Product Overview
This High Hardness potting silicone includes addition curing and condensation curing formulas, designed for rigid encapsulation, sealing, filling and anti-pressure protection of electronic components. It provides excellent adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. After full curing, it forms a hard, rigid protective layer that resists extrusion, impact and external mechanical damage. It stably operates from -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with excellent waterproof, dustproof, anti-corrosion and ozone-resistant performance.
Technical Specifications
This high-hardness Silicone Encapsulant features superior cured hardness and structural strength, with strong anti-pressure and anti-impact capacity. It has ultra-low volatile content and stable rigid structure, no deformation or collapse under long-term mechanical pressure and temperature alternation. It resists chemical erosion and ozone aging effectively. Core indicators including hardness, viscosity and operating time support full personalized customization for industrial packaging needs.
Product Features & Advantages
Different from soft and low-strength ordinary potting silicone, this rigid high-hardness product has exclusive industrial advantages:
1. Ultra-high hardness & rigidity: Resists heavy pressure, impact and extrusion, preventing structural deformation of electronic modules.
2. Full protective performance: Integrates waterproof, moisture-proof, dustproof and shockproof functions with great chemical and ozone resistance.
3. Extreme temperature stability: Maintains rigid protection steadily in -60℃ to 220℃ environments and buffers internal thermal stress.
4. High-strength adhesion: Firmly bonds various metal and non-metal substrates with low volatility and long durability.
Application Scenarios
Perfect for industrial control electronics, power modules, automotive electronics and equipment bearing frequent mechanical extrusion and collision. Its high-hardness rigid protection effectively avoids component deformation and damage, reduces equipment failure rates, lowers production defective costs, and improves electronic product durability and industrial adaptability.
Step-by-Step Usage Process
1. Pre-stirring: Fully stir component A to evenly disperse settled fillers and thoroughly shake component B before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to ensure stable high-hardness curing effect.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.
Certifications & Compliance
This product complies with ISO9001, CE and ROHS international standards, meeting global heavy-duty electronic packaging and cross-border export specifications.
Customization Options
Custom services are available. Cured hardness, viscosity, operating time and strength can be adjusted for personalized rigid packaging solutions.
Production & Quality Control
We adopt standardized production and strict hardness & strength testing. Pre-production verification and pre-shipment full inspection ensure stable high-rigidity performance and consistent batch quality.
FAQ
Q1: What is the core advantage of high hardness Potting Compound ? A: It forms a rigid high-strength protective layer after curing, effectively resisting mechanical pressure and impact damage to electronic components.
Q2: Will colloidal stratification affect hardness performance? A: No. Slight storage stratification is normal, and even stirring will not weaken its cured hardness and structural strength.
Q3: How to store mixed high hardness potting silicone? A: Seal and store raw materials in dry environments. Mixed AB silicone should be used up at one time to avoid performance attenuation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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