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Home> Products> Electronic Potting Compound> Electronic Potting for Graphene-Based Sensors
Electronic Potting for Graphene-Based Sensors
Electronic Potting for Graphene-Based Sensors
Electronic Potting for Graphene-Based Sensors
Electronic Potting for Graphene-Based Sensors
Electronic Potting for Graphene-Based Sensors
Electronic Potting for Graphene-Based Sensors

Electronic Potting for Graphene-Based Sensors

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9305

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-4
Product Description
HONG YE SILICONE Electronic Potting Silicone for Graphene-Based Sensors is a high-performance two-component Addition Curing Silicone, also known as Electronic Potting Compound and Silicone Encapsulant, tailored for graphene-based sensors. Crafted from high-purity Silicone raw materials, it integrates high thermal conductivity, waterproof, moisture-proof, flame retardancy and high insulation, cures into a thin, low-interference protective layer after adding curing agent. With ultra-low volatile content and excellent adhesion to PC, PMMA, PCB and metals (aluminum, copper, stainless steel), it protects graphene sensor components, ensures high sensitivity and stable signal transmission, with customizable parameters to meet global industrial procurement demands.
 
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Product Overview

Our Electronic Potting Silicone is specialized for graphene-based sensors, designed for encapsulation, sealing, filling and pressure protection of their core electronic components and graphene sensing units. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high thermal conductivity and low signal interference, avoiding damage to delicate graphene structures while enhancing heat dissipation. It outperforms epoxy potting resin in flexibility and thermal conductivity, cures at room or elevated temperatures, and ensures reliable protection for sensor drivers, PCB boards and graphene sensing layers, extending product service life and reducing maintenance costs for sensor manufacturers.
 
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Key Features & Advantages

  1. High Thermal Conductivity & Heat Dissipation: Optimized formula with excellent thermal conductivity, efficiently dissipating heat generated by graphene sensor operation, avoiding overheating and ensuring stable sensitivity.
  2. Wide Temperature Adaptability: Operates stably from -60℃ to 220℃, withstanding extreme temperature fluctuations, absorbing thermal cycling stress to protect chips, welding gold wires and graphene sensing components.
  3. Comprehensive Protection & Low Interference: Waterproof, moisture-proof, dust-proof and anti-corrosion, resisting ozone and chemical erosion; low dielectric loss, avoiding interference with graphene sensor signal transmission.
  4. Friendly Curing Process: Addition-curing formula, no heat release, low shrinkage and no corrosion; supports room-temperature or heated curing, 24-hour full solidification, easy to operate and adapt to mass production.
  5. High Reliability & Customizability: As a professional Silicone Potting Compound manufacturer, it has high strength and excellent adhesion to sensor substrates; hardness, viscosity and thermal conductivity can be customized to match different graphene-based sensor models.

How to Use

  1. Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification which affects thermal conductivity and adhesion.
  2. Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly for 2-3 minutes to avoid introducing air bubbles that affect sensor protection and signal transmission.
  3. Degassing: After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of graphene-based sensor components.
  4. Curing: Pour the degassed mixture into component housings; cure at room temperature (full solidification in 24 hours) or heated to accelerate. Note: Environment temperature and humidity have a significant impact on curing speed.

Application Scenarios

This specialized silicone Potting Compound is exclusively for graphene-based sensors, including graphene gas sensors, pressure sensors, temperature sensors, humidity sensors and industrial graphene detection modules. It is suitable for encapsulation, sealing and filling of their core electronic components, PCB boards and graphene sensing layers, ensuring high sensitivity and stable operation in harsh industrial, environmental and medical environments. It reduces sensor failure rates, lowers production and maintenance costs, and is compatible withRapid prototyping silicone to accelerate R&D of new graphene-based sensor products.

Technical Specifications

Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (per requirements); Appearance: Transparent/opaque liquid (both A and B components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature Range: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Curing Time: 24 hours (room temperature), accelerated via heating; Bonding Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel; Thermal Conductivity: Customizable (≥0.4 W(m.k)). Hardness, viscosity and operation time can be fully customized.

Certifications & Compliance

Our Electronic Potting Silicone complies with international industrial standards: ISO 9001 (strict quality control), CE Certification (European safety standards), EU RoHS Directive (hazardous substance-free), ensuring safety and reliability for graphene-based sensor applications, gaining recognition from global industrial procurement partners.

Customization Options

We offer industrial-grade tailored solutions: custom formulations (adjust hardness, viscosity, thermal conductivity and dielectric loss), low-interference formula optimization, and flexible packaging options (5kg, 20kg, 25kg, 200kg) to meet large-scale production and small-batch customization needs of graphene-based sensor manufacturers.

Production Process & Quality Control

We implement a 5-step strict quality control process: raw material purification (high-purity silicone screening), precision formulation (automated mixing for consistent silicone potting compound), performance testing (thermal conductivity, signal interference, insulation, adhesion), curing verification, and sealed packaging. Our facility has a monthly capacity of over 500 tons, supporting large global graphene-based sensor orders.

FAQ

Q: Will it affect the sensitivity of graphene-based sensors?
A: No, it has low dielectric loss and low signal interference, protecting graphene components without reducing sensor sensitivity.
Q: Is it suitable for harsh environmental detection?
A: Yes, it has excellent waterproof, anti-corrosion and dust-proof performance, adapting to various harsh working conditions.
Q: What is the curing time?
A: 24 hours at room temperature, which can be accelerated by heating.
Q: What is the shelf life?
A: 12 months when stored sealed in a cool, dry place (below 25℃).
Q: How to handle stratified colloid?
A: Stir evenly before use, which will not affect product performance.
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