Product Overview
Our Electronic Potting Compound is specially developed for Multi-Gigabit Transceivers, dedicated to encapsulating, sealing, insulating and heat-dissipating transceiver chips, optical modules, PCB substrates, signal interfaces and data transmission components. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for high-speed optical communication scenarios, enhancing low signal interference, high thermal conductivity and miniaturization adaptability to adapt to the ultra-high-speed, high-precision, small-size requirements of multi-gigabit transceivers. Compared with epoxy potting resin, it has minimal volatile content, excellent temperature adaptability, no exotherm during curing, and absorbs thermal stress, ensuring long-term reliable operation of transceiver components and stable multi-gigabit signal transmission.
Key Features & Advantages
- Low Signal Interference & High Transmission Stability: Optimized formula with ultra-low dielectric loss and minimal electromagnetic interference, avoiding signal attenuation and distortion during high-speed data transmission, ensuring stable multi-gigabit signal transmission efficiency for transceivers.
- Superior Thermal Conductivity & Temperature Resistance: Stable performance from -60℃ to 220℃, withstanding temperature fluctuations during transceiver operation; excellent heat dissipation performance, quickly transferring heat generated by high-speed chips, avoiding overheating and extending component service life.
- High Insulation & Miniaturization Adaptability: High volume resistivity (≥1.0×10¹⁶ Ω·cm), excellent dielectric strength, isolating internal and external interference; low viscosity and good fluidity, perfectly adapting to the small-size, dense-component structure of multi-gigabit transceivers, penetrating tiny gaps.
- Low Volatility & Flexible Curing: Minimal volatile content, no harmful volatiles during curing, ensuring the cleanliness of transceiver internal components; addition-curing formula, cures at room or heated temperatures, fully cured in 24 hours, easy to operate and improve production efficiency.
- Strong Adhesion & Customizability: Excellent adhesion to PC, PMMA, PCB, aluminum, copper and other metals, ensuring tight sealing of transceiver components; as a professional Silicone Potting Compound manufacturer, we customize hardness, viscosity, operation time and thermal conductivity to match different multi-gigabit transceiver models.
How to Use
- Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification that affects insulation and signal interference performance.
- Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly to ensure full integration without air bubbles that cause signal attenuation and affect transmission stability.
- Degassing: After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of multi-gigabit transceiver components.
- Curing: Pour the degassed mixture into component housings; cure at room temperature or heat to accelerate, enter the next process after basic curing, and ensure 24 hours of full curing. Note: Environment temperature and humidity significantly affect curing speed.
Application Scenarios
This specializedsilicone potting compound is exclusively for Multi-Gigabit Transceivers, including 10G/25G/100G gigabit transceivers, optical transceivers, and high-speed data transmission modules. It is suitable for encapsulating transceiver chips, optical modules, PCB substrates and signal interfaces, ensuring stable operation in data centers, 5G communication, optical fiber networks, cloud computing and industrial Ethernet fields. It enhances high-speed signal transmission stability, extends transceiver service life, and is compatible with Rapid prototyping silicone to accelerate new multi-gigabit transceiver product R&D. Technical Specifications
Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Dielectric Loss: Ultra-low; Thermal Conductivity: Customizable; Volatility: Minimal; Curing Time: 24 hours (room temperature, heat-accelerated); Bonding Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel; Compliance: EU RoHS; Shelf Life: 12 months. All key parameters are fully customizable.
Certifications & Compliance
Our Electronic Potting Compound complies with international optical communication, electronic equipment, industrial and safety standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global multi-gigabit transceiver safety and performance requirements, trusted by global optical communication equipment procurement partners.
Customization Options
We provide multi-gigabit transceiver-specific tailored solutions: custom formulations (adjust signal interference performance, thermal conductivity, viscosity and curing speed), low-viscosity optimization for tiny gap penetration, and miniaturization adaptation, meeting large-scale production and small-batch customization needs of transceiver manufacturers.
Production Process & Quality Control
We implement a 5-step strict quality control process: high-purity silicone raw materials screening, precision automated formulation mixing, performance testing (insulation, signal interference, thermal conductivity, adhesion), curing verification, and sealed packaging. Our monthly capacity exceeds 500 tons, supporting stable supply for large global multi-gigabit transceiver orders. The product is non-hazardous, transportable as general chemicals, and has a 12-month shelf life when stored in a cool, dry place.
FAQ
Q: Is it suitable for 100G multi-gigabit transceivers?
A: Yes, it has low signal interference and high thermal conductivity, adapting to high-speed data transmission requirements.
Q: Will it affect transceiver signal transmission?
A: No, its ultra-low dielectric loss ensures stable multi-gigabit signal transmission without attenuation.
Q: What’s the curing time?
A: 24 hours at room temperature, heat-accelerated.
Q: Shelf life?
A: 12 months when sealed and stored properly.
Q: How to handle stratified colloid?
A: Stir evenly before use; performance remains unaffected.
Shenzhen Hong Ye Jie Technology Co., Ltd
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