Product Overview
Our Electronic Potting Silicone is specialized for terahertz imaging systems, designed for encapsulation, sealing, waterproofing, fixing and flame-retardant protection of their core electronic components, power modules and signal control units. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high thermal conductivity and low signal interference, avoiding terahertz signal attenuation while efficiently dissipating heat. It outperforms epoxy potting resin in flexibility and temperature adaptability, cures quickly at elevated temperatures, and ensures reliable protection for terahertz detectors, PCB boards and control modules, extending product service life and reducing maintenance costs for imaging equipment manufacturers.
Key Features & Advantages
- High Thermal Conductivity & Efficient Heat Dissipation: Thermal conductivity ≥0.8 W(m·K), efficiently dissipating heat generated by terahertz imaging system operation, avoiding overheating and ensuring stable signal output.
- Excellent Flame Retardancy & Waterproof Performance: Flame retardancy reaches UL94-V0 grade, fully complying with EU RoHS directive; IP65 waterproof grade, providing excellent moisture-proof and waterproof protection for core components.
- Low Signal Interference & High Insulation: Low dielectric loss, no terahertz signal attenuation; high dielectric strength (≥25 kV/mm) and volume resistivity (≥1.0×10¹⁶ Ω·cm), ensuring safe and stable operation of electronic components.
- Friendly Curing Process: Addition-curing formula, low viscosity and good leveling; supports room-temperature (4-5 hours curing) or heated curing (80℃ for 20 minutes), with faster curing at higher temperatures, easy to operate and adapt to mass production.
- High Reliability & Customizability: As a professionalSilicone Potting Compound manufacturer, it has excellent adhesion to PC, PP, ABS, PVC and metals; hardness, viscosity and operation time can be customized to match different terahertz imaging system models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A and Component B in their respective containers to ensure uniform distribution of fillers and avoid stratification which affects performance.
- Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to B, stirring slowly and evenly to ensure consistent thermal conductivity and avoid introducing air bubbles.
- Degassing: After mixing, place the adhesive in a vacuum container at 0.08MPa for 5 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of terahertz imaging components.
- Curing: Pour the degassed mixture into component housings; cure at room temperature (4-5 hours) or heated (80-100℃ for 15-20 minutes). Note: Curing speed is affected by temperature; longer curing time is needed in winter, and heating curing is recommended for thick applications.
Application Scenarios
This specialized thermally conductive Potting Compound is exclusively for terahertz imaging systems, including industrial terahertz imaging equipment, medical terahertz scanners, security terahertz detectors and terahertz testing modules. It is suitable for encapsulation of their core electronic components, power modules and control boards, ensuring stable operation in industrial, medical and security environments. It reduces equipment failure rates, lowers production and maintenance costs, and is compatible with Rapid prototyping silicone to accelerate R&D of new terahertz imaging products. Technical Specifications
Model: HY-9315; Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight); Appearance: Liquid (both A and B components); Viscosity: 500±100 cps (each component), 500±100 cps (mixed); Operation Time: 0.5-2 hours; Curing Time: 4-5 hours (room temperature), 20 minutes (80℃); Hardness (Shore A): 15±5; Thermal Conductivity: ≥0.8 W(m·K); Dielectric Strength: ≥25 kV/mm; Dielectric Constant (1.2MHz): 3.0～3.3; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Linear Expansion Coefficient: ≤2.2×10⁻⁴ m/(m·K); Flame Retardancy: UL94-V0; Waterproof Grade: IP65. Other models and parameters are available; hardness, viscosity and operation time can be fully customized.
Certifications & Compliance
Our Electronic Potting Silicone complies with international industrial standards: ISO 9001 (strict quality control), CE Certification (European safety standards), EU RoHS Directive (hazardous substance-free), with UL94-V0 flame retardancy certification, meeting global terahertz imaging equipment requirements, gaining recognition from global procurement partners.
Customization Options
We offer industrial-grade tailored solutions: custom formulations (adjust hardness, viscosity, thermal conductivity and curing speed), low-signal-interference formula optimization, and flexible packaging options (5kg, 20kg, 25kg, 200kg) to meet large-scale production and small-batch customization needs of terahertz imaging system manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: raw material purification (high-purity silicone screening), precision formulation (automated mixing for consistentsilicone potting compound), performance testing (thermal conductivity, flame retardancy, insulation, adhesion), curing verification, and sealed packaging. Our facility has a monthly capacity of over 500 tons, supporting large global terahertz imaging system orders.
FAQ
Q: Will it affect terahertz signal transmission?
A: No, it has low dielectric loss, avoiding signal attenuation and ensuring stable terahertz imaging.
Q: What is the curing time under different temperatures?
A: 4-5 hours at room temperature, 20 minutes at 80℃, and 15 minutes at 80-100℃.
Q: Is it suitable for outdoor terahertz equipment?
A: Yes, it has IP65 waterproof grade and excellent environmental adaptability.
Q: What is the shelf life?
A: 12 months when stored sealed in a cool, dry place (below 25℃).
Q: Can it be customized for thick application scenarios?
A: Yes, we can adjust the formula to extend curing time and ensure full solidification for thick applications.
Shenzhen Hong Ye Jie Technology Co., Ltd
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