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Home> Products> Electronic Potting Compound> Electronic Potting for Microfluidic Lab Chips
Electronic Potting for Microfluidic Lab Chips
Electronic Potting for Microfluidic Lab Chips
Electronic Potting for Microfluidic Lab Chips
Electronic Potting for Microfluidic Lab Chips
Electronic Potting for Microfluidic Lab Chips
Electronic Potting for Microfluidic Lab Chips

Electronic Potting for Microfluidic Lab Chips

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-9310

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound3
Product Description
HONG YE SILICONE Electronic Potting Silicone for Microfluidic Lab Chips is a high-performance two-component Addition Curing Silicone, also known as Electronic Potting Compound and Silicone Encapsulant, tailored for microfluidic lab chips. Crafted from high-purity Silicone raw materials, it integrates biocompatibility, waterproof, moisture-proof, flame retardancy and high insulation, cures into a thin, non-toxic protective layer after adding curing agent. With ultra-low volatile content and excellent adhesion to PC, PMMA, PCB and metals, it protects microfluidic chip electronic components, avoids sample contamination, ensures precise fluid control and stable operation, with customizable parameters to meet global laboratory equipment procurement demands.
 
HY-SILICONE company

Product Overview

Our Electronic Potting Silicone is specialized for microfluidic lab chips, designed for encapsulation, sealing, filling and pressure protection of their core electronic components and microchannel structures. As a leading manufacturer of liquid silicone and addition curing silicone, we optimize the formula for biocompatibility and low outgassing, avoiding contamination of biological samples while providing comprehensive protection. It outperforms epoxy potting resin in flexibility and biocompatibility, cures at room or elevated temperatures, and ensures reliable protection for chip drivers, PCB boards and microfluidic control units, extending product service life and reducing maintenance costs for laboratory equipment manufacturers.
 
electronic potting

Key Features & Advantages

  1. Excellent Biocompatibility & Low Contamination: Non-toxic, ultra-low volatile content, no harmful substances released, avoiding contamination of biological samples and ensuring the accuracy of lab test results.
  2. Wide Temperature Adaptability: Operates stably from -60℃ to 220℃, withstanding temperature changes in lab environments, absorbing thermal cycling stress to protect chips, welding gold wires and microfluidic structures.
  3. Precise Sealing & Corrosion Resistance: Excellent waterproof, moisture-proof and dust-proof performance; resistant to lab reagents and chemical erosion, ensuring tight sealing of microchannels and stable fluid control.
  4. Friendly Curing Process: Addition-curing formula, no heat release, low shrinkage and no corrosion; supports room-temperature or heated curing, 24-hour full solidification, easy to operate and adapt to microfluidic chip mass production.
  5. High Reliability & Customizability: As a professional Silicone Potting Compound manufacturer, it has high strength and excellent adhesion to chip substrates; hardness, viscosity and curing speed can be customized to match different microfluidic lab chip models.

How to Use

  1. Pre-Mix Preparation: Thoroughly stir Component A to evenly distribute settled fillers, and shake Component B vigorously to ensure uniformity, avoiding stratification which affects adhesion and biocompatibility.
  2. Precision Mixing: Strictly follow the recommended weight ratio of Component A to B, stirring slowly and evenly for 2-3 minutes to avoid introducing air bubbles that affect microchannel sealing and sample purity.
  3. Degassing: After mixing, place the adhesive in a vacuum container at 0.01MPa for 3 minutes to eliminate air bubbles, ensuring full penetration into tiny gaps of microfluidic lab chip components.
  4. Curing: Pour the degassed mixture into component housings; cure at room temperature (full solidification in 24 hours) or heated to accelerate. Note: Environment temperature and humidity have a significant impact on curing speed.

Application Scenarios

This specialized silicone Potting Compound is exclusively for microfluidic lab chips, including biological detection microfluidic chips, chemical analysis microfluidic chips, medical diagnostic microfluidic chips and lab-on-a-chip devices. It is suitable for encapsulation, sealing and filling of their core electronic components, PCB boards and microchannels, ensuring precise fluid control and stable operation in laboratory environments. It reduces chip failure rates, lowers production and maintenance costs, and is compatible with Rapid prototyping silicone to accelerate R&D of new microfluidic lab chip products.

Technical Specifications

Curing Type: Addition-Curing; Mix Ratio (A:B): Customizable (per requirements); Appearance: Transparent/opaque liquid (both A and B components); Viscosity: Customizable; Hardness (Shore A): Customizable; Operating Temperature Range: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Curing Time: 24 hours (room temperature), accelerated via heating; Bonding Substrates: PC, PMMA, PCB, CPU, aluminum, copper, stainless steel; Biocompatibility: Meets international lab standards. Hardness, viscosity and operation time can be fully customized.

Certifications & Compliance

Our Electronic Potting Silicone complies with international laboratory and industrial standards: ISO 9001 (strict quality control), CE Certification (European safety standards), EU RoHS Directive (hazardous substance-free), and meets biocompatibility requirements for lab equipment, gaining recognition from global laboratory equipment procurement partners.

Customization Options

We offer lab-grade tailored solutions: custom formulations (adjust hardness, viscosity, curing speed and biocompatibility), low-outgassing formula optimization, and flexible packaging options (5kg, 20kg, 25kg, 200kg) to meet large-scale production and small-batch customization needs of microfluidic lab chip manufacturers.

Production Process & Quality Control

We implement a 5-step strict quality control process: raw material purification (high-purity silicone screening), precision formulation (automated mixing for consistent silicone potting compound), performance testing (biocompatibility, sealing, insulation, adhesion), curing verification, and sealed packaging. Our facility has a monthly capacity of over 500 tons, supporting large global microfluidic lab chip orders.

FAQ

Q: Will it contaminate biological samples in microfluidic chips?
A: No, it has excellent biocompatibility and ultra-low volatile content, no harmful substances released, ensuring sample purity.
Q: Is it suitable for lab reagent environments?
A: Yes, it has excellent corrosion resistance, resisting common lab reagents and chemical erosion.
Q: What is the curing time?
A: 24 hours at room temperature, which can be accelerated by heating.
Q: What is the shelf life?
A: 12 months when stored sealed in a cool, dry place (below 25℃).
Q: How to handle stratified colloid?
A: Stir evenly before use, which will not affect product performance.
 
 
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