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Home> Products> Electronic Potting Compound> Low Chloride Electronic Potting Silicone
Low Chloride Electronic Potting Silicone
Low Chloride Electronic Potting Silicone
Low Chloride Electronic Potting Silicone
Low Chloride Electronic Potting Silicone
Low Chloride Electronic Potting Silicone
Low Chloride Electronic Potting Silicone

Low Chloride Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
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Product Description
Product Attributes
Packaging & Delivery
Product Description
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Product Attributes

Model No.: HY-9055

Brand: HONG YE SILICONE

Origin: HUIZHOU

Certification: 9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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electronic potting compound-5
Product Description
HONG YE SILICONE’s Low Chloride Electronic Potting Silicone is a high-purity halogen-free Silicone Potting Compound tailored for high-precision electronic packaging. Adopting refined liquid silicone and premium RTV 2 Silicone Rubber, it inherits mature formulas of industrial Mold Making Silicone and Pad printing silicone rubber. As reliable Silicone raw materials and high-grade Electronic Encapsulation Adhesive, it features ultra-low chloride ion content, eliminating metal corrosion risks, while delivering excellent insulation, waterproofing and wide-temperature stable protection for delicate electronic components.
 
HY-factory

Product Overview

This low chloride potting silicone includes addition curing and condensation curing types, professionally used for encapsulation, sealing, filling and pressure resistance of high-end electronics. It boasts superior adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With strictly controlled low chloride content, it avoids electrochemical corrosion and circuit failure of metal contacts. It operates stably at -60℃ to 220℃, absorbs thermal cycling stress to protect chips and gold bonding wires, with outstanding dustproof, anti-oxidation and ozone-resistant performance.

Technical Specifications

This low-chloride Silicone Encapsulant features ultra-low chloride ion concentration and ultra-low volatile content, complying with high-standard electronic packaging requirements. It has high structural strength and stable bonding performance, no metal corrosion or circuit contamination after long-term use. It resists chemical erosion and high-low temperature aging perfectly. Core indicators including viscosity, hardness and operating time support full personalized customization.
 
electronic silicone

Product Features & Advantages

Different from ordinary potting silicone with high chloride ions causing metal corrosion, this product has unique high-purity advantages:
1. Ultra-low chloride formula: Strictly controls ion content, effectively preventing metal circuit oxidation and electrochemical corrosion.
2. Full protective performance: Integrates waterproof, moisture-proof, dustproof and shockproof functions with excellent ozone and chemical resistance.
3. Extreme temperature stability: Steadily works in -60℃ to 220℃, buffering internal thermal stress to protect precision components.
4. High-purity & eco-friendly: Low volatility, high bonding strength, no pollution to precision electronic circuits.

Application Scenarios

Ideal for automotive electronics, aerospace modules, precision semiconductor devices and high-end communication electronics that require strict ion control. Its low-chloride and corrosion-free performance eliminates latent circuit failure risks, extends electronic service life, reduces product defective rates and after-sales costs, and upgrades product reliability for high-end manufacturing.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and shake component B thoroughly.
2. Proportional mixing: Strictly follow standard AB component weight ratio to maintain stable low-chloride performance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming before pouring.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, greatly affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting high-purity electronic packaging and global cross-border export specifications.

Customization Options

Customized services are available. Chloride grade, hardness, viscosity and operating time can be adjusted to meet exclusive high-precision electronic packaging demands.

Production & Quality Control

We adopt dust-free standardized production and strict chloride ion detection. Pre-production verification and pre-shipment full testing ensure stable low-chloride purity and consistent batch quality.

FAQ

Q1: Why is low chloride potting silicone essential for high-end electronics? A: Ultra-low chloride ions avoid metal circuit corrosion and oxidation, solving latent failure risks caused by high-ion ordinary potting adhesives.
Q2: Will colloid stratification affect product purity? A: No. Slight storage stratification is normal, and even stirring will not change its low-chloride purity and protective performance.
Q3: How to store mixed low chloride Potting Compound? A: Seal raw materials and store in dry environments. Mixed AB silicone should be used up at one time to prevent performance attenuation.
 
 
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