Product Overview
This high-quality Electronic Encapsulation Adhesive includes addition curing and condensation curing types, serving as reliable industrial Silicone raw materials for RF filter packaging. It delivers excellent adhesion and thermal stability for PCB, CPU, PC, PMMA, aluminum, copper and stainless steel substrates. After curing, the flexible silicone layer absorbs thermal cycling stress, protects internal chips and gold bonding wires, and integrates waterproof, insulation, dustproof and anti-corrosion functions to maintain stable filtering accuracy of lumped element filters in long-term operation.
Core Product Features & Advantages
Optimized exclusively for lumped element filter working characteristics, it solves common frequency drift and signal clutter issues of ordinary potting materials:
1. Ultra-stable filtering performance: Consistent dielectric properties lock filter frequency parameters, no signal distortion or frequency deviation in high and low temperature cycling.
2. Multi-dimensional protective performance: Boasts outstanding waterproof, moisture-proof, shockproof and dustproof capabilities, with excellent resistance to ozone and chemical erosion.
3. Extreme temperature adaptability: Stably operates at -60℃ to 220℃, relieves internal thermal stress and prevents filter performance attenuation caused by temperature changes.
4. Low volatility & high bonding strength: Minimal volatile content and high structural rigidity, firmly bonds multiple substrates without interfering with RF signal filtering.
Application Scenarios
Widely used for encapsulation and sealing of lumped element filters, low-pass, high-pass and band-pass filter modules, and precision RF signal filtering components. Commonly applied in communication devices, precision instrumentation and wireless electronic systems. It effectively stabilizes filter signal accuracy, reduces product failure and rework rates, improves finished product qualification rate, and cuts manufacturers’ production and maintenance costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly to ensure uniform formula composition.
2. Standard mixing: Strictly follow AB component weight ratio to guarantee stable filtering protection performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3-minute defoaming to eliminate bubbles causing signal instability.
4. Curing treatment: Adopt room temperature or heating curing. Initial curing supports subsequent processing, with full curing completed within 24 hours.
Certifications & Compliance
The product complies with ISO9001, CE, UL and ROHS international standards, meeting global precision RF electronic industry specifications and supporting cross-border export applications.
Customization Options
Customized services are available. Viscosity, hardness, operating time and curing speed can be adjusted to match diverse lumped element filter packaging processes.
Production & Quality Control
We implement standardized production and full-process strict QC. Pre-production sample testing and pre-shipment full inspection ensure stable batch performance and consistent quality.
FAQ
Q1: Will this Potting Compound affect the filtering accuracy of lumped element filters? A: No. It features ultra-stable dielectric properties, perfectly maintaining original filter frequency and signal filtering accuracy.
Q2: Does colloidal stratification influence product protective performance? A: Slight stratification is normal after long storage. Even stirring will not damage its stability and protection effect.
Q3: How to store the Filter Potting Silicone? A: Keep sealed and dry. Mixed AB silicone should be used up at one time to avoid performance degradation.