototypes, accelerating R&D efficiency for MEMS manufacturers. Technical Specifications
Our electronic potting silicone for MEMS is available in addition and condensation curing types, with liquid colloid and good fluidity before curing (ideal for tiny MEMS gaps). It operates stably from -60℃ to 220℃, with excellent thermal conductivity, insulation and flame retardancy. Key parameters including curing hardness, viscosity, operating time and curing speed can be fully customized according to MEMS’ specific precision requirements, ensuring perfect adaptation to different MEMS production needs.
Certifications & Compliance
Our Electronic Potting Silicone meets international MEMS and precision electronics industry standards, backed by our factory’s ISO9001, CE and UL certifications. It undergoes strict quality testing (including anti-microvibration, temperature resistance, adhesion and low-volatility tests) to ensure compliance with the high-precision requirements of MEMS systems, gaining recognition from global MEMS procurement partners.
Customization Options
We provide MEMS-grade customization services. According to MEMS system requirements, we can adjust curing hardness, viscosity, operating time and curing speed to match tiny component specifications. As a professional manufacturer of silicone potting compound and liquid silicone, we also customize formulations to enhance anti-microvibration, low-volatility and thermal conductivity, adapting to the specific precision working environment of MEMS.
Packaging, Storage & Notes
Storage: Store sealed in a cool dry place; shelf life is 1 year at room temperature; non-hazardous, can be transported as general chemicals. Notes:
1. Use mixed adhesive at one time to avoid waste and ensure consistent performance for MEMS precision components.
2. Non-hazardous, but avoid contact with eyes and mouth; rinse with water if accidental contact occurs.
3. Stir evenly before use if stratification occurs, which does not affect product performance or MEMS compatibility.
FAQ
Q: Is this product suitable for Micro-Electromechanical Systems (MEMS)?
A: Yes, it has excellent anti-microvibration, low volatility and extreme temperature resistance, perfectly adapting to MEMS’ strict precision and reliability requirements.
Q: What materials can it bond with?
A: It has excellent adhesion to PC, PMMA, PCB, CPU and precision metals such as aluminum, copper and stainless steel used in MEMS.
Q: Can it be customized for MEMS needs?
A: Yes, curing hardness, viscosity, anti-microvibration performance and other parameters can be adjusted according to your specific MEMS requirements.
Q: What is its temperature resistance range?
A: It can operate stably from -60℃ to 220℃, adapting to MEMS’ complex working environments.
Q: How to store it properly?
A: Store sealed in a cool dry place, shelf life 1 year; non-hazardous for transportation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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