Product Overview
This high-quality Electronic Encapsulation Adhesive includes addition curing and condensation curing types, serving as reliable industrial Silicone raw materials for RF filter module packaging. It specializes in encapsulation, sealing, filling and pressure protection of precision electronic components, with excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After curing, the flexible silicone layer absorbs thermal cycling stress, protects internal chips and gold bonding wires, and integrates waterproof, insulation, dustproof and anti-corrosion functions to stabilize the signal absorption performance of absorptive filter modules.
Product Features & Advantages
Exclusively optimized for absorptive filter module working characteristics, it outperforms ordinary potting materials in RF stability and environmental durability:
1. Comprehensive protection: Delivers excellent waterproof, moisture-proof, dustproof, shockproof and anti-corrosion performance, with strong resistance to ozone and chemical erosion.
2. Extreme temperature resistance: Stably operates from -60℃ to 220℃, relieves internal thermal stress and avoids filter signal absorption deviation caused by temperature changes.
3. Low volatility & high adhesion: Ultra-low volatile content and high structural strength, firmly bonds various substrates without interfering with RF signal absorption.
4. Stable filtering performance: Consistent dielectric parameters maintain accurate noise absorption efficiency, ensuring stable operation of absorptive filter modules for a long time.
Application Scenarios
Ideal for encapsulation and sealing of absorptive filter modules, RF noise absorption modules, high-frequency signal filtering equipment and wireless communication filter components. Widely applied in 5G communication systems and precision RF test instruments. It stabilizes filter working accuracy, reduces equipment failure and debugging rates, improves product consistency, and effectively cuts manufacturers’ production and maintenance costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and shake component B thoroughly for uniform formulation.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable RF protection performance.
3. Vacuum defoaming: Place mixed silicone in a 0.01MPa vacuum container for 3-minute defoaming to eliminate bubble-induced signal instability.
4. Curing treatment: Support room temperature or heating curing. Initial curing allows subsequent processing, with full curing completed within 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE, UL and ROHS international standards, fully meeting global high-frequency electronic industry specifications for cross-border export and industrial-grade filter module packaging.
Customization Options
Customized services are available. Product viscosity, hardness and operating time can be adjusted to adapt to different absorptive filter module packaging processes.
Production & Quality Control
We implement standardized production and full-process strict QC. Pre-production sample testing and pre-shipment full inspection ensure stable batch performance and consistent product quality.
FAQ
Q1: Will this Potting Compound affect the noise absorption effect of filter modules? A: No. It features ultra-stable dielectric properties, which will not interfere with signal absorption and filtering accuracy of absorptive filter modules. Q2: Is stratified silicone usable for module encapsulation? A: Slight stratification after long storage is normal. Even stirring before use will not affect its protective and RF stable performance.
Q3: How to store and use the potting silicone? A: Store in sealed and dry conditions. Mixed AB silicone should be used up at one time to avoid performance degradation and waste.