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Home> Products> Electronic Potting Compound> Electronic Potting for Cryogenic Quantum Processors
Electronic Potting for Cryogenic Quantum Processors
Electronic Potting for Cryogenic Quantum Processors
Electronic Potting for Cryogenic Quantum Processors
Electronic Potting for Cryogenic Quantum Processors
Electronic Potting for Cryogenic Quantum Processors
Electronic Potting for Cryogenic Quantum Processors

Electronic Potting for Cryogenic Quantum Processors

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9325

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound
Product Description
HONG YE SILICONE Electronic Potting Silicone for Cryogenic Quantum Processors is a high-performance two-component RTV silicone, also known as Electronic Potting Compound, Silicone Encapsulant and waterproof insulating electronic silicone, tailored for cryogenic quantum processors. Crafted from high-purity Silicone raw materials, it is a low-viscosity, room-temperature vulcanizing potting adhesive (Model HY-9325), complying with EU RoHS directive. With excellent cryogenic resistance, high insulation and UL94-V1 flame retardancy, it protects quantum processor components in ultra-low temperature environments, ensures stable signal transmission, and has customizable parameters to meet global quantum technology procurement demands.
 
HY-SILICONE company

Product Overview

Our Electronic Potting Silicone is specialized for cryogenic quantum processors, designed for encapsulation, waterproofing, insulation and sealing of their core electronic components, circuit boards and quantum modules. As a leading manufacturer ofliquid silicone and Addition Curing Silicone, we optimize the formula for ultra-low temperature adaptability and low signal interference, avoiding component damage and quantum signal attenuation in cryogenic environments. It outperforms epoxy potting resin in flexibility and cryogenic stability, flows well to fill tiny gaps, cures quickly at room temperature, and ensures reliable protection for cryogenic quantum processors, extending product service life and reducing R&D and maintenance costs for quantum technology manufacturers.
 
electronic potting

Key Features & Advantages

  1. Excellent Cryogenic Adaptability: Optimized formula for ultra-low temperature stability, operating reliably in cryogenic quantum processor environments, avoiding brittleness or performance degradation, perfectly matching the working conditions of quantum components.
  2. High Insulation & Flame Retardancy: Dielectric strength ≥25 kV/mm, volume resistivity ≥1.0×10¹⁶ Ω·cm, ensuring safe insulation of quantum circuits; flame retardancy reaches UL94-V1 grade, enhancing equipment safety.
  3. Low Viscosity & Easy Potting: Low viscosity (500±100 cps), good fluidity, able to fill tiny gaps of quantum processor components, realizing full encapsulation and protection of precision parts.
  4. Fast Room-Temperature Curing: Room-temperature vulcanizing type, 3-5 minutes initial curing and 24 hours full curing, no need for high-temperature heating, avoiding damage to sensitive quantum components.
  5. High Reliability & Customizability: As a professional Silicone Potting Compound manufacturer, it has excellent adhesion to PC, PP, ABS, PVC and metals; hardness, viscosity and operation time can be customized to match different cryogenic quantum processor models.

How to Use

  1. Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled black pigment, and shake Component B vigorously to ensure uniformity, avoiding stratification which affects insulation and adhesion.
  2. Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to B, stirring slowly and evenly to ensure consistent performance and avoid introducing air bubbles.
  3. Degassing: After mixing, place the adhesive in a vacuum container at 0.08MPa for 3 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of quantum processor components.
  4. Curing: Pour the degassed mixture into component housings; cure at room temperature, enter the next process after initial curing (3-5 minutes), and ensure 24 hours full curing. Note: Environment temperature and humidity have a significant impact on curing speed.

Application Scenarios

This specialized silicone Potting Compound is exclusively for cryogenic quantum processors, including lab-scale cryogenic quantum processors, quantum computing modules, quantum sensor components and low-temperature quantum control systems. It is suitable for encapsulation, waterproofing and insulation of their core electronic components and circuit boards, ensuring stable operation in ultra-low temperature quantum environments. It reduces equipment failure rates, lowers R&D and maintenance costs, and is compatible with Rapid prototyping silicone to accelerate R&D of new quantum processor products.

Technical Specifications

Model: HY-9325; Curing Type: Room-Temperature Vulcanizing; Mix Ratio (A:B): 1:1 (weight); Appearance: Viscous liquid (both A and B components); Viscosity: 500±100 cps; Operation Time: 30-120 minutes; Curing Time: 3-5 minutes (initial), 24 hours (full); Hardness (Shore A): 25±2; Thermal Conductivity: ≥0.2 W(m·K); Dielectric Strength: ≥25 kV/mm; Dielectric Constant (1.2MHz): 3.0~3.3; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Flame Retardancy: UL94-V1. Other models and parameters are available; hardness, viscosity and operation time can be fully customized.

Certifications & Compliance

Our Electronic Potting Silicone complies with international quantum technology and industrial standards: ISO 9001 (strict quality control), CE Certification (European safety standards), EU RoHS Directive (hazardous substance-free), meeting global cryogenic quantum processor safety and environmental protection requirements, gaining recognition from global quantum technology procurement partners.

Customization Options

We offer quantum-grade tailored solutions: custom formulations (adjust hardness, viscosity, cryogenic resistance and curing speed), low-signal-interference formula optimization, and flexible packaging options (5kg, 20kg, 25kg, 200kg in iron barrels; 20kg in plastic barrels) to meet large-scale production and small-batch customization needs of cryogenic quantum processor manufacturers.

Production Process & Quality Control

We implement a 5-step strict quality control process: raw material purification (high-purity silicone screening), precision formulation (automated mixing for consistent silicone potting compound), performance testing (cryogenic resistance, insulation, flame retardancy, adhesion), curing verification, and sealed packaging. Our facility has a monthly capacity of over 500 tons, supporting large global cryogenic quantum processor orders.

FAQ

Q: Is it suitable for ultra-low temperature environments of quantum processors?
A: Yes, it has excellent cryogenic adaptability, operating stably in cryogenic conditions without performance degradation.
Q: Will it interfere with quantum signal transmission?
A: No, it has low dielectric loss, avoiding signal attenuation and ensuring stable quantum operation.
Q: What is the shelf life?
A: 12 months when stored sealed in a cool, dry place.
Q: How to handle stratified colloid?
A: Stir evenly before use, which will not affect product performance.
Q: Is it safe for sensitive quantum components?
A: Yes, it is non-toxic, non-hazardous, and cures at room temperature, avoiding damage to sensitive parts.
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