HONG YE SILICONE’s High Resilience Electronic Potting Compound is a flexible silicone encapsulation material designed for vibration-prone electronic devices. Featuring excellent elastic recovery encapsulation material properties, this potting silicone delivers reliable compression set resistance protection. It can instantly absorb external pressure and shock with stable bounce back module potting performance, protecting fragile chips and bonding wires while offering waterproof, insulation and wide-temperature environmental adaptability.
Product Overview
Available in addition curing and condensation curing formulas, this flexible Electronic Potting Compound is widely used for electronic encapsulation, sealing and gap filling. It exhibits outstanding adhesion and thermal stability on mainstream substrates including PCB, PC, PMMA, CPU, aluminum, copper and stainless steel. Operating steadily within -60℃~220℃, this silicone offsets thermal expansion stress and prevents component damage caused by long-term repeated extrusion and vibration. Technical Specifications
Formulated with high-elastic polymer additives, this material features ultra-high resilience and low permanent deformation after repeated squeezing. It adopts specialized bounce back module potting structure to maintain original shape after heavy impact. Besides flexible shock absorption, it provides excellent thermal dissipation same as our mature Thermally Conductive Potting Compound. Resilience grade, viscosity and curing time can be customized for unique working environments.
Product Features & Advantages
Different from rigid or low-elasticity potting adhesives, our high-resilience silicone has irreplaceable core strengths:
1. Superior Elastic Recovery: Acts as premium elastic recovery encapsulation material, recovering rapidly after compression and vibration without permanent deformation.
2. Long-term Fatigue Resistance: Provides professional compression set resistance protection, suitable for devices under continuous vibration and cyclic pressure.
3. Multi-functional Protection: Integrates dustproof, waterproof, anti-corrosion and insulating properties to adapt to complex outdoor and industrial working conditions.
4. Strong Substrate Compatibility: Bonds tightly with multiple metals and plastic materials to prevent delamination during frequent mechanical movement.
Application Scenarios
As a high-performance Electronic Encapsulation Adhesive, this product is ideal for automotive vibration components, wearable electronics, portable detection equipment and aerospace sensitive modules. Its stable elastic buffering performance effectively reduces component failure caused by vibration fatigue, cuts maintenance costs and extends overall service life of finished electronic products. Step-by-Step Usage Process
1. Pre-stirring: Thoroughly stir Part A to redistribute settled fillers and shake Part B evenly before mixing.
2. Proportional Mixing: Follow official AB weight ratio strictly to ensure intact elasticity and compression resistance after curing.
3. Vacuum Defoaming: Place blended glue inside a 0.01MPa vacuum container for 3 minutes to eliminate bubbles before encapsulation.
4. Curing Treatment: Support room-temperature or heating curing; full curing takes around 24 hours, consistent with our standard Silicone Encapsulant series. Certifications and Compliance
All HONG YE SILICONE products comply with ISO9001 quality management system, CE and RoHS certifications. This high-resilience potting compound meets global cross-border export rules and industrial electronic packaging standards.
Customization Options
We support full personalized customization. Clients can adjust material resilience, cured hardness, viscosity and operating time to obtain exclusive vibration-resistant encapsulation solutions.
Production Process
We adopt dust-free standardized production and multi-stage quality inspection. Every batch undergoes elastic fatigue testing and temperature cycling testing to guarantee stable compression set resistance protection for global industrial purchasers.
FAQ
Q1: What is the biggest advantage of high resilience potting silicone?
A: It offers elastic recovery encapsulation material characteristics and bounce back module potting capability
to resist long-term vibration and repeated compression.
Q2: Will raw glue stratification impact elasticity performance?
A: Stratification is normal during storage. Stir evenly before use, and the compression set resistance protection
and resilience will not be affected.
Q3: Can leftover mixed silicone be reused later?
A: Mixed two-part compound cannot be stored long-term. Please finish potting in one single procedure to avoid
performance degradation.
Shenzhen Hong Ye Jie Technology Co., Ltd
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