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Home> Products> Electronic Potting Compound> Low Stress Electronic Potting Silicone
Low Stress Electronic Potting Silicone
Low Stress Electronic Potting Silicone
Low Stress Electronic Potting Silicone
Low Stress Electronic Potting Silicone
Low Stress Electronic Potting Silicone
Low Stress Electronic Potting Silicone

Low Stress Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9045

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound1
Product Description
HONG YE SILICONE’s Low Stress Electronic Potting Silicone is a tension-free Silicone Potting Compound designed for fragile precision electronic components. Made of high-purity liquid silicone and premium RTV 2 Silicone Rubber, it integrates mature formulas of industrialMold Making Silicone and Pad printing silicone rubber. As reliable industrial Silicone raw materials, this professional Electronic Encapsulation Adhesive eliminates curing shrinkage stress and thermal expansion tension, protecting delicate chips and welding lines while offering full environmental protection performance.
 
HY-SILICONE company

Product Overview

This low-stress Silicone Encapsulant is available in addition curing and condensation curing types, specialized in encapsulation, sealing, filling and buffer protection of sensitive electronic parts. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel surfaces. With ultra-soft and low-tension formula, it effectively absorbs internal stress generated by high and low temperature cycling, preventing component cracking and damage. It also delivers outstanding waterproof, insulation, dustproof and anti-chemical corrosion performance for long-term stable protection.
 
electronic silicone
 

Technical Specifications

This low-stress potting silicone features minimal curing shrinkage and zero residual tension, adapting to -60℃ to 220℃ continuous operation. It has ultra-low volatile content, high flexibility and excellent resistance to ozone and chemical erosion. It maintains stable physical and insulation properties during repeated temperature changes. Core parameters including viscosity, hardness and operating time are fully customizable to fit precision electronic packaging requirements.

Product Features & Advantages

Different from ordinary rigid potting compounds with high curing stress, this product owns unique low-tension advantages:
1. Ultra-low stress protection: Eliminates curing shrinkage and thermal cycling tension, avoiding crack damage to fragile chips and gold wires.
2. Full environmental adaptability: Integrates waterproof, moisture-proof, dustproof and shockproof functions with superior ozone and chemical corrosion resistance.
3. Wide temperature tolerance: Stably operates in extreme temperature ranges and buffers internal structural stress effectively.
4. Excellent bonding performance: Firmly adheres to various substrates with low volatility, no damage to precision circuits.

Application Scenarios

Ideal for precision sensors, delicate chip modules, micro electronic components and high-precision communication devices. Its low-stress property avoids component failure caused by mechanical tension and temperature deformation, improves product yield and stability, and reduces manufacturers’ defective rate and after-sales maintenance costs.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable low-stress performance.
3. Vacuum defoaming: Place mixed glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global precision electronic packaging and cross-border export specifications.

Customization Options

Custom services are available. Hardness, viscosity, stress level and operating time can be adjusted for personalized packaging solutions.

Production & Quality Control

We implement standardized production and full-process stress testing. Pre-production verification and pre-shipment inspection ensure consistent low-stress performance and reliable batch quality.

FAQ

Q1: What is the core advantage of low stress potting silicone?
A: It reduces curing and thermal stress effectively, preventing fragile precision electronic components from cracking and failure.
Q2: Can stratified silicone be used normally after storage?
A: Yes. Slight stratification is normal, and uniform stirring will not affect its low-stress protection and basic performance.
Q3: How to store mixed low-stress Potting Compound?
A: Store raw materials in sealed and dry environments. Mixed AB glue should be used up at one time to avoid performance degradation.
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