HONG YE SILICONE Electronic Potting Silicone for Atmospheric Entry Probes is a space-grade two-component Addition Curing Silicone, also known as High transparency mold silicone and Silicone Encapsulant, tailored for atmospheric entry probe equipment. Crafted from high-purity Silicone raw materials, it features 1:1 weight mixing ratio, high transmittance (95% at 450nm), excellent high-temperature resistance (-50-250℃), and good fluidity. It cures deeply quickly, with strong adhesion to precision components, protecting core probe parts from thermal shock and radiation, supporting full parameter customization to meet global aerospace equipment procurement demands (around 195 characters).
Product Overview
Our Electronic Potting Silicone is specially developed for atmospheric entry probes, dedicated to encapsulating, sealing and protecting their core electronic components, optical detection modules, signal transmitters and PCB boards. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for extreme atmospheric entry scenarios, enhancing high-temperature impact resistance and UV resistance to adapt to harsh conditions like high-speed friction heating, intense radiation and pressure changes. Compared with epoxy potting resin, it has better transparency, flexibility and thermal stability, supports fast deep curing, and ensures long-term reliable protection for probe components, reducing space mission failure risks for aerospace manufacturers.
Key Features & Advantages
- Superior High Transparency: Transmittance up to 95% at 450nm (2mm thickness), refractive index 1.41, ensuring unobstructed light transmission for probe optical detection modules, guaranteeing accurate data collection during atmospheric entry.
- Extreme Temperature Resistance: Operates stably from -50℃ to 250℃, withstanding sudden thermal shock caused by high-speed atmospheric entry friction, avoiding material deformation or performance degradation.
- Excellent Fluidity & Fast Deep Curing: Low viscosity (500±100 mPa.s for both components), good fluidity, able to penetrate tiny gaps of probe components; cures deeply quickly, improving production efficiency of probe manufacturing.
- Environmental & Radiation Resistance: Solvent-free addition-curing formula, non-polluting; excellent UV and cosmic radiation resistance, avoiding material aging in harsh space and atmospheric environments.
- Flexible Curing & Customizability: 1:1 weight mixing ratio, easy to operate; curing speed adjustable by temperature; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity and operation time to match different atmospheric entry probe models.
How to Use
- Pre-Mix Preparation: Mix Component A and Component B in a dry container, stir evenly, then let stand for defoaming or vacuum degassing to remove air bubbles, ensuring no bubbles affect encapsulation effect.
- Component Preparation: Clean the probe components to be encapsulated thoroughly, dry them completely (ensure no moisture remains on precision parts), then pour the mixed adhesive to fully infiltrate the components.
- Curing: Place the encapsulated components into an oven for curing; adjust curing speed by changing temperature—higher temperature accelerates curing, ensuring full curing to achieve optimal protection performance.
Application Scenarios
This specialized silicone Potting Compound is exclusively for atmospheric entry probes, including planetary atmospheric entry probes, meteorological detection probes, space exploration entry modules and aerospace optical detection equipment. It is suitable for encapsulating core electronic components, optical lenses, signal transmission modules and PCB boards, ensuring stable operation during atmospheric entry, data collection and transmission. It improves probe reliability, guarantees detection accuracy, and is compatible with Rapid prototyping silicone to accelerate new atmospheric entry probe R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Colorless Transparent Liquid (both components); Viscosity: 500±100 mPa.s (each component); Hardness (Shore A): 20±3; Refractive Index: 1.41; Transmittance (450nm): 95% (2mm); Volume Resistivity: 1.0×10¹⁵ Ω·cm; Thermal Expansion Coefficient (CTE): 280 ppm/℃; Operating Temperature: -50℃ to 250℃; Curing Speed: Adjustable by temperature; Shelf Life: 12 months; Packaging: Customizable. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Silicone complies with international aerospace, industrial and safety standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive (hazardous substance-free), meeting global atmospheric entry probe safety and performance requirements, trusted by global aerospace equipment procurement partners.
Customization Options
We provide space-grade tailored solutions: custom formulations (adjust transparency, high-temperature resistance and curing speed), viscosity optimization for tiny gap penetration, and flexible packaging to meet large-scale production and small-batch customization needs of atmospheric entry probe manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (transparency, high-temperature resistance, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for large global aerospace orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when stored in a cool, dry place.
FAQ
Q: Is it suitable for planetary atmospheric entry probes?
A: Yes, it has excellent high-temperature impact and radiation resistance, adapting to extreme atmospheric entry environments.
Q: What is the transmittance?
A: 95% at 450nm (2mm thickness), ensuring unobstructed optical detection.
Q: How to adjust curing speed?
A: Change curing temperature—higher temperature accelerates curing.
Q: Shelf life?
A: 12 months when sealed and stored in a cool, dry place.
Q: What substances should be avoided?
A: Avoid contact with oxygen, phosphorus, sulfur, peroxides and metal compounds (lead, tin, cadmium) to prevent curing failure.
Shenzhen Hong Ye Jie Technology Co., Ltd
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