Product Overview
This premium Electronic Encapsulation Adhesive is classified as high-quality industrial Silicone raw materials, available in addition curing and condensation curing types. It is widely used for encapsulation, sealing, filling and pressure buffering of various electronic components. It delivers superior adhesion and thermal stability on PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After full curing, the flexible Shore A silicone layer absorbs thermal cycling stress, protects internal chips and gold bonding wires, and integrates moistureproof, dustproof, anti-corrosion and shockproof functions to extend electronic service life.
Technical Specifications
This flexible potting silicone features stable Shore A hardness with soft and tough texture, effectively buffering external pressure and vibration. It supports continuous operation at -60℃ to 220℃, with ultra-low volatile content and excellent mechanical toughness. It boasts strong resistance to ozone and chemical erosion, maintaining stable dielectric and physical properties. Hardness, viscosity and operating time are fully customizable to match diverse electronic packaging processes.
Product Features & Advantages
Different from rigid potting materials, our Shore A flexible silicone has unique advantages for precision electronic protection:
1. Superior flexible toughness: Soft Shore A hardness absorbs vibration and thermal stress, avoiding component cracking caused by hard encapsulation.
2. Full environmental protection performance: Integrates waterproof, moisture-proof, dustproof and anti-corrosion functions, resisting ozone and chemical erosion.
3. Extreme temperature adaptability: Stably operates in wide temperature ranges, preventing parameter drift and component damage from temperature cycling.
4. High adhesion & low volatility: Firmly bonds multiple metal and non-metal substrates with low volatiles, no pollution to precision circuits.
Application Scenarios
Suitable for flexible protection of precision electronic modules, circuit boards, communication components and sensitive chip devices. Widely applied in consumer electronics, communication equipment and industrial control systems. Its flexible buffering performance reduces component damage rate during operation and transportation, improves finished product yield, and lowers manufacturers’ production and after-sales maintenance costs.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable curing and flexible performance.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing. Initial curing allows post-processing, with complete curing finished within 24 hours, affected by temperature and humidity.
Certifications & Compliance
This product meets ISO9001, CE, UL and ROHS international standards, complying with global industrial electronic packaging and cross-border export specifications.
Customization Options
Custom services are available. Shore A hardness, viscosity and operating time can be adjusted to meet customized electronic encapsulation demands.
Production & Quality Control
We implement standardized production and full-process strict QC. Pre-production sample testing and pre-shipment full inspection ensure stable batch performance and consistent quality.
FAQ
Q1: What are the benefits of Shore A flexible potting silicone? A: Its soft toughness relieves thermal stress and vibration damage, effectively protecting fragile chips and welding lines better than rigid potting compounds.
Q2: Can stratified silicone be used normally? A: Yes. Slight stratification after long-term storage is normal, and uniform stirring will not affect protective performance.
Q3: How to store and use mixed glue? A: Store raw materials in sealed and dry conditions. Mixed AB silicone should be used up at one time to avoid waste and performance degradation.