HONG YE SILICONE’s Semi-Conductive Electronic Potting Compound is a dedicated static dissipative encapsulation grade silicone designed for electrostatic-sensitive electronic components. This exclusive Semi-Conductive Electronic Potting Compound realizes stable charge bleed off protection to prevent static accumulation and sudden electrostatic damage. Balanced between insulation and semi-conductivity, this material also delivers waterproof, shockproof and thermal management capabilities to secure core circuits in high-precision electronic devices.
Product Overview
Available in addition curing and condensation curing formulas, our functional Electronic potting compound is widely used for encapsulation, sealing and structural filling of various electronic modules. It features excellent adhesion and thermal stability for PCB, PC, PMMA, CPU and multiple substrates including aluminum, copper and stainless steel. It operates steadily across -60℃ to 220℃, absorbing thermal cycling stress while providing basic anti-corrosion, dust-proof and ozone-resistant properties for electronic assemblies.
Technical Specifications
Formulated with professional conductive fillers, this material supports standardized static dissipative encapsulation grade performance with controllable surface resistivity. The cured silicone features low volatile content and outstanding chemical resistance. Apart from electrostatic protection, it retains superior thermal dissipation performance same as our classic Thermally Conductive Potting Compound. Hardness, viscosity and working time can be fully customized to match diverse industrial encapsulation requirements.
Product Features & Advantages
Different from fully insulating or over-conductive potting silicone, our product possesses irreplaceable technical strengths:
1. Anti-static Protection: Supports professional anti static module potting, releasing redundant static charges gradually without short-circuit risks.
2. Balanced Semi-conductivity: Achieves precise charge bleed off protection, solving static buildup issues for electrostatic sensitive electronics.
3. All-round Environmental Resistance: Integrates waterproof, insulation, anti-aging and wide-temperature resistance to adapt to complex working environments.
4. Strong Substrate Adhesion: Bonds tightly with metal and plastic materials to avoid delamination during long-term daily operation.
Application Scenarios
As a multi-functional Electronic Encapsulation Adhesive, this semi-conductive silicone is ideal for semiconductor units, cleanroom electronics, precision sensors and vulnerable automotive electronic parts. It effectively lowers product defective rate caused by static discharge, reduces maintenance costs and improves finished product stability for global electronic manufacturers. Step-by-Step Usage Process
1. Pre-stirring: Thoroughly stir component A to homogenize settled fillers and fully shake component B before mixing.
2. Proportional Mixing: Strictly follow official AB component weight ratio to maintain stable semi-conductive performance after curing.
3. Vacuum Defoaming: Place mixed glue in a 0.01MPa vacuum container for 3 minutes to remove bubbles for flawless encapsulation.
4. Curing Treatment: Adopt room-temperature or heating curing; full curing takes around 24 hours, affected by ambient temperature and humidity for our versatile Silicone Encapsulant. Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality system, CE and RoHS certifications. This semi-conductive potting material meets international cross-border export standards and industrial electronic packaging regulations.
Customization Options
We provide one-stop customization services. Clients can adjust resistivity range, cured hardness, viscosity and pot life to create exclusive anti-static encapsulation solutions.
Production Process
We implement dust-free standardized production and multi-dimensional quality tests. Every batch undergoes static resistance testing and thermal cycling inspection to ensure consistent anti-static and protective performance for worldwide buyers.
FAQ
Q1: What is the core function of this semi-conductive potting compound?
A: It provides anti static module potting and charge bleed off protection, eliminating static
accumulation to protect sensitive electronic components.
Q2: Will raw glue stratification impact static dissipative performance?
A: Stratification is normal during storage. Even stirring before use will not change its static
dissipative encapsulation grade characteristics.
Q3: Can leftover mixed glue be stored for later use?
A: Mixed two-part compound cannot be stored long-term. Please finish usage in one batch
to prevent performance degradation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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