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Home> Products> Electronic Potting Compound> Low Shrinkage Electronic Potting Silicone
Low Shrinkage Electronic Potting Silicone
Low Shrinkage Electronic Potting Silicone
Low Shrinkage Electronic Potting Silicone
Low Shrinkage Electronic Potting Silicone
Low Shrinkage Electronic Potting Silicone
Low Shrinkage Electronic Potting Silicone

Low Shrinkage Electronic Potting Silicone

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Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
Other information
Product Attributes

Model No.: HY-9320

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-5
Product Description
HONG YE SILICONE’s Low Shrinkage Electronic Potting Silicone is a low-deformation Silicone Potting Compound engineered for high-precision electronic packaging. Formulated with premium pure liquid silicone and stable RTV 2 Silicone Rubber, it adopts mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. As reliable industrial Silicone raw materials, this professional Electronic Encapsulation Adhesive features ultra-low curing shrinkage, avoiding component extrusion damage and gap deformation, while delivering full insulation, waterproof and wide temperature protection for precision electronics.
 
HY-silicone term

Product Overview

This low shrinkage potting silicone includes addition curing and condensation curing types, specialized in encapsulation, sealing, filling and pressure protection of precision electronic components. It boasts excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With minimal shrinkage rate during curing, it eliminates structural deformation and internal extrusion stress. It stably operates at -60℃ to 220℃, absorbs thermal cycling stress, and protects chips and gold bonding wires, with outstanding dustproof, anti-corrosion and ozone-resistant performance.

Technical Specifications

This low-shrinkage Silicone Encapsulant achieves near-zero shrinkage after full curing, with no deformation or crack generation. It features ultra-low volatile content, high structural strength and excellent chemical erosion resistance. It maintains stable size and sealing performance during long-term high and low temperature cycling. Core parameters including viscosity, hardness and operating time support personalized customization to meet high-precision packaging standards.
 
electronic silicone

Product Features & Advantages

Compared with ordinary potting silicone with high shrinkage and easy deformation, this product has unique precision packaging advantages:
1. Ultra-low shrinkage performance: Prevents curing deformation, component extrusion and seal gap failure, perfect for precision electronic packaging.
2. Multi-dimensional protection: Integrates waterproof, moisture-proof, dustproof and shockproof functions with superior ozone and chemical corrosion resistance.
3. Extreme temperature stability: Buffers thermal expansion and contraction stress to protect delicate internal electronic structures.
4. High bonding stability: Firmly adheres to various substrates with low volatility, no damage to precision circuits.

Application Scenarios

Ideal for precision sensors, micro electronic components, high-precision circuit modules and miniature electronic devices. Its low-shrinkage property avoids structural deformation and component damage caused by curing shrinkage, improves product assembly accuracy and yield, reduces defective rates and production costs, and enhances long-term operational stability of electronic equipment.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure low shrinkage curing effect.
3. Vacuum defoaming: Defoam mixed uniform glue for 3 minutes under 0.01MPa vacuum to eliminate bubbles.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting global precision electronic packaging and cross-border export specifications.

Customization Options

Customized services are available. Shrinkage rate, hardness, viscosity and operating time can be adjusted for personalized precision packaging solutions.

Production & Quality Control

We implement standardized production and strict shrinkage testing. Pre-production formula verification and pre-shipment full inspection ensure stable low-shrinkage performance and consistent batch quality.

FAQ

Q1: What is the core benefit of low shrinkage potting silicone? A: It minimizes curing shrinkage and deformation, protecting precision electronic components from extrusion damage and sealing failure.
Q2: Will stored stratified glue affect shrinkage performance? A: No. Slight stratification is normal, and even stirring will not change its low-shrinkage feature and protective performance.
Q3: How to store mixed low shrinkage Potting Compound? A: Keep raw materials sealed and dry. Mixed AB silicone should be used up at one time to avoid performance degradation.
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