Product Overview
Our Electronic Potting Compound is specially developed for Microbolometer Arrays, dedicated to encapsulating, sealing, thermally conducting and insulating its core electronic components, microbolometer chips, signal processing boards and PCB substrates. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for microbolometer scenarios, enhancing thermal conductivity and low stress to adapt to the ultra-high sensitivity, low-noise requirements of thermal imaging detection. Compared with epoxy potting resin, it has minimal volatile content, excellent temperature adaptability, no exotherm during curing, and can absorb internal stress, ensuring long-term reliable protection for microbolometer components, reducing failure rates and maintenance costs for thermal imaging equipment manufacturers.
Key Features & Advantages
- Excellent Thermal Conductivity & Heat Dissipation: Optimized thermally conductive formula, efficiently transferring heat generated by microbolometer arrays during operation, avoiding overheating and ensuring stable detection performance and extended component service life.
- Low Stress & High Sensitivity Protection: Flexible cured texture, effectively absorbing thermal stress and mechanical stress, avoiding damage to sensitive microbolometer chips and welding gold wires, ensuring high detection sensitivity and accuracy.
- Superior Insulation & Environmental Adaptability: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent dielectric strength (≥25 kV/mm), isolating external electromagnetic interference; waterproof, moisture-proof and dust-proof, adapting to harsh outdoor and industrial thermal imaging environments (-60℃ to 220℃).
- Low Viscosity & Flexible Curing: Low viscosity, good fluidity, able to penetrate tiny gaps of microbolometer components; addition-curing formula, cures at room or heated temperatures, fully cured in 24 hours, easy to operate and improve production efficiency.
- Strong Adhesion & Customizability: Strong adhesion to PC, PMMA, PCB, aluminum, copper and other metals, ensuring tight sealing; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity, thermal conductivity and operation time to match different microbolometer array models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects thermal conductivity and adhesion.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that affect heat dissipation and sealing.
- Degassing: After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of microbolometer components.
- Curing: Pour the degassed mixture into component housings; cure at room temperature or heat to accelerate, enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specialized silicone potting compound is exclusively for Microbolometer Arrays, including thermal imaging cameras, infrared detection modules, industrial temperature sensors and medical thermal imaging equipment. It is suitable for encapsulating microbolometer chips, PCB substrates, signal connectors and electronic components, ensuring stable operation in outdoor surveillance, industrial temperature monitoring, medical diagnosis and aerospace thermal detection fields. It improves microbolometer array stability, guarantees detection accuracy, and is compatible with Rapid prototyping silicone to accelerate new thermal imaging product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Transparent/Translucent Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Thermal Conductivity: Customizable; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international thermal imaging equipment, industrial and safety standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive (hazardous substance-free), meeting global Microbolometer Arrays safety and performance requirements, trusted by global thermal imaging equipment procurement partners.
Customization Options
We provide precision-tailored solutions: custom formulations (adjust thermal conductivity, hardness and curing speed), low-viscosity optimization for tiny gap penetration, and flexible packaging to meet large-scale production and small-batch customization needs of microbolometer array manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (thermal conductivity, insulation, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for large global thermal imaging equipment orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when stored in a cool, dry place.
FAQ
Q: Is it suitable for thermal imaging microbolometer arrays?
A: Yes, it has excellent thermal conductivity and low stress, adapting to high-sensitivity thermal imaging detection environments.
Q: Will it affect microbolometer detection accuracy?
A: No, its low interference and stress-absorbing performance ensure stable, accurate thermal detection.
Q: What is the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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