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Home> Products> Electronic Potting Compound> Electronic Potting for Quantum Key Distribution
Electronic Potting for Quantum Key Distribution
Electronic Potting for Quantum Key Distribution
Electronic Potting for Quantum Key Distribution
Electronic Potting for Quantum Key Distribution
Electronic Potting for Quantum Key Distribution
Electronic Potting for Quantum Key Distribution

Electronic Potting for Quantum Key Distribution

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9315

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Product Description
HONG YE SILICONE Electronic Potting Compound for Quantum Key Distribution (QKD) is a high-performance two-componentAddition Curing Silicone, also known as Thermally Conductive Potting Compound and Silicone Encapsulant, tailored for QKD equipment. Crafted from high-purity Silicone raw materials, it features 1:1 weight mixing ratio, low viscosity (500±100 cps), UL94-V0 flame retardancy, thermal conductivity ≥0.8 W(m·K), and temperature adaptability (-60℃ to 220℃). It cures at room or heated temperatures, adheres well to PC, PP, ABS, PVC and metals, protecting QKD core components, ensuring signal integrity, complying with EU RoHS, and supporting full parameter customization (around 198 characters).
 
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Product Overview

Our Electronic Potting Compound (HY-9315) is specially developed for Quantum Key Distribution (QKD) systems, dedicated to encapsulating, sealing, thermally conducting and insulating QKD core components, quantum signal modulators, encryption modules, PCB substrates and power units. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for QKD scenarios, enhancing ultra-low electromagnetic interference and high insulation to adapt to the ultra-high precision, low-noise requirements of quantum encryption systems. Compared with epoxy potting resin, it has low viscosity, excellent flowability, no exotherm during curing, and IP65 waterproof grade, ensuring long-term reliable protection for QKD components and reducing signal interference.
 
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Key Features & Advantages

  1. Ultra-Low Electromagnetic Interference: Optimized formula with minimal electromagnetic permeability, avoiding interference with quantum signal transmission and encryption integrity, ensuring stable operation of QKD systems and secure key distribution.
  2. Excellent Thermal Conductivity & Heat Dissipation: Thermal conductivity ≥0.8 W(m·K), efficiently transferring heat generated by QKD electronic components, avoiding overheating-induced signal distortion, and extending component service life.
  3. High Flame Retardancy & Waterproof Performance: Flame retardancy meets UL94-V0 standard, ensuring safe operation; IP65 waterproof and dustproof grade, effectively isolating moisture and dust, adapting to complex indoor and outdoor QKD deployment environments.
  4. Low Viscosity & Flexible Curing: Low viscosity (500±100 cps) with good flowability, penetrating tiny gaps of QKD components; 1:1 weight ratio, easy to operate; cures at room (4-5 hours) or 80℃ (20 minutes), fully cured in 8 hours at room temperature, improving production efficiency.
  5. Strong Adhesion & Customizability: Excellent adhesion to PC, PP, ABS, PVC and metals; as a professional Silicone Potting Compound manufacturer, we customize hardness (15±5 Shore A), viscosity, operation time (0.5-2 hours) and thermal conductivity to match different QKD system models.

How to Use

  1. Pre-Mix Preparation: Thoroughly stir Component A and Component B in their respective containers to ensure uniform mixing, avoiding stratification that affects thermal conductivity and signal compatibility.
  2. Precision Mixing: Strictly follow the 1:1 weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause signal interference.
  3. Degassing: After mixing, place the adhesive in a vacuum container at 0.08MPa for 5 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of QKD components.
  4. Curing: Pour the degassed mixture into component housings; cure at room temperature (4-5 hours basic curing) or 80-100℃ (15 minutes) for faster curing. Note: Curing time extends for thick applications; winter curing is recommended to be heated.

Application Scenarios

This specialized thermally conductive potting compound is exclusively for Quantum Key Distribution (QKD) systems, including QKD encryption terminals, quantum signal modulators, outdoor QKD communication equipment and laboratory quantum security devices. It is suitable for encapsulating QKD core electronic components, PCB substrates, power modules and signal connectors, ensuring stable operation in quantum communication, government security, financial encryption and aerospace fields. It enhances QKD system stability, guarantees signal security, and is compatible with Rapid prototyping silicone to accelerate new QKD product R&D.

Technical Specifications

Model: HY-9315; Curing Type: Addition-Curing; Mix Ratio (A:B): 1:1 (weight ratio); Appearance: Liquid (both components); Viscosity: 500±100 cps (each component), 500±100 cps (mixed); Operation Time: 0.5-2 hours; Curing Time: 4-5 hours (room temperature), 20 hours (80℃); Hardness (Shore A): 15±5; Thermal Conductivity: ≥0.8 W(m·K); Dielectric Strength: ≥25 kV/mm; Dielectric Constant (1.2MHz): 3.0~3.3; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Flame Retardancy: UL94-V0; Waterproof Grade: IP65; Bonding Substrates: PC, PP, ABS, PVC, metals; Compliance: EU RoHS; Shelf Life: 12 months (25℃以下); Packaging: 5kg, 20kg, 25kg, 200kg. All parameters are customizable.

Certifications & Compliance

Our Electronic Potting Compound complies with international quantum communication, industrial and safety standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, flame retardancy UL94-V0, meeting global QKD system safety and performance requirements, trusted by global quantum equipment procurement partners.

Customization Options

We provide QKD-specific tailored solutions: custom formulations (adjust electromagnetic interference performance, thermal conductivity and curing speed), viscosity optimization for tiny gap penetration, and flexible packaging to meet large-scale production and small-batch customization needs of QKD manufacturers.

Production Process & Quality Control

We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (thermal conductivity, insulation, flame retardancy), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for large global QKD orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when stored in a cool, dry place.

FAQ

Q: Is it suitable for outdoor QKD communication equipment?
A: Yes, it has IP65 waterproof grade and UL94-V0 flame retardancy, adapting to outdoor environments.
Q: Will it interfere with quantum signal transmission?
A: No, its ultra-low electromagnetic interference ensures signal integrity.
Q: What’s the mixing ratio?
A: 1:1 weight ratio, easy to operate.
Q: Shelf life?
A: 12 months when stored below 25℃ in sealed condition.
Q: How to speed up winter curing?
A: Heat at 80-100℃ for 15 minutes for faster curing.
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