Product Overview
Our Electronic Potting Silicone is specialized for plasma etching equipment, designed for encapsulation, sealing, filling and pressure protection of their core electronic components, control modules and sensor units. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for plasma etching scenarios, enhancing plasma corrosion resistance and ultra-low outgassing performance to adapt to high-vacuum, high-temperature working conditions. It outperforms epoxy potting resin in flexibility and chemical stability, cures at room or elevated temperatures, and ensures reliable protection for plasma etching components, extending service life and reducing equipment failure rates for semiconductor manufacturers.
Key Features & Advantages
- Excellent Plasma Corrosion Resistance: Special optimized formula resists erosion from plasma etching gases, preventing material degradation and insulation failure, ensuring long-term stability in semiconductor-grade plasma environments.
- Ultra-Low Outgassing: Meets semiconductor industry outgassing standards, no harmful volatile substances released in high-vacuum environments, avoiding contamination of etching chambers and precision components.
- Extreme Temperature Stability: Operates stably from -60℃ to 220℃, withstanding high-temperature cycles during plasma etching, absorbing internal stress to protect chips and welding gold wires from damage.
- Low Volatility & Strong Adhesion: Ultra-low volatile content, non-toxic and environmentally friendly; strong adhesion to PC, PMMA, PCB and various metals, ensuring tight sealing and no peeling in long-term high-vacuum operation.
- Flexible Curing & Customizability: Addition-curing formula, supporting room-temperature or heated curing (full curing in 24 hours); as a professional Silicone Potting Compound manufacturer, we can customize hardness, viscosity and operation time to match different plasma etching equipment models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification which affects corrosion resistance and outgassing performance.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly for 2-3 minutes to avoid introducing air bubbles that affect sealing and vacuum compatibility.
- Degassing: After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of plasma etching components.
- Curing: Pour the degassed mixture into component housings; cure at room temperature or heated to accelerate, enter the next process after basic curing, and ensure 24 hours full curing. Note: Environment temperature and humidity have a significant impact on curing speed.
Application Scenarios
This specialized silicone Potting Compound is exclusively for plasma etching equipment, including semiconductor wafer etching machines, flat-panel display plasma etching systems and microelectronic component etching devices. It is suitable for encapsulation, sealing and filling of their core electronic components, PCB boards and sensor connections, ensuring stable operation in high-vacuum, high-temperature and corrosive plasma environments. It reduces equipment maintenance costs, improves production efficiency, and is compatible with Rapid prototyping silicone to accelerate R&D of new plasma etching equipment. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (per requirements); Appearance: Liquid (both A and B components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature Range: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Curing Time: 24 hours (room temperature), accelerated via heating; Bonding Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel; Plasma Corrosion Resistance: Excellent; Outgassing Rate: Meets semiconductor industry standards. Hardness, viscosity and operation time can be fully customized.
Certifications & Compliance
Our Electronic Potting Silicone complies with international semiconductor and industrial standards: ISO 9001 (strict quality control), CE Certification (European safety standards), EU RoHS Directive (hazardous substance-free), meeting global plasma etching equipment safety and performance requirements, gaining recognition from global semiconductor procurement partners.
Customization Options
We offer semiconductor-grade tailored solutions: custom formulations (adjust plasma corrosion resistance, outgassing rate and curing speed), vacuum compatibility optimization, and flexible packaging options to meet large-scale production and small-batch customization needs of plasma etching equipment manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: raw material purification (high-purity silicone screening), precision formulation (automated mixing for consistent silicone potting compound), performance testing (plasma corrosion resistance, insulation, outgassing rate, adhesion), curing verification, and sealed packaging. Our facility has a monthly capacity of over 500 tons, supporting large global plasma etching equipment orders.
FAQ
Q: Is it suitable for long-term use in plasma etching environments?
A: Yes, it has excellent plasma corrosion resistance and ultra-low outgassing, maintaining stable performance in long-term high-vacuum operation.
Q: Can it avoid contamination of etching chambers?
A: Yes, its ultra-low outgassing rate meets semiconductor standards, preventing chamber contamination.
Q: What is the curing time?
A: 24 hours at room temperature, which can be accelerated by heating.
Q: What is the shelf life?
A: 12 months when stored sealed in a cool, dry place.
Q: How to handle stratified colloid?
A: Stir evenly before use, which will not affect product performance.
Shenzhen Hong Ye Jie Technology Co., Ltd
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