Product Overview
Our Electronic Potting Compound is specially developed for quantum sensors, dedicated to encapsulating, sealing, waterproofing and insulating its core electronic components, quantum detection modules, signal processing boards and PCB boards. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for quantum sensing scenarios, enhancing low signal interference and environmental stability to adapt to the ultra-high precision, low-disturbance requirements of quantum detection. Compared withepoxy potting resin, it has better flexibility, minimal volatile content and excellent thermal stability, supports fast curing, and ensures long-term reliable protection for sensor components, reducing failure rates and maintenance costs for scientific research institutions and quantum equipment manufacturers.
Key Features & Advantages
- Ultra-Low Signal Interference: Optimized formula with low dielectric loss and high insulation, avoiding electromagnetic interference with quantum sensing signals, ensuring the ultra-high detection accuracy of quantum sensors.
- Superior Environmental Adaptability: Operates stably from -60℃ to 220℃, with excellent waterproof, moisture-proof and dust-proof performance, resisting ozone and chemical erosion, adapting to laboratory, industrial and outdoor quantum detection environments.
- High Insulation & Strong Adhesion: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent insulation performance, protecting sensitive electronic components from short circuits; strong adhesion to PC, PMMA, PCB and metals (aluminum, copper, stainless steel), ensuring tight sealing and structural stability.
- Low Viscosity & Flexible Curing: Low viscosity, good fluidity, able to penetrate tiny gaps of quantum sensor components; addition-curing formula, cures at room or heated temperatures, fully cured in 24 hours, easy to operate and improve production efficiency.
- Low Volatility & Customizability: Minimal volatile content, no harmful substances released, avoiding contamination of quantum detection environments; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity and operation time to match different quantum sensor models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects signal compatibility and adhesion.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that affect sealing and signal stability.
- Degassing: After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of sensor components.
- Curing: Pour the degassed mixture into component housings; cure at room temperature or heat to accelerate, enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized silicone potting compound is exclusively for quantum sensors, including laboratory quantum magnetometers, quantum accelerometers, quantum gyroscopes and high-precision quantum detection equipment. It is suitable for encapsulating core electronic components, PCB boards, sensitive detection modules and signal connectors, ensuring stable operation in scientific research laboratories, quantum technology facilities and precision measurement fields. It improves quantum sensor stability, guarantees detection accuracy, and is compatible withRapid prototyping silicone to accelerate new quantum equipment R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Transparent/Translucent Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Signal Interference: Ultra-low; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international quantum technology, industrial and safety standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive (hazardous substance-free), meeting global quantum sensor safety and performance requirements, trusted by global quantum equipment procurement partners.
Customization Options
We provide quantum-grade tailored solutions: custom formulations (adjust signal interference resistance, viscosity and curing speed), low-viscosity optimization for tiny gap penetration, and flexible packaging to meet large-scale production and small-batch customization needs of quantum sensor manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (signal compatibility, insulation, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for large global quantum equipment orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when stored in a cool, dry place.
FAQ
Q: Is it suitable for laboratory quantum sensors?
A: Yes, it has ultra-low signal interference and low volatility, adapting to ultra-high precision quantum detection environments.
Q: Will it affect quantum detection accuracy?
A: No, its low dielectric loss and high stability ensure no signal interference, guaranteeing detection precision.
Q: What is the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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