Product Overview
This repairable potting silicone includes addition curing and condensation curing types, designed for encapsulation, sealing, filling and shock protection of various electronic components. It delivers excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. Different from hard-to-remove potting glue, it can be easily stripped and repaired without damaging circuit boards and components. It operates stably at -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold wires, and features waterproof, dustproof, anti-corrosion and ozone-resistant performance.
Technical Specifications
This repairable Silicone Encapsulant boasts unique removable and reworkable properties with ultra-low volatile content and moderate softness. It maintains stable insulation and physical performance in -60℃~220℃ temperature range, resisting long-term aging and chemical erosion. It leaves no residual damage on electronic substrates after removal. Viscosity, hardness and operating time are fully customizable to match diverse maintenance and packaging demands.
Product Features & Advantages
Breaking the limitation of traditional non-repairable potting products, this item has exclusive market advantages:
1. Excellent repairability: Soft texture allows easy manual removal and rework, no damage to precision electronic components and circuits.
2. Multi-functional protection: Integrates waterproof, moisture-proof, dustproof and shockproof performance with superior chemical and ozone resistance.
3. Wide temperature stability: Buffers thermal stress during temperature cycling to protect internal chip structures steadily.
4. Safe and stable: Low volatile formula ensures no circuit pollution, with reliable bonding for multiple substrates.
Application Scenarios
Ideal for precision sensors, communication electronics, experimental circuit modules and equipment requiring regular inspection and maintenance. Its repairable property enables convenient component replacement and circuit debugging, greatly reducing maintenance time and replacement costs. It improves equipment reuse rate and comprehensive cost-performance for electronic manufacturers.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to homogenize settled fillers and shake component B thoroughly before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable repairable performance after curing.
3. Vacuum defoaming: Place mixed glue in a 0.01MPa vacuum container for 3-minute defoaming for flawless pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global repairable electronic packaging and cross-border export standards.
Customization Options
Custom services are available. Hardness, viscosity, operating time and repairable flexibility can be adjusted for personalized solutions.
Production & Quality Control
We implement standardized production and strict repairability and stability testing. Pre-production verification and pre-shipment full inspection ensure consistent batch quality and stable maintenance performance.
FAQ
Q1: Will removing this repairable potting silicone damage electronics? A: No. It features soft and non-corrosive texture, which can be easily stripped off without scratching or damaging circuits and components.
Q2: Does colloidal stratification affect repairable performance? A: No. Slight storage stratification is normal, and even stirring will not affect its flexibility and maintenance performance.
Q3: How to store mixed repairable Potting Compound? A: Store raw materials in sealed and dry conditions. Mixed AB silicone should be used up at one time to avoid performance degradation.