HONG YE SILICONE Electronic Potting for Silicon Photomultipliers is a specialized Electronic Potting Compound and Silicone Encapsulant, also known as Electronic Encapsulation Adhesive, tailored for silicon photomultiplier (SiPM) encapsulation. Made of high-purity Silicone raw materials, it is an addition-curing silicone with excellent waterproof, moisture-proof, insulation and ultra-high light transmittance, operating stably from -60℃ to 220℃, strong adhesion to metals and PC/PMMA/PCB, low volatility, no signal interference, complying with EU RoHS, non-hazardous, and supporting full parameter customization (around 198 characters).
Product Overview
Our Electronic Potting for Silicon Photomultipliers is a professional Silicone Potting Compound developed for the encapsulation, sealing, insulation and protection of silicon photomultipliers. As a leading manufacturer of electronic Potting Compound and silicone raw materials, we optimize the formula for the high sensitivity, insulation, anti-interference and light transmittance requirements of SiPMs. Unlike ordinary potting silicones, it maintains ultra-high light transmittance after curing, does not block weak light reception, absorbs internal stress from temperature cycles, resists corrosion and ozone, and has excellent adhesion to aluminum, copper, stainless steel and PC/PMMA/PCB, effectively protecting SiPMs and ensuring long-term stable operation for procurement partners.
Key Features & Advantages
- Ultra-High Light Transmittance & Sensitivity Preservation: Ultra-high light transmittance after curing, ensuring unobstructed reception of weak light signals by silicon photomultipliers, without affecting photoelectric conversion efficiency and detection sensitivity; no interference to SiPM signals, maintaining signal integrity and detection accuracy, which is critical for SiPM performance in low-light detection scenarios.
- Superior Insulation & Anti-Interference: Ultra-strong insulation performance (dielectric strength ≥25 kV/mm, volume resistivity ≥1.0×10¹⁶ Ω·cm), preventing short circuits and ensuring safe operation; effectively isolating external electromagnetic interference and voltage interference, avoiding signal distortion and ensuring stable photon multiplication effect of SiPMs.
- Excellent Temperature & Environmental Adaptability: Operating stably from -60℃ to 220℃, with outstanding high and low temperature resistance; can absorb internal stress caused by temperature cycles, protecting SiPM chips and welding wires from damage; good ozone resistance, chemical erosion resistance and waterproof moisture-proof performance, adapting to harsh indoor and outdoor working environments of low-light detection equipment.
- Strong Adhesion & Easy Operation: Excellent adhesion to aluminum, copper, stainless steel and other metals, as well as PC, PMMA and PCB materials (common in SiPMs), forming a tight seal without detachment; two-component design, easy to mix evenly, optional vacuum defoaming (0.01MPa for 3 minutes), supports room temperature or heated curing, full curing in 24 hours, suitable for batch production of SiPMs.
- Environmental Protection & High Stability: Addition-curing silicone, non-toxic and non-hazardous, fully compliant with EU RoHS directive; low volatility, high strength, no stratification after long-term storage (stir before use without affecting performance); mixed glue can be used up at one time, avoiding waste and reducing procurement costs.
How to Use (Step-by-Step Guide)
- Pre-Mixing Preparation: Fully stir Component A in its container to mix the settled filler evenly, and shake Component B thoroughly to ensure uniform consistency, avoiding affecting curing effect, adhesion and light transmittance, which is crucial for SiPM sensitivity.
- Mixing: Mix Component A and Component B according to the specified weight ratio (customizable), stir slowly and evenly to avoid generating air bubbles, which may affect insulation, light transmittance and sealing performance of silicon photomultipliers.
- Degassing (Optional): Put the mixed potting compound into a vacuum container, degas at 0.01MPa for 3 minutes to completely eliminate air bubbles, then pour it into silicon photomultiplier packaging molds or casings.
- Curing: Place the encapsulated SiPM at room temperature for curing or heat to accelerate curing; enter the next process after basic curing, and full curing takes 24 hours. Note: Environment temperature and humidity significantly affect curing speed and final performance.
Application Scenarios
This specialized electronic potting compound and silicone encapsulant is mainly used for encapsulation, sealing, filling and pressure protection of silicon photomultipliers (SiPMs). It is widely applied in low-light detection, medical imaging, nuclear radiation detection, aerospace, security monitoring and optical communication. It ensures stable operation of SiPMs in various environments, reduces failure rates caused by moisture, corrosion and vibration, maintains high detection sensitivity and signal stability, and helps procurement partners reduce production costs and enhance product competitiveness.
Technical Specifications
Type: Addition-Curing Electronic Potting Silicone; Mix Ratio (A:B): Customizable (weight ratio); Appearance: Liquid (both components); Viscosity: Customizable; Working Time: Customizable; Curing Time: 24 hours (full, room temp/heated optional); Operating Temperature: -60℃ to 220℃; Dielectric Strength: ≥25 kV/mm; Volume Resistivity: ≥1.0×10¹⁶ Ω·cm; Adhesion: Excellent (metals, PC, PMMA, PCB); Light Transmittance: Ultra-High (customizable); Volatility: Minimal; Compliance: EU RoHS; Shelf Life: 12 months (sealed storage); Non-hazardous; Customizable parameters available.
Certifications & Compliance
Our Electronic Potting for Silicon Photomultipliers complies with international standards: ISO 9001 (strict quality control), CE Certification, EU RoHS Directive, meeting global silicon photomultiplier production requirements, trusted by global electronic component manufacturers and procurement partners.
Customization Options
We provide silicon photomultiplier-specific customization: adjust viscosity, hardness, curing speed, insulation and light transmittance; optimize adhesion for SiPM materials (metals, PC/PMMA/PCB); flexible parameter adjustment to match different SiPM sensitivity requirements, meeting small-batch and large-scale production needs of different industries, adapting to various SiPM sizes and working conditions.
Production Process & Quality Control
We implement a strict 5-step quality control process: high-purity silicone raw materials screening, precision automated mixing, performance testing (insulation, adhesion, light transmittance, temperature resistance), curing verification, and sealed packaging. Monthly capacity exceeds 500 tons, supporting stable global supply; non-hazardous, transportable as general chemicals.
FAQ
Q: Is it suitable for all silicon photomultipliers?
A: Yes, it can be customized for different SiPM sizes and materials, with good compatibility and no impact on light reception and detection sensitivity.
Q: What’s the mixing ratio?
A: Customizable weight ratio, easy to operate and mix.
Q: How to store the product?
A: Seal and store, shelf life is 12 months; stir evenly before use if stratified, no impact on performance.
Q: Is it hazardous?
A: No, it is non-hazardous and can be transported as general chemicals.
Q: What if it gets into eyes or mouth?
A: Rinse with clean water immediately or seek medical attention.
Shenzhen Hong Ye Jie Technology Co., Ltd
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