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Home> Products> Electronic Potting Compound> Shock Wave Dampening Electronic Potting Silicone
Shock Wave Dampening Electronic Potting Silicone
Shock Wave Dampening Electronic Potting Silicone
Shock Wave Dampening Electronic Potting Silicone
Shock Wave Dampening Electronic Potting Silicone
Shock Wave Dampening Electronic Potting Silicone
Shock Wave Dampening Electronic Potting Silicone

Shock Wave Dampening Electronic Potting Silicone

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Payment Type:T/T,Paypal
Incoterm:FOB,CFR,CIF,EXW,FAS,FCA,CPT,CIP,DEQ,DDP,DDU,Express Delivery,DAF
Min. Order:1 Kilogram
Transportation:Ocean,Land,Air,Express
Port:shenzhen
Product Attributes

Model No.HY-210

BrandHONG YE SILICONE

OriginHUIZHOU

Certification9001

Packaging & Delivery
Selling Units : Kilogram
Package Type : 1kg/5kg/25kg/200kg
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Electronic potting silicone
Product Description
HONG YE SILICONE’s Shock Wave Dampening Electronic Potting Silicone is a high-resilience safety-grade Electronic Potting Compound for harsh industrial environments. As premiumElectronic Encapsulation Adhesive, durable Silicone Encapsulant and upgraded alternative to standard Thermally Conductive Potting Compound, it features professional blast mitigation encapsulation and impulse absorbing module potting. This specialized product delivers reliable explosive environment protection, absorbing shock waves and impulse force while providing insulation, waterproofing and extreme temperature stability for core electronic components.
 
HY-factory

Product Overview

This shock dampening potting silicone includes addition curing and condensation curing formulas, professionally engineered for anti-shock and explosion-resistant electronic encapsulation. It is widely used for sealing, filling and pressure protection of industrial electronic modules, offering superior adhesion and thermal stability for PCB, PC, PMMA, CPU, aluminum, copper and stainless steel substrates. With flexible resilient cured structure, it achieves excellent impulse absorbing module potting and blast mitigation encapsulation. It operates steadily from -60℃ to 220℃, absorbs thermal cycling stress and sudden shock wave impact to protect chips and gold bonding wires, with low volatility and high structural toughness.

Technical Specifications

This shock wave dampening silicone potting material features high resilience and powerful energy absorption capacity, realizing efficient blast mitigation encapsulation and explosive environment protection. It owns outstanding ozone resistance and chemical erosion resistance, maintaining stable shock absorption performance under extreme temperature alternation and harsh working conditions. It boasts high bonding strength with multiple substrates, and key parameters including hardness, viscosity and operation time support full personalized customization.
 
electronic silicone

Product Features & Advantages

Different from ordinary rigid potting silicone with poor shock resistance, this product has exclusive anti-impact advantages:
1. Professional shock wave dampening: High-resilience structure absorbs sudden impulse and blast energy, avoiding electronic component fracture and failure.
2. Reliable explosive environment protection: Unique blast mitigation performance ensures stable operation of electronics in high-risk industrial scenarios.
3. Full comprehensive protection: Integrates shockproof, waterproof, anti-corrosion, dustproof and insulation functions with ultra-wide temperature adaptability.
4. Stress buffer stability: Absorbs high-temperature thermal stress and external mechanical shock, extending component service life effectively.

Application Scenarios

Ideal for mining electronics, military modules, industrial explosion-proof equipment and impact-prone electronic devices. Its impulse absorbing module potting performance effectively resists shock wave and blast damage, reduces equipment failure rate in harsh environments, cuts maintenance and replacement costs, and greatly improves electronic equipment safety and durability.

Step-by-Step Usage Process

1. Pre-stirring: Fully stir component A evenly to disperse settled fillers completely and shake component B thoroughly before mixing.
2. Proportional mixing: Strictly follow standard AB component weight ratio to guarantee stable shock dampening performance after curing.
3. Vacuum defoaming: Place mixed uniform glue in a 0.01MPa vacuum container for 3-minute defoaming to ensure dense and resilient cured structure.
4. Curing treatment: Supports room temperature or heating curing; full curing takes 24 hours, affected by ambient temperature and humidity.

Certifications & Compliance

This product complies with ISO9001, CE and ROHS international standards, meeting industrial explosion-proof electronic packaging and global export specifications.

Customization Options

Customized services are available. Shock absorption strength, hardness, viscosity and operating time can be adjusted for exclusive harsh environment protection solutions.

Production & Quality Control

We adopt standardized production and strict shock resistance testing. Pre-production formula verification and pre-shipment full inspection ensure stable blast mitigation and impulse absorbing performance for every batch.

FAQ

Q1: What is the core advantage of shock wave dampening potting silicone?
A: It absorbs shock waves and impulse energy, providing professional blast mitigation encapsulation
and explosive environment protection that ordinary potting glue cannot achieve.
Q2: Will colloid stratification affect shock absorption performance?
A: No. Slight storage stratification is normal, and even stirring will not weaken its resilience and shock
dampening capacity.
Q3: How to preserve mixed Potting Compound?
A: Seal raw materials and store in dry environments. Mixed AB silicone should be used up at one time
to avoid performance attenuation.
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