Product Overview
Our Electronic Potting Silicone is exclusively customized for hypersonic vehicle avionics systems, designed for encapsulation, sealing, filling and pressure protection of precision avionics components like flight control circuit boards, sensor modules and communication chips. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula to resist hypersonic airflow scouring, high-temperature thermal shock (from -60℃ to 220℃) and aerospace-grade chemical corrosion. The low-viscosity liquid penetrates tiny gaps of components, cures into a flexible and robust solid, and outperforms epoxy potting resin in thermal stress absorption and space environment adaptability, effectively protecting avionics signal stability and equipment service life.
Key Features & Advantages
- Extreme Environment Resistance: Outstanding waterproof, moisture-proof and anti-corrosion performance, resisting hypersonic airflow scouring, high-temperature ablation and aerospace chemical erosion.
- Wide Temperature Tolerance: Operates stably from -60℃ to 220℃, absorbing thermal cycling stress generated by hypersonic flight to protect chips and welding gold wires from damage.
- Superior Insulation & Thermal Management: High dielectric strength and volume resistivity avoid electrical interference, while excellent thermal conductivity dissipates heat generated by avionics work.
- Dual Curing Flexibility: Available as addition and Condensation Curing Silicone Mold Rubber, supporting room-temperature or heated curing to adapt to different avionics production lines.
- High Adhesion & Reliability: Excellent bonding strength to PC, PMMA, PCB, CPU and aerospace-grade aluminum, copper, stainless steel, preventing delamination in extreme flight environments; ultra-low volatile content avoids vacuum contamination in high-altitude conditions.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously for 2-3 minutes to ensure uniformity.
- Precision Mixing: Strictly follow a 1:1 weight ratio of Component A to B, stirring slowly and evenly for 3 minutes to avoid introducing air bubbles (critical for avionics component protection).
- Degassing (Optional): Place the mixed adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate bubbles, ensuring full penetration into tiny gaps of precision components.
- Curing: Pour the degassed mixture into avionics housings; cure at room temperature for 24 hours (full solidification) or accelerate via heating (80-100℃ for 15 minutes). Note: Temperature and humidity significantly affect curing speed, maintain 40-60% humidity for optimal results.
Application Scenarios
This specialized Silicone Potting Compound is exclusively for hypersonic vehicle avionics systems, including flight control avionics modules, attitude sensor electronics, communication circuit boards and navigation control units. It ensures uninterrupted signal transmission and stable operation of avionics under extreme hypersonic flight conditions, reduces maintenance costs of aerospace equipment, and is compatible with Rapid prototyping silicone to accelerate R&D of new hypersonic vehicle avionics devices. Technical Specifications
Curing Type: Addition-Curing (dual curing option); Mix Ratio (A:B): 1:1 (weight); Viscosity: 500±100 mPa·s (pre-mix); Curing Time: 24h (room temperature), accelerated via heating; Hardness (Shore A): Customizable (20-30±2); Thermal Conductivity: ≥0.2 W/(m·K); Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Operating Temp Range: -60℃ to 220℃; Bonding Substrates: PC, PMMA, PCB, CPU, aerospace-grade aluminum, copper, stainless steel. Customization of hardness, viscosity and operating time is available.
Certifications & Compliance
Our product complies with international aerospace standards: EU RoHS Directive (hazardous substance-free), ISO 9001 (strict quality control), CE Certification (European safety standards), and UL94-V1 flame retardancy, ensuring safety and reliability in hypersonic vehicle avionics systems, and gaining recognition from global aerospace procurement partners.
Customization Options
We offer aerospace-grade tailored solutions: custom formulations (adjust hardness, viscosity, thermal conductivity and curing speed), specialized adhesion optimization for hypersonic vehicle substrates, high-temperature resistant formula customization, and bulk packaging (5kg, 20kg, 25kg, 200kg metal/plastic barrels) for large-scale aerospace production orders.
Production Process & Quality Control
We implement a 5-step aerospace-grade quality control process: raw material purification (high-purity silicone screening), precision formulation (automated mixing for consistent silicone Potting Compound), performance testing (high-temperature resistance, thermal shock resistance, insulation, adhesion), curing verification, and sealed packaging. Our facility has a monthly capacity of over 500 tons, supporting large global hypersonic vehicle avionics orders. FAQ
Q: Can it resist the high temperature generated by hypersonic flight?
A: Yes, it operates stably from -60℃ to 220℃, absorbing thermal stress to protect avionics components from high-temperature damage. Q: Does it bond well with hypersonic vehicle avionics substrates?
A: Yes, it adheres excellently to aerospace-grade aluminum, copper, stainless steel and common avionics substrates, preventing delamination in extreme flight conditions. Q: Can the curing speed be adjusted for mass production?
A: Yes, dual curing options and customizable curing time optimize production efficiency for aerospace batch orders. Q: What is the shelf life?
A: 12 months when stored sealed in a cool, dry place (below 25℃). Q: Is it safe for transportation?
A: Yes, it is a non-hazardous chemical, compliant with general chemical transportation regulations.
Shenzhen Hong Ye Jie Technology Co., Ltd
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